• Journal of the Korean Ceramic Society
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• v.19 no.1
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• pp.24-34
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• 1982

The effect of the several variables on wetting of AISIB1113 steel by molten glass was studied by Sessible-drop method. Experimental variables were temperature, firing atmospheres, Fe2O3 addition to the sealing glass and steel surface conditions. The degree of wetting in terms of contact angles between molten glass and metal tested at different test conditions was analyzed by using Young's equation. The results showed that contact angles in H2 atmosphere in the glass metal systems were high but in N2 atmosphere, were small for studied glass metal systems. Especially, when the glass drop was in contact with oxidized steel in N2 atmosphere, The best adherence with contact angle of approximately 9°was obtained. In the case of Fe2O3 addition in glass contact angles subtantially increased due to the increase of surface tension of glass. Wetting phenomena were also discussed under the basis of these experimental results.

• Journal of Welding and Joining
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• v.20 no.5
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.179.2-179.2
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• 2014

Carbon nanotubes (CNT)-metal contacts play an important role in nanoelectronics applications such as field-effect transistor (FET) devices. Using Al and (10,0) CNT, we have recently showed that the CNT-metal contacts mediated via topological defects within CNT exhibits intrinsically low contact resistance, thanks to the preservation of the sp2 bonding network at the metal-CNT contacts.[1] It is well-established that metals with good wetting property such as Pd consistently yield good contacts to both metallic and semiconducting CNTs. In this work, the electronic and charge transport properties of the interfaces between capped CNT and Pd will be investigated based on first-principles computations and compared with previous results obtained for the Al electrodes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.11
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• pp.925-931
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• 2007

We successively fabricated the Ni metal mask by additive method and evaluated the effects of wetting agents addition on the microstructure, hardness, and friction coefficient. In the process, the additive patterns with fine hole and pitch were made by photolithography technique and subsequently Ni plate was electroformed on the patterns. We found that the microstructure and mechanical properties were significantly varied when the different combinations of the wetting agents were used. When the wetting agents of both SF-1 and SF-2 were added, the microstructure consisted of crystal and amorphous phases, the grain size reduced to 5-40 nm, the RMS value decreased to 11.4 nm and the wear resistance improved. In addition, the hardness was as high as 638 Hv which is higher than that of commercial stainless steel mask and this improvement is probably due to the presence of amorphous Phase and fine grain size. The improvement of the wear resistance can provide a higher reliability and a longer service life.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Journal of Korea Foundry Society
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• v.15 no.4
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• pp.360-367
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• 1995

Effects of metal coating treatment on SiC particle on wetting behavior and interfacial strength were studied. Experimental variables are included types of coated metallic films such as Cu and Ni-P, and temperatures of heat-treatment under vacuum. The experimental results concerning wetting phenomena of liquid Al on SiC, showed that coating treatment of metallic film on SiC particles remarkably improves the wetting behavior of liquid Al on SiC, especially in the case of Ni-P coating. The interfacial strength of Al/SiC composites made of coated SiC plate was higher than that of the composite with non-coated SiC plate although the coating treatment was not perfect.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.3
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• pp.133-142
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• 2011

We produce a photosensitive convex plate to research a Nickel metal relief printing plate using galvanic process. A Method for preparing DLC convex plate that is metalized on Nickel metal relief printing plate using CVD(Chemical Vapor Deposition) process and $N_2DLC$-convex plate that is DLC metalized thin film layer of $N_2$ plasma surface treatment are comprised. DLC thin film layers on Nickel surface are fragile. The results of the research indicate that the coefficient of friction on DLC metalized thin film layer is relatively low than Nickel surface and the durability of Nickel surface coated DLC metalized thin film layer is superior to Nickel surface. A relative evaluation of three form plate wetting properties using varnish liquid-drop plate indicates superior printing aptitudes for $N_2DLC$, DLC, Nichel plate order as above.

• Korean Journal of Materials Research
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• v.3 no.6
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• pp.606-613
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• 1993

This was studied about aging characteristic of AC4A/$SiC_{w}$ 10-30v/o reinforced composite. Aging hardenability was decreased $SiC_{w}$ 30% > 10% > 20%. Aging hardening of T6 treatmented composite was higher absolute value than AC4A I/M material. And this results indicated initial hardening phenomenon according to increase $SiC_{w}$ volume fraction. Reinforced effect by pressure was the same effect as before aging treatment and the best condition pressure at 75MPa. Similar to reinforced effect according to $SiC_{w}$ volume fraction was 30 % > 10 % > 20 %. In case of pressure is low, whisker is not break the same time press with base metal after wetting. After it is wetting with base metal, a part transformed or wetting part break and whisker maintain original shape or a part transformed on the otherhand, in case of pressure is high, whisker is break in same time it was not against pressure and whisker's shape is near a polygon or spherical shape.

• Korean Journal of Materials Research
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• v.19 no.2
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• pp.115-118
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• 2009

The use of dolomite refractories has increased during the past several years in the manufacturing of clean steel during the stainless steelmaking process. However, at the same time, the use of dolomite refractories has led to what is known as the skull formation. In the present work, to understand the skull formation, the wetting characteristics of dolomite substrates by liquid Fe-19wt%Cr-10wt%Ni alloys in various oxygen partial pressures were initially investigated at 1753K using the sessile drop technique. For comparison, the wetting characteristics of alumina substrates were investigated with the same technique. It was found that the wetting index, (1+$cos{\theta}$), of dolomite is approximately 40% higher compared to those of alumina. In addition, the oxygen partial pressure to generate the surface oxide, which may capture the liquid metal on the refractory surface, for dolomite is much lower than that for alumina. From this study, it was concluded that the use of dolomite is much more closely associated with the skull formation compared to the use of alumina due to the stronger wettability and the surface oxide formation at a lower oxygen partial pressure of dolomite.

• Proceedings of the Korean Vacuum Society Conference
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• 2008.02a
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• pp.114-114
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• 2008