• Journal of Welding and Joining
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• v.21 no.5
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• pp.525-533
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• 2003

The dimensional accuracy and global roughness between successive layers of VLM-s, which is a new rapid prototyping process using hotwire cutter and EPS foam, depend significantly on the operating parameters of hotwire cutter. In the present study, the effect of cutting angle on the kerf width and edge shape in hotwire cutting of EPS foam for the case of single-sloped cutting with one cutting angle was investigated. Through single-sloped cutting tests, the modified relationship between kerf width and effective heat input, considering the effect of the cutting angle, and the relationship between the melted area and the cutting angle were obtained. In order to investigate the effect of cutting angles on the thermal field in EPS foam, transient heat transfer analyses using single-sloped volumetric heat flux model and locally-conformed mesh were performed. Through the comparison between experimental and numerical results, it was shown that the proposed analysis model is needed to estimate the three-dimensional temperature distribution of the EPS foam for the case of single-sloped hotwire cutting.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.19-19
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• 2010

Mo 변화에 따른 Cr-Mo 강의 미세조직 및 물성병화를 알아보기 위해 새로 디자인된 용접봉을 사용하여 Flux cored arc welding(FCAW) 공정으로 용접하였다. 또한 고온에서의 용접부 물성을 알아보기 위하여 각각의 시편을 $400^{\circ}C$, $500^{\circ}C$, $600^{\circ}C$, $700^{\circ}C$에서 24시간 동안 열처리 하였다. 용접부의 미세조직은 미세한 베이나이트 및 침상 페라이트로 구성되었으며 Mo의 함량이 높아질수록 베이나이트 조직이 증가하여 경도 및 강도가 증가하였다. 높은 항복강도와 인장강도를 가지며 연신율이 매우 낮음을 관찰하였다. 열처리후의 미세조직은 $400^{\circ}C$, $500^{\circ}C$는 템퍼드 베이나이트 조직이 나왔으나 $600^{\circ}C$에서 베이나이트 조직이 성장하였다. $700^{\circ}C$ 로 갈수록 베이나이트가 감소하고 페라이트로 미세조직이 변태 하였으며 탄화물의 석출 및 성장이 관찰되었다. 이로 인하여 경도값이 $400^{\circ}C$, $;500^{\circ}C$ 에서 증가하였고 $600^{\circ}C$는 소폭 감소하였으며 $700^{\circ}C$의 경우 완전 페라이트 조직의 형성으로 경도가 크게 감소하고 Mo 함량에 따른 경도 차이 또한 보이지 않았다.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.305-310
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• 2001

UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

• Journal of Welding and Joining
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• v.25 no.6
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• pp.78-83
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• 2007

The wettability of Sn-Xwt%Cu(X=$0{\sim}3wt%$) solder was evaluated with wetting balance tester. And, the intermetallic compounds(IMCs) which were formed at the interface between solders and pads were investigated by using scanning electron microscopy(SEM) and energy dispersive spectroscopy(EDS). The wetting force of Sn-0.7wt%Cu solder was higher than that of 100wt%Sn and Sn-3.0wt%Cu solder. The value of $\gamma_{fl}$ and ($\gamma_{fs}-\gamma_{ls}$) had a tendency to increase with increasing the wetting temperature. The activation energy with bare Cu pad and flux with 15% solid content was increased in the following order: Sn-0.7Cu (68.42 kJ/mol) ; Sn-3.0Cu(72.66 kJ/mol) ; Sn solder(94.53 kJ/mol). It was identified that the Cu6Sn5 phase was formed at the interface between Sn-Xwt%Cu solder and Cu pad.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.195-201
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• 2009

This paper is concerned with effects of Mn and heat-input on the mechanical properties of EGW welds. Four different kinds of welding consumables were fabricated by varying Mn contents such as 1.3, 1.5, 1.7, 2.0%Mn and each consumable was welded for EGW on four heat-input conditions between 190 and 340 KJ/Cm. Mn contents were decreased as heat-input increases and alloy elements (C, Si, Ti, B, Al) to deoxidize easily also revealed similar tendency to Mn. Their microstructure, Charpy impact property and strength were investigated, and it is found that Charpy impact property and strength exhibit a strong dependence on change of microstructure by Mn contents and heat-input. The increase of Mn contents or the decrease of heat-input made the microstructure fine and increase volume fraction of acicular ferrite, thereby leading to the great improvement of Charpy impact property and strength. In case of single EGW, optimum Mn contents are over 1.7% for the toughness and strength.

• Journal of Welding and Joining
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• v.30 no.5
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• Journal of Welding and Joining
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• v.32 no.4
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• pp.26-33
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• 2014

The metallurgical and mechanical characteristics, toughness and corrosion resistance of dissimilar welds between super duplex stainless steel UNS S32750 and carbon steel ASTM A516Gr.70 have been evaluated. Three heat inputs of 21.12, 24.00, 26.88kJ/cm were employed to make joints of dissimilar metals with flux cored arc welding(FCAW). Based on microstructural examination, vermicular ferrite was formed in the first layer of weld at low heat input(21.12kJ/cm) and $Cr_{eq}/Ni_{eq}$ of 1.61 while acicular ferrite was formed in last layer of weld at high heat input(26.88kJ/cm) and $Cr_{eq}/Ni_{eq}$ of 1.72. Ferrite percentage in dissimilar welds was lowest in the first layer of weld regardless of heat inputs and it gradually increased in the second and third layers of weld. Heat affected zone showed higher hardness than the weld metal although reheated zone showed lower hardness than weld metal due to the formation of secondary austenite. Tensile strengths of dissimilar welds increased with heat input and there was 100MPa difference. The corrosion test by ferric chloride solution showed that carbon steel had poor corrosion resistance and pitting corrosion occurred in the first layer(root pass) of weld due to the presence of reheated zone where secondary austenite was formed. The salt spray test of carbon steel showed that the surface only corroded but the amount of weight loss was extremely low.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.20-25
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• 2013

This study was carried out to investigate the influence of a sigma phase precipitation on the pitting corrosion resistance and microstructural change of super duplex stainless steels(UNS S32750). The welds made by FCAW (Flux Cored Arc Welding) were heat treated ($930^{\circ}C$, $1080^{\circ}C$, $1230^{\circ}C$) and quenched. Based on the microstructural examination, it was found that the ${\sigma}$ phase was formed in base metals and welds heat treated at $930^{\circ}C$ while there were little ${\sigma}$phases formed in base metals and weld metal experienced the relatively fast cooling from $1080^{\circ}C$ and $1230^{\circ}C$. On the other hand, the most weight loss due to pitting corrosion occurred in base and weld metals heat treated at $930^{\circ}C$. It was confirmed that the pitting corrosion occurred in the phase boundaries of ferrite/sigma and austenite/sigma. The pitting corrosion resistance decreased owing to an increase in Cr, Mo depleted areas adjacent to the intermetallic phases such as ${\sigma}$phases. The hardness was greatly increased due to the precipitation ${\sigma}$phases.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1090-1096
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• 2010

This pitting corrosion study of welded joints of austenitic stainless steels (AISI 304L and 316L) has addressed the differentiating solidification mode using three newly introduced filler wires with a flux-cored arc welding process (FCAW). The delta ferrite (${\delta}$-ferrite) content in the welded metals increased with an increasing equivalent weight ratio of chromium/nickel ($Cr_{eq}/Ni_{eq}$). Ductility dip cracking (DDC) was observed in the welded metal containing ferrite with none of AISI 304L and 0.1% of AISI 316L. The potentiodynamic anodic polarization results revealed that the $Cr_{eq}/Ni_{eq}$ ratio in a 3.5% NaCl solution didn't much affect the pitting potential ($E_{pit}$). The AISI 316L welded metals with ${\ddot{a}}$-ferrite content of over 10% had a superior $E_{pit}$ value. Though the AISI 316L welded metal with 0.1% ferrite had larger molybdenum contents than AISI 304L specimens, it showed a similar $E_{pit}$ value because the concentration of chloride ions and the corrosion product induced severe damage near the DDC.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.199-201
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• 2006

The wetting balance test was carried out to compare the wettability of Sn-Xwt%Cu($0{\sim}3$wt%) solders. And, IMCs which were formed at interface between solders and substrates were investigated by using XRD(x-ray diffractometer), SEM(scanning electron microscope) and EDS(energy dispersive spectroscope). The value of ${\gamma}_[fl}$ and(${\gamma}_{fs}-{\gamma}_{ls}$) had a tendency to increase with increasing wetting temperature. The activation energy that was calculated between the bare Cu substrate and flux was increased in the following order Sn-0.7wt%Cu(68.42 kJ/mol);Sn-3.0wt%Cu(72.66 kJ/mol);100wt%Sn solder(94.53 kJ/mol).