한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 2004년도 추계학술대회 논문집
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- Pages.622-625
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- 2004
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- 2005-8446(pISSN)
마찰력 측정을 통한 CMP 공정의 모니터링
CMP Process Monitoring through Friction Force Measurement
초록
The CMP monitoring system was newly developed by the aid of friction force measurement, resulting from installation of piezoelectric quartz sensor on R&D polisher. The correlation between friction and CMP results was investigated in terms of tribological aspects by using the monitoring system. Various friction signals were monitored and analyzed by the change of experimental conditions such as pressure, velocity, pad and slurry. First of all, the lubrication regimes were classified with Sommerfeld Number through measuring coefficient of friction in ILD CMP. And then, the removal mechanism of abrasives could be understood through the correlation with removal rate and coefficient of friction. Especially, the amount of material removal per unit sliding distance is directly proportional to the friction force. The uniformity of CMP performances was also deteriorated as coefficient of friction increased.
키워드