A Study on the Strain Analysis of Cracked Plate by Electronic Speckle Pattern Interferometry

전자처리 Speckle Pattern 간섭법에 의한 균열평판의 Strain 해석에 관한 연구

Electronic Speckle Pattern Interferometry (ESPI) with a CW laser, a video system and an image processor was utilized to measure the in-plane displacement. Unlike traditional strain gauges or Moire method. ESPI method measure the in-plane displacement on real time with out any surface preparation on surface attachment. The specimen has a crack of 10*0.1 mm in the middle of plate and strain gauge was also attached on that surface to compare with ESPI method. This study reveled the ESPI method to measure the displacement and distribution of strain in the specimen. It was shown in tensile tests that the measurement by ESPI method was comparable with strain gauge.