Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Study on Two Step Plasma Treatment for Electroless Cu Plating of Fluoropolymer

불소수지의 무전해 동도금을 위한 단계적 플라즈마 전처리법에 관한 연구

  • Shin, Seung-Han (Surface Nano-technology Team, Korea Institute of Industrial Technology(KITECH)) ;
  • Han, Sung-Ho (Surface Nano-technology Team, Korea Institute of Industrial Technology(KITECH)) ;
  • Kim, Young-Seok (Surface Nano-technology Team, Korea Institute of Industrial Technology(KITECH))
  • 신승한 (한국생산기술연구원 나노표면기술팀) ;
  • 한성호 (한국생산기술연구원 나노표면기술팀) ;
  • 김영석 (한국생산기술연구원 나노표면기술팀)
  • Published : 2005.06.01
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Abstract

Low temperature plasma treatment with different gases and rf powers were performed to improve the adhesion strength between polytetrafluoroethylene(PTFE) and electroless deposited copper. According to the research, $H_2$ plasma having hydrogen radical was more effective in surface polarity modification than $O_2$ plasma due to the defluorination reaction. However, surface roughness of PTFE was more increased with $O_2$ than $H_2$ plasma. PTFE treated with $120W-O_2$ plasma and $250w-H_2$ plasma, consecutively showed rougher surface than single step $250w-H_2$ plasma treated one and more hydrophilic than single step $120W-O_2$ plasma treated one. And it showed 5B tape test grade, which is better adhesion property than 1B or 3B obtained by single step plasma treatment. In addition, adhesion strength between PTFE and Cu deposit is also deeply affected by residual water on its interface.

Keywords

References

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