Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Analysis Method of Metallic ion Migration

금속 이온 마이그레이션의 해석적 방법

  • 홍원식 (전자부품연구원 신뢰성평가센터) ;
  • 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단) ;
  • 김광배 (한국항공대학교 항공재료공학과)
  • Published : 2005.04.01
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Abstract

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References

  1. The Institute for Interconnecting and Packaging Electronic Circuit. IPC-TR-476A Electrochemical Migration (1997)
  2. The Institute for Interconnecting and Packaging Electronic Circuit. IPC-TM-650 Test Methods Manual (1973)
  3. M. G. Fontana. Corrosion Engineering. 3rd ed., p.41. M. B. Bever. McGraw-Hill. New York. (1987)
  4. Y. Kin, ESPEC Technology Report. 2. 1 (1996)
  5. H. Tanaka, Y. Aoki and S. Yamamoto, Espec Technology Report, 4, 10 (1997)
  6. T. Ohtori, J. of Jpn. Inst. Interconnecting and Packaging Electronic Circuits. 10(2). 80 (1995) https://doi.org/10.5104/jiep1995.10.80
  7. Y. Aoki, H. Tanaka, S. Yamamoto and O. Obata, Espec Technology Report, 1, 16 (1996)
  8. S. J. Krumbein. IEEE Trans. Relr. 44. 539 (1995) https://doi.org/10.1109/24.475971
  9. H. Tanaka, H. Hiramatsu, K. Kumekkawa, F. Ueta, S. Yoshihara and T. Shirakashi, J. of Jpn. Inst. Electronics Packaging. 5(2). 188 (2002) https://doi.org/10.5104/jiep.5.188