Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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- Pages.30-33
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- 2001
Improvement of Defect Density by Slurry Fitter Installation in the CMP Process
CMP 공정에서 슬러리 필터설치에 따른 결함 밀도 개선
초록
Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding
키워드
- Chemical Mechanical Polishing/Planrization (CMP);
- Inter-Level Dielectrics (ILD);
- Inter-Metal Dielectric (IMD);
- Point of Use (POU);
- slurry filter;
- microscratch