마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제12권1호
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- Pages.87-93
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Ti/Cu/Au UBM의 Au 두께와 리플로우 온도에 따른 Sn-52In 솔더와의 계면반응 및 전단 에너지
Interfacial Reaction and Shear Energy of Sn-52In Solder on Ti/Cu/Au UBM with Variation of Au Thickness and Reflow Temperature
- Choi Jae-Hoon (Department of Materials Science and Engineering, Hongik University) ;
- Jun Sung-Woo (Department of Materials Science and Engineering, Hongik University) ;
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Oh Tae-Sung
(Department of Materials Science and Engineering, Hongik University)
- 발행 : 2005.03.01
초록
Au 층의 두께를
Interfacial reactions between 48Sn-52In solder and