Scanning Acoustic Tomograph 방식을 이용한 지능형 반도체 평가 알고리즘

The Intelligence Algorithm of Semiconductor Package Evaluation by using Scanning Acoustic Tomograph

In this study, researchers developed the estimative algorithm for artificial defects in semiconductor packages and performed it by pattern recognition technology. For this purpose, the estimative algorithm was included that researchers made software with MATLAB. The software consists of some procedures including ultrasonic image acquisition, equalization filtering, Self-Organizing Map and Backpropagation Neural Network. Self-Organizing Map and Backpropagation Neural Network are belong to methods of Neural Networks. And the pattern recognition technology has applied to classify three kinds of detective patterns in semiconductor packages: Crack, Delamination and Normal. According to the results, we were confirmed that estimative algorithm was provided the recognition rates of $75.7\%$ (for Crack) and $83_4\%$ (for Delamination) and $87.2\%$ (for Normal).