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Packaging Technology in Electronics and 3-dimensional Slacking Packaging  

Kim Jung-Mo (서울시립대학교 신소재공학과)
Jung Jae-Pil (서울시립대학교 신소재공학과)
Kim Sook-Hwan (포항산업과학연구원)
Park Jai-Hyun (포항산업과학연구원 신뢰성평가2팀)
Publication Information
Journal of Welding and Joining / v.23, no.2, 2005 , pp. 23-31 More about this Journal
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