Interfacial Reaction and Shear Energy of Sn-52In Solder on Ti/Cu/Au UBM with Variation of Au Thickness and Reflow Temperature (Ti/Cu/Au UBM의 Au 두께와 리플로우 온도에 따른 Sn-52In 솔더와의 계면반응 및 전단 에너지)
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- Journal of the Microelectronics and Packaging Society
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- v.12 no.1 s.34
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- pp.87-93
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- 2005