The Transactions of the Korean Institute of Electrical Engineers C (대한전기학회논문지:전기물성ㆍ응용부문C)

The Korean Institute of Electrical Engineers (대한전기학회)
권호 표지

PDP Tubeless Packaging Process Using Glass-to-Glass Vacuum-Electrostatic Bonding

유리-유리 진공-정전 열 접합을 이용한 PDP의 Tubeless 패키징 공정

  • 주병권 (KIST정보재료소자센터 연구원) ;
  • 이덕중 (KIST정보재료소자센터 연구원)
  • Published : 2001.01.01
Download PDF
⟨ Previous Next ⟩

Abstract

New package process for PDP was proposed based on the glass-to-glass vacuum-electrostatic bonding process and tubeless packaging concept derived from the previous study. Hermeticity and operating performance of PDP test panel through the seal-off process application and the possibility for practical use might be high if the process simplicity and productivity-related effort was sequentially carried out.

Keywords

References

  1. S. J. Jung, G. J. Moon, K. S. Kim, M. S. Kim, K. J. Woo, N. Y. Lee and S. Ahn, : Asia Display 98 Digest, p.1157 (1998)
  2. A. Roth : Vacuum Sealing Technique, (AIP Press, New York), p.228 (1994)
  3. 주병권, 이덕중, 이윤희, 오명환, Tubeless Packaging된 Field Emission Display의 개발, 전기학회논문지, 제48C권, 4호, pp.275-280 (1999.4)
  4. 주병권, 이덕중, 최우범, 김영조, 이남양, 오명환, 비정질 실리콘 박막을 이용한 Sodalime-Sodalime 정전 열 접합 및 FEA Packaging 응용, 전기학회논문지, 제48C권, 9호, pp.656-661 (1999.9)
  5. 주병권, 이덕중, FED Tubeless Packaging의 기술적 개선, 전기전자재료학회논문지, 제12권, 12호,pp.1097-1101 (1999.12)
  6. D.J. Lee, N.Y. Lee, J. Jang and B.K. Ju, Application of Electrostatic Bonding to FED Vacuum Packaging, J. Electro. Chem. Soc., vol.147 (6), pp.2385-2388 (2000.6) https://doi.org/10.1149/1.1393541
  7. 주병권, 평판 디스플레이의 새로운 진공 패키징 기술 동향, 전자진흥(한국전자산업진흥회), pp.61-65 (2000.3)
  8. M. Kamiya, H. Uchiike, T. Sasaki, Y. Kawai : Asia Display95 Digest, p.385 (1995)
  9. D.J. Lee, B.K.Ju, J.W.Jeoung, J. Jang and M.H.Oh, Thin PDP packaging by glass-bonding technology and Its driving properties, IDW 00 proceeding, pp.779-782 (2000.12)