Acknowledgement
This work was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (No. 2020R1I1A3A04038083) The authors are thankful to IDEC for EDA tool support.
Proceedings of the Korean Institute of Information and Commucation Sciences Conference (한국정보통신학회:학술대회논문집)
- 2021.05a
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- Pages.63-65
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- 2021
EC-DSA Implementation using Security SoC with built-in ECC Core
ECC 코어가 내장된 보안 SoC를 이용한 EC-DSA 구현
- Yang, Hyeon-Jun (Kumoh National Institute of Technology) ;
- Shin, Kyung-Wook (Kumoh National Institute of Technology)
- Published : 2021.05.03
Abstract
This paper describes an integrated H/W-S/W implementation of elliptic curve digital signature algorithm (EC-DSA) using a security system-on-chip (SoC). The security SoC uses the Cortex-A53 APU as CPU, and the hardware IPs of high-performance elliptic curve cryptography (HP-ECC) core and SHA3 (secure hash algorithm 3) hash function core are interfaced via AXI4-Lite bus protocol. The signature generation and verification processes of EC-DSA were verified by the implementation of the security SoC on a Zynq UltraScale+ MPSoC device.
보안 SoC (system-on-chip)를 이용한 타원곡선 디지털 서명 알고리듬 (elliptic curve digital signature algorithm; EC-DSA)의 H/W-S/W 통합 구현에 대해 기술한다. 보안 SoC는 Cortex-A53 APU를 CPU로 사용하며, 하드웨어 IP로 설계된 고성능 타원곡선 암호 (high-performance ellipitc curve cryptography; HP-ECC) 코어와 SHA3 (secure hash algorithm 3) 해시 함수 코어가 AXI4-Lite 버스 프로토콜로 연결된다. 고성능 ECC 코어는 12가지의 타원곡선을 지원하며, SHA3 코어는 4가지의 해시 함수를 지원한다. 보안 SoC를 Zynq UltraScale+ MPSoC 디바이스에 구현하여 EC-DSA에 의해 생성된 서명의 유효성을 검증하였다.