Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지

Packaging Technology in Electronics and 3-dimensional Slacking Packaging

패키징 기술과 3차원 실장

  • 김정모 (서울시립대학교 신소재공학과) ;
  • 정재필 (서울시립대학교 신소재공학과) ;
  • 김숙환 (포항산업과학연구원) ;
  • 박재현 (포항산업과학연구원 신뢰성평가2팀)
  • Published : 2005.04.01
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Abstract

Keywords

References

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