Transactions of the Korean Society of Mechanical Engineers A (대한기계학회논문집A)

The Korean Society of Mechanical Engineers (대한기계학회)
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Fabrication of Nickel Nano and Microstructures by Redeposition Phenomena in Ion Etching Process

이온식각공정의 재증착 현상을 이용한 니켈 마이크로 나노 구조물 제작

  • 정필구 (부산대학교 기계공학부) ;
  • 황성진 (부산대학교 기계공학부) ;
  • 이상민 (부산대학교 미세기계전자시스템협동과정) ;
  • 고종수 (부산대학교 기계공학부)
  • Published : 2007.01.01
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Abstract

Nickel nano and microstructures are fabricated with simple process. The fabrication process consists of nickel deposition, lithography, nickel ion etching and plasma ashing. Well-aligned nickel nanowalls and nickel self-encapsulated microchannels were fabricated. We found that the ion etching condition as a key fabrication process of nickel nanowalls and self-encapsulated microchannels, i.e., 40 sccm Ar flow, 550 W RF power, 15 mTorr working pressure, and $20^{\circ}C$ water cooled platen without using He backside cooling unit and with using it, respectively. We present the experimental results and discuss the formational conditions and the effect of nickel redeposition on the fabrication of nickel nano and microstructures.

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References

  1. Quake, Stephen R. and Scherer, Axel, 2000, 'From Micro to Nanofabrication with Soft Materials,' Science, Vol. 290, pp. 1536-1540 https://doi.org/10.1126/science.290.5496.1536
  2. Ko Jong Soo, Yoon Hyun C., Yang Haesik, Pyo Hyeon-Bong, Chung Kwang Hyo and Kim Youn Tae, 2003, 'A Polymer-Based Microfluidc Device for Immunosensing Biochips,' Lab Chip., Vol. 3, pp. 106-113 https://doi.org/10.1039/b301794j
  3. Routkevitch Dmitri, Tager, A. A., Haruyama Junji, Almawlawi Diyaa, Moskovits Martin and Xu Jimmy M., 1996, 'Nonlithographic Nano-Wire Arrays: Fabrication, Physics, and Device Applications,' IEEE Trans. Electron Devices, Vol. 43, pp. 1646-1658 https://doi.org/10.1109/16.536810
  4. Yoo Pil Jin, Suh Kahp Y., Park S. Young and Lee Hong H., 2002, 'Physical Self-Assembly of Microstructures by Anisotropic Buckling,' Adv. Mat., Vol. 14, pp. 1383-1387 https://doi.org/10.1002/1521-4095(20021002)14:19<1383::AID-ADMA1383>3.0.CO;2-D
  5. Boehm, J., Shubert, A, Otto T. and Burkhardt, T., 2001, 'Micro-Metalforming with Silicon Dies,' Microsyst. Technol., Vol. 7, pp. 191-195 https://doi.org/10.1007/s005420000084
  6. Joo Byung-Yun, Rhim Sung-Han and Oh Soo-Ik, 2005, 'Micro-Hole Fabrication by Mechanical Punching Process,' J. Mater. Process Technol., Vol. 170, pp. 593-601 https://doi.org/10.1016/j.jmatprotec.2005.06.038
  7. Sen Mohan and Shan, H. S., 2005, 'A Review of Electrochemical Macro- to Micro-hole Drilling Processes,' Int. J. Mach. Tool Manu., Vol. 45, pp. 137-152 https://doi.org/10.1016/j.ijmachtools.2004.08.005
  8. Lehmann, H. W., Krausbauer, L. and Widmer, R. 1977, 'Redeposition-A Serious Problem in rf Sputter Etching of Structures with Micronmeter Dimensions,' J. Vac. Sci. Technol., Vol. 14, pp. 281-284 https://doi.org/10.1116/1.569140
  9. Robinson, R. S. and Rossnagel, S. M., 1982, 'Ion-Beam-Induced Topography and Surface Diffusion,' J. Vac. Sci. Technol., Vol. 21, pp. 790-797 https://doi.org/10.1116/1.571826
  10. Vossen, J. L., 1971, 'ontrol of Film Properties by rf-Sputtering Techniques,' J. Vac. Sci. Technol., Vol. 8, pp. s12-s30 https://doi.org/10.1116/1.1316386