Browse > Article
http://dx.doi.org/10.4313/JKEM.2007.20.11.925

Fabrication and Characterizations of Nickel Metal Mask with fine Pitch by Additive Process  

Park, Eui-Cheol (성균관대학교 신소재공학부)
Lim, Jun-Hyung (성균관대학교 신소재공학부)
Kim, Kyu-Tae (성균관대학교 신소재공학부)
Park, Si-Hong (성균관대학교 신소재공학부)
Hwang, Soo-Min (성균관대학교 신소재공학부)
Shim, Jong-Hyun (성균관대학교 신소재공학부)
Jung, Seung-Boo (성균관대학교 신소재공학부)
Kim, Bong-Soo (에프앤비테크)
Joo, Jin-Ho (성균관대학교 신소재공학부)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.20, no.11, 2007 , pp. 925-931 More about this Journal
Abstract
We successively fabricated the Ni metal mask by additive method and evaluated the effects of wetting agents addition on the microstructure, hardness, and friction coefficient. In the process, the additive patterns with fine hole and pitch were made by photolithography technique and subsequently Ni plate was electroformed on the patterns. We found that the microstructure and mechanical properties were significantly varied when the different combinations of the wetting agents were used. When the wetting agents of both SF-1 and SF-2 were added, the microstructure consisted of crystal and amorphous phases, the grain size reduced to 5-40 nm, the RMS value decreased to 11.4 nm and the wear resistance improved. In addition, the hardness was as high as 638 Hv which is higher than that of commercial stainless steel mask and this improvement is probably due to the presence of amorphous Phase and fine grain size. The improvement of the wear resistance can provide a higher reliability and a longer service life.
Keywords
Additive process; Electroforming; Friction coefficient; Metal mask; Wetting agent;
Citations & Related Records
연도 인용수 순위
  • Reference
1 K. Holmberg, 'A concept for friction mechanisms of coated surfaces', Surface and Coatings Technology, Vol. 56, p. 1, 1992   DOI   ScienceOn
2 J. Kloeser, K. Heinricht, E. Jung, L. Lauter, A. Ostmann, R. Aschenbrenner, and H. Reichl, 'Low cost bumping by stencil printing: process qualification for 200 ${\mu}m$ pitch', Microelectronics Reliability, Vol. 40, p. 497, 2000   DOI   ScienceOn
3 C.-W. Ju, S.-J. Kim, K.-H. Pack, H.-T. Lee, B.-S. Han, S.-S. Park, and Y.-I. Kang, 'Fabrication of wafer level fine pitch solder bump for flip chip application', J. of KIEEME(in Korean), Vol. 14, No. 11, p. 874, 2001
4 Y. P. Kathuria, 'L3: Laser, LIGA and lithography in microstructuring', J. Indian Inst. Sci., Vol. 84, p. 77, 2004
5 Marc J. Madou, 'Fundamentals of microfabrication', CRC press, p. 35, 2002
6 M. Meozzi, 'Special use of the ball on disc standard test', Tribology International, Vol. 39, p. 496, 2006   DOI   ScienceOn
7 Y. Y. Wu, D.-Y. Chang, D.-S. Kim, and S.-C. Kwon, 'Effects of 2-butyne-1,4-diol on structures and morphologies of electroplating Ni - W alloy', Surface and Coatings Technology, Vol. 162, p. 269, 2003   DOI   ScienceOn
8 P. Sibley and P. A. Brook, 'The effect of addition agents on the electrical resistivity of electrodeposited nickel', Electrodeposition and Surface Treatment, Vol. 1, p. 439, 1972   DOI   ScienceOn
9 N. Kanani, 'Electroplating Basic principles, processes and practice', Elsevier, p. 63, 2004
10 C.-M. Cheng and R.-H. Chen, 'Experimental investigation of fabrication properties of electroformed Ni-based micro mould inserts', Microelectronic Engineering, Vol. 75, p. 423, 2004   DOI   ScienceOn
11 David B. Williams and C. Barry Carter, 'Transmission electron microscopy : Diffraction', Springer, p. 274, 1996
12 Frederick A. Lowenheim, 'Modern electroplating', Wiley, p. 26, 1942
13 K. P. Wong, K. C. Chan, and T. M. Yue, 'Influence of spike current in different shaped waveforms on the hardnesses and grain size of nickel electroforms', Journal of Materials Processing Technology, Vol. 117, p. 97, 2001   DOI   ScienceOn
14 R. Liu and D. Y. Li, 'Modification of Archard's equation by taking account of elastic/pseudoelastic properties of materials', Wear, Vol. 251, p. 956, 2001   DOI   ScienceOn