Journal of Welding and Joining

  • 제20권4호
  • /
  • Pages.498-504
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  • 2002
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  • 2466-2232(pISSN)
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  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지

Sn-Pb 공정솔더 플립칩의 접합강도에 미치는 플라즈마 처리 효과

Effect of Plasma Treatment on the Bond Strength of Sn-Pb Eutectic Solder Flip Chip

  • 홍순민 ((주)삼성전자 메카트로닉스센터 지능시스템연구소 마이크로접합 Lab) ;
  • 강춘식 (서울대학교 재료공학부) ;
  • 정재필 (서울시립대학교 재료공학과)
  • 발행 : 2002.08.01
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초록

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

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참고문헌

  1. Fundamentals of Microsystems Packaging R.R. Tummala
  2. J. Elec. Mater. v.30 no.3 Fluxless Wetting Properties of One side-Coated Under Bump Metallurgy and Top Surface Metallurgy S.M. Hong;J.Y. Park;J.P. Jung;C.S. Kang
  3. Mater. Trans. v.42 no.7 Fluxless Wetting Properties of Top Surface Metallurgy in Different Pb-free Solders S.M. Hong;J.Y. Park;J.P. Jung;C.S. Kang https://doi.org/10.2320/matertrans.42.1423
  4. IEEE Transactions on CPMT v.21 The Effects of Flux Materials on the Moisture Sensitivity and Reliability of Flip-Chip-on-Board Assemblies C. Beddingfield;L.M. Higgins
  5. Pro. 5th Int. Joint Symp. on Microelec. and Packaging M. Bixenaman;E. Miller
  6. 2001 IEEE-ETCT Conference Proceeding Plasma Treatment Process for Fluxless Reflow Soldering K.J. Wolter;Th. Zerna;R. Deltschew;H. Neumann
  7. 1993 IEEE-ECTC Conference Proceeding Fluxless Soldering in Air and Nitrogen N. Koopman;S. Bobbio;S. Nangalia;J. Bousaba;B. Piekarski
  8. Proceeding of 2001 Intl Symposium on Advanced Packaging Materials Fluxless Bump Reflow Using Carboxylic Acid H. Matsuki;H. Matsui;E. Watanabe
  9. 1999 IEEE-ECTC Conference Proceeding Flux Free Flip Chip Attach Technology for BGA/CSP Packages F. Masahiko;M. Tsugunori;D. Kazuhide;N. Hiroshi
  10. Mater. Trans. v.42 no.7 A Study on the Fluxless Soldering of Si-wafer/Glass Substrate Using Sn-3.5mass%Ag and Sn-37mass%Pb Solder C.B. Park;S.M. Hong;J.P. Jung;C.S. Kang;Y.E. Shin
  11. The Mechanics of Solder Alloy Wetting and Spreading Oxidation of Solder Coating D.M. Tench;F.G. Yost(ed.);F.M. Hosking(ed.);D.R. Frear(ed.)
  12. The Mechanics of Solder Alloy Wetting and Spreading Fluxes and Flux Action C.A. Mackay;F.G. Yost(ed.);F.M. Hosking(ed.);D.R. Frear(ed.)
  13. Mater. Trans. v.42 no.3 Fluxless Wetting Properties of the UBM-coated Si-wafer to Pb-free Solders under Different Atmosphere S.M. Hong;J.Y. Park;J.P. Jung;C.S. Kang https://doi.org/10.2320/matertrans.42.520