Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Correlation between the dielectric constant and porosity due to the nano pore in the thin film

나노기공에 의한 박막 내의 기공율과 절연상수의 상관관계

  • Oh, Teresa (School of Electronic and Information Engineering, Cheongju University)
  • Published : 2007.03.25
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Abstract

SiOC films were made using the oxygen and bistrimethylsilylmethane mixed precursor. The chemical properties of SiOC films divided into three properties, organic, hybrid and inorganic depending on the flow rate ratio between oxygen and bistrimethylsilylmethane precursor. The films with organic properties decreased dielectric constant, because of pore incorporation in final materials. In this study, the porosity of SiOC films with organic properties was investigated using the Makwell-Garnett equation. The porosity of the films could be correlated with the blue shift in the infrared spectra scopy, and increased with the decreasing the dielectric constant of the film.

SiOC 박막은 산소와 bistrimethylsilylmethane 전구체를 사용하여 CVD방법을 이용하여 만들었다. 유량비에 따라서 유기물, 하이브리드 그리고 무기물 특성의 3가지 특성으로 분류되어지는데 유기물의 특성을 지니는 박막에서 기공이 생성되었다 기공의 생성은 유전상수가 낮아지는 효과가 있으며, 본 연구에서는 기공이 형성되는 유기물 특성의 SiOC 박막내의 기공율을 Maxwell-Garnett 등식을 이용하여 계산하였다. 박막의 기공율은 IR분포에서 blue shift특성을 가지며, 기공율이 증가할수록 유전상수는 감소하였다.

Keywords

References

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