• Journal of the Korean Geotechnical Society
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• v.18 no.4
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• pp.249-256
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• 2002

The stability of slurry trench system is closely associated with the characteristics of the filter cake (assumed impervious membrane) transferring the hydrostatic force of slurry to the trench walls. The effectiveness of this assumption in a wide range of trench systems has been examined with the aid of a Finite Element program. Build up of excess porewater pressure in the soil mass behind the filter cake is a function of the slurry density, the properties of filter cake, the ground conditions, time, the geometry of trench and the original ground water level. These factors were all investigated by the Finite Element Method. The most significant factors were found to be the ground conditions and the properties of filter cake.

• Geomechanics and Engineering
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• v.34 no.2
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• pp.125-138
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• 2023

To improve the understanding of infiltration characteristic of modified slurry and the support efficiency of filter cake in silty sand strata, the slurry infiltration (SI) and filter cake formation (FCF) were investigated in a laboratory apparatus. The water discharge and the excess pore pressure at different depths of silty sand strata were measured during SI. The relationship between permeability coefficient/thickness ratio of filter cake (k_c/ΔL) and effective slurry pressure conversion rate of filter cake (η) were analyzed. Moreover, the SI and FCF process as well as the modification mechanism of CMC (carboxymethyl cellulose) were clarified. The experimental results indicate the formation of only external filter cake in the silty sand strata. The slurry particles obtain thicker water membrane after being modified by CMC, which blocks partial water path in filter cake and decreases the water discharge significantly. The silty sand excavated from tunnel face also contributes to the water discharge reduction. The k_c of the external filter cake ranges from 3.83×10^-8 cm/s to 7.44×10^-8 cm/s. The η of the external filter cake is over 96%, which decreases with increasing k_c/ΔL. A silty sand content within 10% is suggested during construction to ensure the uniformity of the filter cake.

• Particle and aerosol research
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• v.12 no.4
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• pp.145-150
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• 2016

During the chemical mechanical planarization (CMP) process, slurry that comprises abrasive particles can directly affect the CMP performance and quality. Mainly, the large particles in the slurry can generate the defects on the wafer. Thus, many kinds of filters have been used in the CMP process to remove unwanted over-sized particles. Among these filters, the point-of-use (POU) filter is used just before the slurry is supplied onto the CMP pad. In the CMP research field, analysis of the POU filter has been relatively exceptional, and previous studies have not focused on the standardized filtration efficiency (FE) or filter performance. Furthermore, conventional evaluation methods of filter performance are not appropriate for POU filters, as the POU filter is not a membrane type, but is instead a depth type roll filter. In order to accurately evaluate the POU filter, slurry FE according to particle size was measured in this study. Additionally, a CMP experiment was conducted with filtered slurry to demonstrate the effects of filtered slurry on CMP performance. Depending on the flow rate and the filter retention size, the FE according to particle size was different. When the small and large particles have different FEs, the total filtration efficiency (TFE) can still have a similar value. For this reason, there is a need to measure the FE with respect to the particle size to verify the effects of the POU filter on the CMP process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.557-561
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• 2001

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integraded circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-level dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding 1㎛ in size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particles agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectrics(IMD)-CMP process. The filter installation in CMP polisher could reduce defects after IMD-CMP process. As a result of micro-scratch formation, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. We have concluded that slurry filter lifetime is fixed by the degree of generating defects.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.707-713
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was requirdfo the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gest thinner, micro-scratches are becoming as major defects. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}{\textrm}{m}$ point of use (POU) filter, which is depth-type filter and has 80% filtering efficiency for the 1.0${\mu}{\textrm}{m}$ size particle. In this paper, we studied the relationship between defect generation and polished wafer counts to understand the exact efficiency fo the slurry filteration, and to find out the appropriate pad usage. Our experimental results showed that it sis impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the slurry flow rate, and to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of depth type filter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05b
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• pp.34-37
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the inter-metal dielectrics (IMD) layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}m$ POU (point of use) filter, which is depth-type filter and has 80% filtering efficiency for the $1.0{\mu}m$ size particle. In this paper, we studied the relationship between defect generation and pad count to understand the exact efficiency of the slurry filtration, and to find out the appropriate pad usage. Our preliminary results showed that it is impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the flow rate of slurry to overcome depth type filters weak-point, and to install the high spray of de-ionized Water (DIW) with high pressure.

• Journal of the Korean Geotechnical Society
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• v.18 no.4
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• pp.239-248
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• 2002

Bentonite slurries in a slurry wall construction must fulfill a stabilizing function by forming impermeable membrane (surface cake and penetrated cake) on the excavated soil faces. Thus problems are occurring in practice for the construction of diaphram walls and cut-off walls with a low permeability for wastes disposal areas in some deep excavations or different grounds. In this paper, the fundamental mechanics of fluid loss and filter cake formation in various soil beds are investigated using large scale laboratory apparatus. The sealing efficiency of filter cake from the large scale tests and the significance of fluid loss in a slurry trench are utilized for practical situation as a recommended design procedure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.185-188
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• 2001

Chemical mechanical polishing(CMP) process is widely used for global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP Process, deionized water (DIW) pressure, purified $N_2$ (P$N_2$) gas, slurry filter and high spray bar were installed. Our experimental results show that DIW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter. Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• Journal of Animal Environmental Science
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• v.16 no.3
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• pp.215-226
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• 2010

The pig slurry leachate was dark brown-colored solution that leaches out of woodchip trickling filter. The purpose of this research was to investigate the effect of pig slurry leachate and byproduct on growth characteristics of leaf lettuce in hydroponics culture. The effects of addition of fish meal, bone meal and crab shell for the growth of leaf lettuce were investigated. Leaf lettuce were grown in each of six combination treatment solutions; slurry leachate, slurry leachate + fish meal, slurry leachate+bone meal, slurry leachate + crab shell and chemical hydroponic solution for lettuce based on EC content. The chemical nutrient solution was the solution of National Horticulture Research Station for the growth of lettuce. The all of nutrient solution was adjusted 1.5 mS/cm in EC in hydroponics culture. 1. The pH level of leachate of trickling filter was increased and EC decreased gradually during treatment. Pig slurry leachate was low in suspended solids (SS), phosphorus (P), but rich in potassium (K). 2. The plot of slurry leachate (SL) was lowest in the growth characteristics of lettuce. The leaf length and width of lettuce treated with mixture plot of slurry leachate and fish meal (SL + FM) was higher compared with plot in slurry leachate. The chlorophyll reading was reduced in plot treated with slurry leachate, but that in plot of SL+FM was similar compared with control plot. 3. The fresh weight of lettuce showed lowest in the plot treated with slurry leachate. The addition of fish meal increased the yield of comparing plot of slurry leachate, but plots of bone meal and crab shell addition were not significantly difference. The fresh weight of leaf lettuce in plot of SL+FM was 87% as 400.0g compared with control. In conclusion, the mixture solution of pig slurry leachate and fish meal could be used as a nutrition solution of organic lettuce hydroponics.

• Journal of the Semiconductor & Display Technology
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• v.3 no.4
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• pp.45-49
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• 2004

We examined large particles and filter size effects of Central Chemical Supplying (CCS) system for STI-CMP on Light Point Defects (LPDs) after polishing. As manufacturing process recently gets thinner below 0.1 um line width, it is very important to keep down post-CMP micro-scratch and LPDs in case of STI-CMP. Therefore, we must control the size distribution of large particles in a slurry. With optimization of final filter size, CCS system is one of the solutions for this issue. The oxide and nitride CMP tests were accomplished using nano-ceria slurries made by ourselves. The number of large particles in a slurry and the number of LPDs on the wafer surface after CMP were reduced with decrease of the final filter size. Oxide removal rates slightly changed according to the final filter size, showing the good performance of self-made nano ceria slurries.