• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.14-14
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• 2001

Nitride films such as TiN, CrN etc. deposited on glass by PVD processes have been developed for many industrial applications. These nitride films deposited on glass were widely used for not only decorative and optical coatings but also wear and corrosion resistance coatings employed as dies and molds made of glass for the example of lens forming molds. However, the major problem of nitride coatings on glass by PVD process is non-uniform film owing to pin-hole and micro crack. It is estimated that nonuniform coating is influenced by a different surface energy between metal nitrides and glass due to binding states. In this work, therefore, for the evaluation of nucleation and growth mechanism of nitride films on glass TiN and CrN film were synthesized on glass with various nitrogen partial pressure by unbalanced magnetron sputtering. Prior to deposition, for the examination of relationship between surface energy and film microstructure plasma pre-treatment process was carried out with various argon to hydrogen flow rate and substrate bias voltage, duty cycle and frequency by using pulsed DC power supply. Surface energy owing to the different plasma pre-treatment was calculated by the measurement of wetting angle and surface conditions of glass were investigated by X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscope(AFM). The microstructure change of nitride films on glass with increase of film thickness were analyzed by X-Ray Diffraction(XRD) and Scanning Electron Microscopy(SEM).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.412-412
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• 2008

ENIG(Electroless Nickel Immersion Gold)is a surface treatment method that is used most widely at fine pitch's SMT and BGA packaging process. ENIG has good diffusion barrier of Ni against solder and good wettability due to Au finish. But when the discoloration occurred on the Au finish of ENIG, some key characteristics related to the quality and reliability of PCB such as bondability, solderability and electrical flowing of packaging process could be deteriorated. In this paper, we have performed the water dip test ($88^{\circ}C$ purified water) which accelerates the galvanic corrosion of Ni diffused from the Ni-P layer. That is, the excessive oxidation of the Ni layer could result in non-wetting of the solder because the flux may not be able to remove excessive oxides. Though Au discoloration have been reported to be caused by Ni oxides in many literature, it is still open to verify and discuss The microstructures and chemical compositions have been investigated using FE-SEM, TEM, FIB, EDS and XPS. As a result, authors have found that the Au discoloration in ENIG type is severely caused by the oxidation of the Ni and the mechanism of Au discoloration can be confirmed through the experiment result of water dip test.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Geomechanics and Engineering
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• v.23 no.4
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• pp.339-349
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• 2020

This study investigates the feasibility of using the results of the UPV (ultrasonic pulse velocity) test to assess the UCS (unconfined compressive strength) of unsaturated soil. A series of laboratory tests was conducted on samples of unsaturated lateritic soils of northern Taiwan. Specifically, the unconfined compressive test was combined with the pressure plate test to obtain the unconfined compressive strength and its matric suction (s) of the samples. Soil samples were first compacted at the designated water content and subsequently subjected to the wetting process for saturation and the following drying process to its target suction using the apparatus developed by the authors. The correlations among the UCS, s and UPV were studied. The test results show that both the UCS and UPV significantly increased with the matric suction regardless of the initial compaction condition, but neither the UCS nor UPV obviously varied when the matric suction was less than the air-entry value. In addition, the UCS approximately linearly increased with increasing UPV. According to the investigation of the test results, simplified methods to estimate the UCS using the UPV or matric suction were established. Furthermore, an empirical formula of the matric suction calculated from the UPV was proposed. From the comparison between the predicted values and the test results, the MAPE values of UCS were 4.52-9.98% and were less than 10%, and the MAPE value of matric suction was 17.3% and in the range of 10-20%. Thus, the established formulas have good forecasting accuracy and may be applied to the stability analysis of the unsaturated soil slope. However, further study is warranted for validation.

• Journal of Adhesion and Interface
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• v.7 no.2
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• pp.26-31
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• 2006

In order to effectively improve interfacial adhesion strength between polypropylene (PP) and jute fiber, we particularly incorporated maleic anhydride grafted PP (MAPP) into the matrix through the environment-friendly process without an additional method of process and had better mechanical performances by providing the alignment into the natural fiber than those of the conventional fabrication technology such as an extrusion or injection molding. We also proposed hot pressing method which applied relatively low shear to the composites and confirmed the chemical bonds among the functional groups of MAPP and jute using FT-IR approach. The concentration of MAPP for maximum tensile strength and modulus was optimized at 3 wt%. Flexural properties had no noticeable tendency to increase with MAPP contents compared to tensile strength, which could probably be explained by the degree in wetting of PP/MAPP matrix.

• Journal of the Korean Society of Environmental Restoration Technology
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• v.17 no.1
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• pp.27-43
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• 2014

The purpose of this research is to assess potential area of mountainous wetland by GIS and AHP (Analytic Hierarchy Process). Mountainous wetland is topographically located at high altitude, so it's difficult to approach for researchers. And, it's difficult to investigate systematically because of the insufficient information of mountainous wetland. Therefore, it's necessary to study on potential area of mountainous wetland for systematic and efficient investigation. This research selected slope, wetting index, land-cover map and soil map as assessment items indicating environmental characteristics of mountainous wetland and established them by GIS DB. And, spatial value of mountainous wetland for each assessment item was drawn by existing investigation data and overlap analysis of mountainous wetland. Based on the numerical results of each assessment item, a survey was conducted and relative importance for each assessment item was decided by AHP. As the result, slope was the highest as 0.550 and ground coverage was the lowest as 0.083. The subject of this research was Yangsan-si and Ulsan of Gyeongnam and an analysis was conducted for mountainous wetland in those research areas. As the result, all of wetland was distributed in the range of potential area. And, field survey and literature search were conducted for the point that the distribution of mountainous wetland is expected. As the result, mountainous wetland was distributed. Therefore, mountainous wetland should be excavated through the results of this research and it should be helpful for effective investigation as providing information necessary to the following studies on mountainous wetland.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.86-86
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• 2010

Micro- and nanoscale texturing and control of surface energy have been considered for superhydrophobicity on polymer and silicon. However these surfaces have been reported to be difficult to meet the robustness and transparency requirements for further applications, from self cleaning windows to biochip technology. Here we provided a novel method to fabricate a nearly superhydrophobic soda-lime glass using two-step method. The first step involved wet etching process to fabricate micro-sale patterns on soda-lime glass. The second step involved application of $SiO_x$-incorporated DLC to generate high intrinsic contact angle on the surface using chemical vapor deposition (CVD) process. To investigate the effect of surface roughness, we used both positive and negative micro-scale patterns on soda-limeglass, which is relatively hard for surface texturing in comparison to quartz or Pyrex glasses due to the presence of impurities, but cheaper. For all samples we tested the static wetting angle and transparency before and after 100 cycles of wear test using woolen steel. The surface morphology is observed using optical and scanning electron microscope (SEM). The results shows that negative patterns had a greater wear resistance while the hydrophobicity was best achieved using positive patterns having static contact angle up to 140 deg. with about 80% transparency. The overall experiment shows that positive patterns at etching time of 1 min shows the optimum transparency and hydrophobicity. The optimization of micro-scale pattern to achieve a robust, transparent, superhydrophobic soda-lime glass will be further investigated in the future works.

• Korean Journal of Chemical Engineering
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• v.35 no.11
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• pp.2241-2255
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• 2018

RSM methodology was applied to present mathematical models for the fabrication of polyvinylidene fluoride (PVDF) dual-layer hollow fibers in membrane distillation process. The design of experiments was used to investigate three main parameters in terms of polymer concentration in both outer and inner layers and the flow rate of dope solutions by the Box-Behnken method. According to obtained results, the optimization was done to present the proper membrane with desirable properties. The characteristics of the optimized membrane (named HF-O) suggested by the Box-Behnken (at the predicted point) showed that the proposed models are strongly valid. Then, a morphology study was done to modify the fiber by a combination of three types of a structure such as macro-void, sponge-like and sharp finger-like. It also improved the hydrophobicity of outer surface from 87 to $113^{\circ}$ and the mean pore size of the inner surface from 108.12 to 560.14 nm. The DCMD flux of modified fiber (named HF-M) enhanced 62% more than HF-O when it was fabricated by considering both of RSM and morphology study results. Finally, HF-M was conducted for long-term desalination process up to 100 hr and showed stable flux and wetting resistance during the test. These stepwise approaches are proposed to easily predict the main properties of PVDF dual-layer hollow fibers by valid models and to effectively modify its structure.

• Clean Technology
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• v.16 no.2
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• pp.103-116
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• 2010

It has been reported that the LCD panel market in the FPD industry is become growing and its panel size and production capacity are increasing, and its manufacturing technique is improved every year. FPD manufacturing process requires high cleanliness in its overall process. Especially, FPD cleaning process which accounts for 30~40% of total manufacturing process is very important in its technological and productivity aspects. It is difficult to remove residual liquid-crystal in the fine gap after liquid-crystal injection process in the cell. In this study, aqueous cleaning agents with excellent cleaning, rinsing, and penetrating abilities, but minimum ion content for LCD panel were formulated through mixing glycol ether-type and glycol dimethyl ether-type solvents and nonionic surfactants which are widely used as raw materials for alternative cleaning agents because of environmental regulation at home and abroad. And the formulated cleaning agents were applied to clean FPD liquid crystal after its injection in the cell. Physical properties, cleaning efficiencies, and rinsabilities of the formulated cleaning agents with different combination ratios of solvents, surfactants and additives were measured. As experimental results, the formulated cleaning agents showed higher wetting indices and cloud point than the traditional commercial cleaning agent. And it was found that cleaning efficiencies of the formulated cleaning agents were influenced by the structure of main solvents in them and the types of liquid crystal as soil for cleaning. The best cleaning agents among the formulated cleaning agents showed similar cleaning efficiencies and better rinsabilities compared to the conventional cleaning agent.

• Clean Technology
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• v.17 no.4
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• pp.306-313
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• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.