대한기계학회논문집B (Transactions of the Korean Society of Mechanical Engineers B)

  • 제30권7호
  • /
  • Pages.663-670
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  • 2006
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  • 1226-4881(pISSN)
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  • 2288-5324(eISSN)
대한기계학회 (The Korean Society of Mechanical Engineers)
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콜로이드 액적의 증발에 의한 입자 증착에 관한 연구

A Study on Particle Deposition of an Evaporating Colloidal Droplet

  • 위상권 (삼성종합기술원 Micro Systems Lab.) ;
  • 이정용 (삼성종합기술원 Micro Systems Lab.)
  • 발행 : 2006.07.01
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초록

The presented study aims to investigate the colloidal droplet deposition caused by evaporation of the liquid. In the numerical analysis, the evaporation is carried out by using different evaporation function intended to obtain different shape of solute deposition. In the experiment, the colloidal droplets of different solvents are placed on a glass plate and the surface profiles are measured after drying the solvents of the droplets to investigate the effect of the solvent evaporation on the final deposition profile. Comparing the surface profiles obtained under different conditions, the optimum drying conditions of colloidal droplets are, determined to obtain uniform surface profiles. The numerical results showed that ring-shaped deposition of solute was formed at the edge of the droplet due to the coffee stain effect and the height of the ring was reduced at the lower evaporation rate. The experiments showed that the boiling point of a solvent was critical to the surface uniformity of the deposition profile and the mixture of solvents with different boiling points influenced the uniformity as well.

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참고문헌

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