한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2005년도 춘계학술대회 논문집
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- Pages.1-5
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- 2005
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- 2005-8446(pISSN)
실리콘 웨이퍼의 고정밀 단면 연삭에 관한 연구
A Study on Precision Infeed Grinding for the Silicon Wafer
- Ahn D.K. (Hankook Machine Tools. Co. Ltd.) ;
- Hwang J.Y. (Hankook Machine Tools. Co. Ltd.) ;
- Choi S.J. (Hankook Machine Tools. Co. Ltd.) ;
- Kwak C.Y. (Hankook Machine Tools. Co. Ltd.) ;
- Ha S.B. (Hankook Machine Tools. Co. Ltd.)
- 발행 : 2005.06.01
초록
The grinding process is replacing lapping and etching process because significant cost savings and performance improvemnets is possible. This paper presents the experimental results of wafer grinding. A three-variable two-level full factorial design was employed to reveal the main effects as well as the interaction effects of three process parameters such as wheel rotational speed, chuck table rotational speed and feed rate on TTV and STIR of wafers. The chuck table rotaional speed was a significant factor and the interaction effects was significant. The ground wafer shape was affected by surface shape of chuck table.
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