• 한국표면공학회지
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• 제35권1호
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

• 대한전기학회논문지:시스템및제어부문D
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• 제52권5호
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• pp.206-206
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• 2003

It is hard to expect excellent electrical, mechanical and chemical properties from most of the composite materials presently used as insulators due to insufficient wettability property caused by the difference of interfacial properties between the matrix material and the reinforcer. Therefore, various interfacial coupling agents have been developed to improve the interfacial properties of composite materials. But if the wettable coupling agents are used outdoor for a long time, change in quality takes place in the coupling agents themselves, bringing about deterioration of the properties of the composite materials. In this study, glass surface was treated by plasma to examine the effect of dry interface treatment without coupling agent. It was identified that the optimum parameters for the best wettability of the samples at the time of generation of plasma were oxygen atmosphere, 0.1 torr of system pressure, 100 W of discharge power, and 3 minutes of discharge time. Also, the surface resistance rate and dielectric property were improved.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권5호
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• pp.206-212
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• 2003

It is hard to expect excellent electrical, mechanical and chemical properties from most of the composite materials presently used as insulators due to insufficient wettability property caused by the difference of interfacial properties between the matrix material and the reinforcer. Therefore, various interfacial coupling agents have been developed to improve the interfacial properties of composite materials. But if the wettable coupling agents are used outdoor for a long time, change in quality takes place in the coupling agents themselves, bringing about deterioration of the properties of the composite materials. In this study, glass surface was treated by plasma to examine the effect of dry interface treatment without coupling agent. It was identified that the optimum parameters for the best wettability of the samples at the time of generation of plasma were oxygen atmosphere, 0.1 torr of system pressure, 100 W of discharge power, and 3 minutes of discharge time. Also, the surface resistance rate and dielectric property were improved.

• Composites Research
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• 제34권5호
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• pp.305-310
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• 2021

섬유강화복합재료의 기계적물성은 섬유의 체적분율 및 사이징제 조건에 의한 계면강도에 영향을 받는다. 최적의 계면은 기지층에서 강화재로의 기계적 응력을 효과적으로 전달하여 응력 집중을 완화하고 결과적으로 복합재료의 성능을 향상시킬 수 있다. 본 논문에서는 사이징제 조건 및 섬유체적분율에 따른 에폭시 수지와 유리섬유 간의 젖음성 및 계면강도를 평가하였다. 정적 및 동적접촉각을 이용하여 사이징제가 다른 유리섬유와 에폭시 수지의 표면에너지를 계산하였고, 이를 활용하여 접착일을 계산하였다. 유리섬유 토우 캐필러리 시험법을 이용하여 젖음성을 평가하였고, 마이크로드롭렛 인발시험을 통해 계산된 계면전단강도를 이용하여 계면강도를 평가하였다. 최종적으로 젖음성과 계면강도를 활용하여 최적의 유리섬유강화 복합재료 제작 조건을 확인하였다.

• Journal of Welding and Joining
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• 제20권5호
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• Journal of Welding and Joining
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• 제20권1호
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• pp.91-96
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• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.31-35
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• 2002

It is hard to expect excellent electrical, mechanical and chemical properties from most of the composite materials presently used as insulators due to insufficient wettability property caused by the difference of interfacial properties between the matrix material and the reinforcer. Therefore, various interfacial coupling agents have been developed to improve the interfacial properties of composite materials. But if the wettable coupling agents are used outdoor for a long time, change in quality takes place in the coupling agents themselves, bringing about deterioration of the properties of the composite materials. In this study, composite materials were put to dry interfacial treatment by use of plasma technology. It has been presented that the optimum parameters for the best wettability of the samples at the time of generation of plasma were oxygen atmosphere, 0.1 torr of system pressure, 100 W of discharge power, and 3 minutes of discharge time. Also, the surface resistance rate and dielectric property were improved.

• 한국안광학회지
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• 제8권2호
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• pp.119-127
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• 2003

지질이 소수성인 RGP lens의 관리용액인 다목적용액(multipurpose solution, MPS)에서 중요한 요소인 습윤성에 대해 알아보고자 시중에 유통 중인 6개사 제품을 측정 비교해 보았다. 실험에 사용한 MPS는 ALCON의 OPTI-SOAK, CIBA Vision의 SOLO care hard, ALLEKGAN의 Total care, BOSTON의 Simplicity, B&L의 Wetting and Soaking Sol., 그리고 Saehan의 Aquas-multi였으며, 실험방법은 각각에 대해 접촉각과 표면장력, 점도를 측정하였다. 결과는 RGP lens를 8시간 MPS에 담근 후 인공누액을 떨어뜨려 측정한 접촉각은 $25^{\circ}{\sim}36^{\circ}$의 범위로 렌즈와 MPS는 비교적 우수한 습윤성을 보여주었으며, 표면장력은 19.8~31.3 mN/m의 값이 얻어졌다. 각각의 다목적용액에 렌즈를 홀더에 얹은 상태로 계면과 렌즈가 분리될 때의 표면장력을 측정하였을 때는 26.5~33.5mN/m의 값이 측정되었다. 점도는 $4^{\circ}C$와 $28^{\circ}C$에서 측정했으며 측정온도에 따라 온도가 낮을수록 높게 측정되었고, MPS의 온도 $28^{\circ}C$에서 측정했으며 측정온도에 따라 온도가 낮을수록 높게 측정되었고, MPS의 온도 $28^{\circ}C$에서 점도는 9.5~65.5 cps를, $4^{\circ}C$에서는 6.5~137 cps의 값을 보였다. RGP lens MPS는 soft lens MPS에 비해 접촉각과 표면장력은 낮고, 점도는 높아서 습윤성이 더 우수하였는데 제조회사에 따라 습윤성의 차이가 다소 있었다.

• 한국생물공학회:학술대회논문집
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• 한국생물공학회 2003년도 생물공학의 동향(XIII)
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• pp.428-433
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• 2003

소수성인 RGP lens의 관리용액인 6개사의 다목적용액(multipurpose solution, MPS)의 습윤성 접촉각과 표면장력, 점도를 측정하여 비교해 보았다. 결과는 RGP 렌즈를 8시간 MPS에 담근 후 인공누액을 떨어뜨려 측정한 접촉각은 $25^{\circ}-36^{\circ}$의 범위로 렌즈와 MPS는 비교적 우수한 습윤성을 보여주었으며, 표면 장력은 19.8-31.3 mN/m의 값이 얻어졌다. 각각의 다목적용액에 렌즈를 홀더에 얹은 상태로 계면과 렌즈가 분리될 때의 표면장력을 측정하였을 때는 26.5-33.5 mN/m의 값이 측정되었다. 점도는 4^{\circ}C$와 28^{\circ}C$에서 측정했으며 측정온도에 따라 온도가 낮을수록 높게 측정되었고, MPS의 온도 28^{\circ}C$에서 점도는 9.5-65.5 cps를, 4^{\circ}C$에서는 6.5-13.7 cps의 값을 보였다. RGP lens MpS는 soft lens MPS에 비해 접촉각과 표면장력은 낮고, 점도는 높아서 습윤성이 더 우수하였고 제조회사에 따라 습윤성의 차이가 있었다.

• 대한치과보철학회지
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• 제38권2호
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• pp.191-199
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• 2000

Wettability of addition silicone impression material is very important property for making an accurate restoration. This study examined the impression quality in clinical condition and the wettability of impression and die material. Four commercially available addition silicone impression material (Express, Examix, Contrast, Perfect) and three die materials (Die-Keen, Vel-Mix, Fuji-Rock) were studied. A total of 50 putty/wash and heavy body/wash impressions of wet intact permanent molar teeth were examined for definition of the gingival sulcus reproduction and then classified in quality ranking. The percentage of the sulcus reproduction ability of each material was calculated from the sulcus depths of cross-sectioned epoxy resin casts from the impressions and clinically measured sulcus depths, The same impression materials were used to produce 3 groups of die stone casts form void entrapment die had been exposed to milk. Voids in the impression body and stone casts ere counted under a stereoscopic microscope. From the experiment, the following results were obtained : 1. Sulcus reproduction ability of additional silicone impression material were diminished in order of Express, Examix, Perfect, Contrast. The significant difference was found between Perfect and other material. Heavy body/wash combination was superior In putty/wash method n Perfect impression material. 2. In direct observation, Contrast showed least void in impression body but correlations ere not found between sulcus reproduction and void production. 3. In void entrapment laboratory test, wettability were diminished in order of Examix, Contrast, Express, Perfect. Clinical impression recording seems not to correlate with laboratory test. 4. The wettability of die material to impression material was not different in Express, Examix, Contrast. But, in Perfect, Die-Keen had superior wettability to others.