• Journal of the Korean Applied Science and Technology
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• v.3 no.1
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• pp.65-71
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• 1986

Four amphoteric surfactants, 1-(N-alkyl-N,N-dimethyl ammonio)-4-naphthalene sulfonates, were prepared by the alkylation of 1-(N,N-dimethylamino)-4,naphthalene sulfonic acid with chloroalkanes such as 1-decylchloride, 1-tetradecyl chloride and 1-hexadecyl chloride. These quaternary ammonium compounds such as 1-(N-decyl-N, N-dimethylammonio)-4-naphthalene sulfonate, 1-(N-dodecyl-N,N-dimethylammonio)-4-naphthalene sulfonate, 1-(N-tetradecyl-N,N-dimethylammonio)-4-naphthalene sulfonate and 1-(N-hexadecyl-N,N-dimethylammonio)-4-naphthalene sulfonate could be separated by means of thin layes chromatography and column chromatography. The surface chemical properties such as surface tension, foaming power, foam stability, wetting efficiency and solubilizing effect for these four compounds were measured. Also critical micelle concentration and hydrophilic-lipophilic balance(HLB) were evaluated. These compounds showed good surface as O/W type emulsifying agent and detergent.

• International Journal of Highway Engineering
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• v.8 no.2 s.28
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• pp.13-22
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• 2006

Surface fog coating methods to porous pavements with a polymer, that contains MMA as a main ingredient, are being widely used in Japan and called 'Top-Coat Processes'. They have lots of effects such as to prevention of the pavement void choking, improvement of the water permeability of the pavements and so on. The purpose of this research is to show the characterization of the polymer to optimize the functions of the polymer fog-coat methods. This study focused on the difference of 'wetting' by water among polymers used for the fog coatings, and calculation the surface free energy from the water contact angle on each material. At the end, the water permeability test were conducted using porous asphalt mixtures that were coated with several kinds of polymers. The permeability was also measured on the specimens that were forcibly choked by muddy water and the resistance to choking was compared. It is concluded that the reduction of the surface free energy between water and a polymer improves the life of the permeability functions of porous pavements. Improvement of water permeation capacity and void-blocking controlling effects can be quantitatively evaluated using the interfacial tension ($\gamma$sl) with water for the coating material (high-viscosity asphalt and hardening resin binder). Consequently, the smaller the $\gamma$sl of the coating material the higher the water permeation capacity and void-blocking controlling effects of the porous asphalt pavements.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• Journal of Welding and Joining
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• v.20 no.6
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• pp.783-788
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

• 한국생물공학회:학술대회논문집
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• 2003.04a
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• pp.40-44
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• 2003

Soil-borne infectious disease including Pythium aphanidermatum and Rhizoctonia solani causes severe damage to plants, such as cucumber. This soil-borne infectious disease was not controlled effectively by chemical pesticide. Since these diseases spread through the soil, chemical agents are usually ineffective. Instead, biological control, including antagonistic microbe can be used as a preferred control method. An efficient method was developed to select an antagonistic strain to be used as a biological control agent strain. In this new method, surface tension reduction potential of an isolate was included in the ‘decision factor’ in addition to the other factors, such as growth rate, and pathogen inhibition rate. Considering these 3 decision factors by a statistical method, an isolate from soil was selected and was identified as Bacillus sp. GB16. In the pot test, this strain showed the best performance among the isolated strains. The lowest disease incidence rate and fastest seed growth was observed when Bacillus sp. GB16 was used. Therefore this strain was considered as plant growth promoting rhizobacteria (PGPR). The action of surface tension reducing component was deduced as the enhancement of wetting, spreading, and residing of antagonistic strain in the rhizosphere. This result showed that new selection method was significantly effective in selecting the best antagonistic strain for biological control of soil-borne infectious plant pathogen. The antifungal substances against P. aphanidermatum and R. solani were partially purified from the culture filtrates of Bacillus sp. GB16. In this study, lipopeptide possessing antifungal activity was isolated from Bacillus sp. GB16 cultures by various purification procedures and was identified as a surfactin-like lipopeptide based on the Fourier transform infrared spectroscopy (FT-IR), nuclear magnetic resonance (NMR), high performance liquid chromatography mass spectroscopy (HPLC-MS), and quadrupole time-of-flight (Q-TOF) ESI-MS/MS data. The lipopeptide, named GB16-BS, completely inhibited the growth of Pythium aphanidermatum, Rhizoctonia solani, Penicillium sp., and Botrytis cineria at concentrations of 10 and 50 mg/L, respectively. A novel method to prevent the foaming and to provide oxygen was developed. During the production of surface active agent, such as lipopeptide (surfactin), large amount of foam was produced by aeration. This resulted in the carryover of cells to the outside of the fermentor, which leads to the significant loss of cells. Instead of using cell-toxic antifoaming agents, low amount of hydrogen peroxide was added. Catalase produced by cells converted hydrogen peroxide into oxygen and water. Also addition of corn oil as an oxygen vector as well as antifoaming agent was attempted. In addition, Ca-stearate, a metal soap, was added to enhance the antifoam activity of com oil. These methods could prevent the foaming significantly and maintained high dissolved oxygen in spite of lower aeration and agitation. Using these methods, high cell density, could be achieved with increased lipopeptide productivity. In conclusion to produce an effective biological control agent for soil-borne infectious disease, following strategies were attempted i) effective screening of antagonist by including surface tension as an important decision factor ii) identification of antifungal compound produced from the isolated strain iii) novel oxygenation by $H_2O_2-catalase$ with vegetable oil for antifungal lipopeptide production.

• Fire Science and Engineering
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• v.34 no.2
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• pp.147-155
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• 2020

This paper presents a study on the development of a fire extinguishing agent and extinguishing system for an energy storage system (ESS) fire. The fire extinguishing agent designed to extinguish an ESS fire is a highly permeable fire extinguisher that reduces the surface tension and viscosity while bringing about cooling action. This is the main extinguishing effect of this type of wetting agent, which displays the characteristics of fire extinguishing agents used for penetrating the battery cells inside the ESS module. For the fire extinguishing system, a local application system was designed to suppress fire on a rack-by-rack basis. A 360° rotating nozzle was inserted into the rear hall of the ESS module, and general nozzles were installed in the rack to maximize the fire extinguishing effect. The fire extinguishing agent was strongly discharged by virtue of the gas release pressure. Experiments on fire suppression performance with ESS module 1 unit and module 3 units showed that all visible flames were extinguished in 8 s and 9 s, respectively, by the fire extinguishing agent. In addition, based on confirming reignition for 600 s after the fire extinguishing agent was exhausted, it was confirmed that the ESS fire was completely extinguished without reignition in all fire suppression performance experiments.

• The Journal of Engineering Geology
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• v.27 no.4
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• pp.475-487
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• 2017

We performed landslide flume tests to analyze characteristics of landslide occurrence and change in the ground materials due to rainfall infiltration. The test apparatus is composed of flume, rainfall simulator, and measurement sensors and landslides were triggered by heavy rainfall (Intensity=200 mm/hr) sprinkled at the above of an artificial slope. The measurement sensors for matric suction and volumetric water content were installed with 3 sets at shallow (GL-0.2 m), middle (GL-0.4 m), and deep depth (GL-0.6 m) in the slope and the tests were performed with in-situ, loose, and dense condition of each weathered soils of granite, gneiss, and mudstone. The analyses show that surface erosion was dominant in initial time of the test due to heavy rainfall and then landslides occur following locally happened transverse tension cracks. The characteristics of landslide were both shallow failure because of a spread of wetting front induced by the rainfall infiltration and retrogressive failure. While the matric suction was decreased rapidly without any precursor in the soil saturation, the volumetric water content was increased gradually, reached its maximum value, and then decreased rapidly with landslide.

• Fire Science and Engineering
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• v.29 no.2
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• pp.79-83
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• 2015

The fire accident is a representative type of disaster that can largely impact on business. Therefore, precautionary measures and rapid initial response is very important when a disaster occurs. The storage of porous combustibles is inevitable in coal yard, plywood processing industry, and others that are currently operating. Initial fire fighting of fire and identifying the ignition point in such a porous combustible storage space are so difficult that if the initial response is failed, being led to deep-seated fire, surface fire is likely to result in secondary damage. In addition, deep-seated fire can cause personal injuries and property damage due to a large amount of toxic gases and reignition. Therefore damage reduction measures is required around the storage space to handle a porous flammable. Improving the penetration performance of the concentration of the surfactant is carried out as underlying study, which is about an deep-seated fire extinguishing efficiency augmentation when using wetting agents. The porous materials used in the experiments is radiata pine wood flour, which occupies more than 75% of the domestic wood market. Fire fighting water is selected as Butyl Di Glycol (BDG), which is being used for infiltration extinguishing agent, and the experiment was carried out by producing a standard solution. The experiment was carried out on the basis of the Deep-Seated Fire Test of NFPA 18. The amount of watering, porous material to the internal amount of penetration, and runoff measurement out of the porous material was conducted. According to experimental results, as the surface tension is reduced, the surfactant concentration macroscopic penetration rate decreases, but infiltration to a porous material is shown to have growth characteristics.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.