한국마이크로전자및패키징학회:학술대회논문집 (Proceedings of the International Microelectronics And Packaging Society Conference)
- 한국마이크로전자및패키징학회 2003년도 International Symposium
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- Pages.175-190
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- 2003
The trend of packaging technology in Japan
- Hara, Kazumi (Seiko Epson corporation Production engineering and Development Department)
- 발행 : 2003.09.01