• Title/Summary/Keyword: Electronic Speckle Pattern Interfermetry

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Surface contouring using Electronic Speckle Pattern Interferometry (전자 스페클 패턴 간섭계를 이용한 형상 측정)

  • 김계성;유원재;강영준
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.397-401
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    • 1995
  • ESPI(Electronic Speckle Pattern Interfermetry) is an optical technique to measure surface deforamtion of engineering components and materials in industrial ares. This optical method is capable of providing full-field results with high spatial resolution, high speed and is the non-contact technique. One of important application aspects using electronic speckle pattern interferometry is to generate contours of a diffuse object in order to provide data for 3-D shape analysis and topography measurement. The contouring method by modified dual-beam speckle pattern interferometry is proposed. We introduce a shift of the illumination beams through optical fiber in order to obtain the contour fringe patterns. The speckle pattern correlation technique is suitable for providing measurement range from millimeters to several centimeters. The complete geometric analysis of the contoretical and experimental results are obtained.

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A Study on the Strain Analysis of Cracked Plate by Electronic Speckle Pattern Interferometry (전자처리 Speckle Pattern 간섭법에 의한 균열평판의 Strain 해석에 관한 연구)

  • 김경석;양승필
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.6
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    • pp.1382-1390
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    • 1995
  • Electronic Speckle Pattern Interferometry (ESPI) with a CW laser, a video system and an image processor was utilized to measure the in-plane displacement. Unlike traditional strain gauges or Moire method. ESPI method measure the in-plane displacement on real time with out any surface preparation on surface attachment. The specimen has a crack of 10*0.1 mm in the middle of plate and strain gauge was also attached on that surface to compare with ESPI method. This study reveled the ESPI method to measure the displacement and distribution of strain in the specimen. It was shown in tensile tests that the measurement by ESPI method was comparable with strain gauge.

A study on the measurement of two-dimensional in-plane displacements of the plate with a circular hole by ESPI method (ESPI에 의한 원공판의 2차원 면내변위 측정에 관한 연구)

  • Kim, Kyoung Suk;Choi, Hyoung Chol;Yang, Seung Pil;Kim, Hyoung Soo;Hong, M.S.;Jung, W.K.
    • Journal of the Korean Society for Precision Engineering
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    • v.11 no.5
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    • pp.161-170
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    • 1994
  • This paper presents the performance and problems in analysis method and testing system of Electronic Speckle Pattern Interfermetry(ESPI) method, in measuring two-dimensional in- plane displacement. The analysis result of measurement by ESPI is quite comparable to that of measurement by strain gauge method. This implieds that the method of ESPI is a very effective tool in non-contact two-dimensional in-plane strain analysis. But there is a controversial point, measurement error. This error is discussed to be affected not by ESPI method itself, but by its analysis scheme of the interference fringe, where the first-order interpolation has been applied to the points of strain measured. Further development of advanced first-order interpolation method is being undertaken for the more precise in-plane strain measurement.

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