• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.1-10
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• 2018

Recently, there has been rapid development in the field of flexible electronic devices, such as organic light emitting diodes (OLEDs), organic solar cells and flexible sensors. Encapsulation process is added to protect the flexible electronic devices from exposure to oxygen and moisture in the air. Using numerical simulation, we investigated the effects of the encapsulation layer on mechanical stability of the silicon chip, especially the fracture performance of center crack in multi-layer package for various loading condition. The multi-layer package is categorized in two type - a wide chip model in which the chip has a large width and encapsulation layer covers only the chip, and a narrow chip model in which the chip covers both the substrate and the chip with smaller width than the substrate. In the wide chip model where the external load acts directly on the chip, the encapsulation layer with high stiffness enhanced the crack resistance of the film chip as the thickness of the encapsulation layer increased regardless of loading conditions. In contrast, the encapsulation layer with high stiffness reduced the crack resistance of the film chip in the narrow chip model for the case of external tensile strain loading. This is because the external load is transferred to the chip through the encapsulation layer and the small load acts on the chip for the weak encapsulation layer in the narrow chip model. When the bending moment acts on the narrow model, thin encapsulation layer and thick encapsulation layer show the opposite results since the neutral axis is moving toward the chip with a crack and load acting on chip decreases consequently as the thickness of encapsulation layer increases. The present study is expected to provide practical design guidance to enhance the durability and fracture performance of the silicon chip in the multilayer package with encapsulation layer.

• Mycobiology
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• v.30 no.3
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• pp.170-174
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• 2002

A total of twenty-nine species and one species variety belonging to 12 genera was isolated from 30 samples of molasses on 1% glucose(10 genera, 22 species and 1 variety) and 50% sucrose(7, 21 and 1) Czapek's agar at $25^{\circ}C$ media. Aspergillus, Mucor, Mycosphaerella and Penicillium were the most common genera on the two types of media. From the above genera, the most prevalent species were: Aspergillus flavus, A. fumigatus, A. niger, Mycosphaerella tassiana, Penicillium chrysogenum, P. oxalicum and P. purpurogenum. Also, some species were only isolated on 50% sucrose such as Eurotium amstelodami, E. chevalieri, E. repens, Humicola fuscoatra, Penicillium aurantiogriseum and P. puberulum. About 65 fungal isolates isolated from 50% sucrose agar were tested for their ability to produce invertase enzyme in liquid medium and 93.8% of the isolates could produce this enzyme. From the positive isolates, 32 showed high invertase activity, 21 had moderate activity and the remaining 8 isolates were of weak activity. Sixty isolates of Aspergillus, Emericella, Eurotium, Mycosphaerella and Penicillium from the preceding study were screened for the presence of their respective mycotoxins. Larva of brine shrimp(Artema sauna L.) were used for toxicity test of the fungal crude extracts. Three isolates out of 60 tested were toxic. Using thin-layer chromatographic technique, 5 different known mycotoxin were detected aflatoxins : B1, B2, G1, G2 and citrinin.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.732-742
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• 1995

Effects of the substrate pretreatment on uncleation density of the diamond thin films have been investigated. The film was prepared using the hot-filament CVD reactor with the mixture of methane and hydrogen. The substrate pretreatment was done in three different ways: predeposition of carbon on the substrate, soot on the substrate, and graphite on the substrate. All three cases enhanced the nucleation density of diamond. And the effect was more marked in the first and the second cases than in the third one. In the first case where the substrate was predeposited by the carbon phase, a very smooth and uniform film of diamond could be obtained. Since the bound strength between the substrate and the predeposited carbon phase is relatively weak, separation of the diamond film layer from the substrate was found to be easy.

• Journal of the Korean institute of surface engineering
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• v.55 no.2
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• pp.91-95
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• 2022

ZnO single layer (60 nm thick) and ZnO with Ag interlayer (ZnO/Ag/ZnO; ZAZ) films were deposited on the glass substrates by using radio frequency (RF) and direct current (DC) magnetron sputter to evaluate the effectiveness of Ag interlayer on the optical visible transmittance and the conductivity of the films. In the ZAZ films, the thickness of ZnO layers was kept at 30 nm, while the Ag thickness was varied as 5, 10, 15 and 20 nm. In X-ray diffraction (XRD) analysis, ZnO films show the (002) diffraction peak and ZAZ films also show the weak ZnO (002) peak and Ag (111) diffraction peak. As a thickness of Ag interlayer increased to 20 nm, the grain size of the Ag films enlarged to 11.42 nm and the optical band gap also increased from 4.15 to 4.22 eV with carrier concentration increasing from 4.9 to 10.5×10²¹ cm^-3. In figure of merit measurements, the ZAZ films with a 10 nm thick Ag interlayer showed the higher figure of merit of 4.0×10^-3 Ω^-1 than the ZnO single layer and another ZAZ films. From the experimental result, it is assumed that the Ag interlayer enhanced effectively the opto-electrical performance of the ZAZ films.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.3
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• pp.576-581
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• 2005

In this paper. the a-Si:H TFT using ferroelectric of $SrTiO_3$ as a gate insulator is fabricated on glass. High k gate dielectric is required for on-current, threshold voltage and breakdown characteristics of TFT Dielectric characteristics of ferroelectric are superior to $SiO_2$ and $Si_3N_4$. Ferroelectric increases on-current and decreases threshold voltage of TFT and also ran improve breakdown characteristics.$SrTiO_4$ thin film is deposited by e-beam evaporation. Deposited films are annealed for 1 hour in N2 ambient at $150^{\circ}C\~600^{\circ}C$. Dielectric constant of ferroelectric is about 60-100 and breakdown field is about IMV/cm. In this paper, the TFT using ferroelectric consisted of double layer gate insulator to minimize the leakage current. a-SiN:H, a-Si:H (n-type a-Si:H) are deposited onto $SrTiO_3$ film to make MFNS(Metal/ferroelectric/a-SiN:H/a-Si:H) by PECVD. In this paper, TFR using ferroelectric has channel length of$8~20{\mu}m$ and channel width of $80~200{\mu}m$. And it shows that drain current is $3.4{\mu}A$at 20 gate voltage, $I_{on}/I_{off}$ is a ratio of $10^5\~10^8,\;and\;V_{th}$ is$4\~5\;volts$, respectively. In the case of TFT without having ferroelectric, it indicates that the drain current is $1.5{\mu}A$ at 20gate voltage and $V_{th}$ is $5\~6$ volts. If properties of the ferroelectric thin film are improved, the performance of TFT using this ferroelectric thin film can be advanced.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.37-43
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• 2020

The effects of O₂ plasma pre-treatment and post-annealing conditions on the interfacial adhesion of Ti thin film and WPR dielectric were investigated using 90° peel test for fan-out wafer level packaging (FOWLP) redistribution layer (RDL) applications. Peel strength between Ti film and WPR dielectric decreased from 8.9±1.3 g/mm to 2.7±0.9 g/mm for variation of O₂ plasma pre-treatment time from 30s to 300s, which is closely related to C-O-C or C=O bonds breakage at the WPR dielectric surface due to excessive plasma pre-treatment conditions. During post-annealing at 150℃, the peel strength abruptly decreased from 0 h to 24 h, and then maintained constant until 100 h, which is also mainly due to the damage of WPR dielectric which is weak to high temperature. Therefore, the optimum plasma pre-treatment conditions on the surface of dielectric is essential to interfacial reliability of FOWLP RDL.

• Journal of Ocean Engineering and Technology
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• v.31 no.3
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• pp.241-247
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• 2017

Plywood, which is created by bonding an odd number of thin veneers perpendicular to the grain orientation of an adjacent layer, was developed to supplement the weak points such as contraction and expansion of conventional wood materials. With structural merits such as strength, durability, and good absorption against impact loads, plywood has been adopted as a structural material in the insulation system of a membrane type liquefied natural gas (LNG) carrier. In the present study, as an attempt to resolve recent failure problems with plywood in an LNG insulation system, conventional PF (phenolic-formaldehyde) resin plywood and its alternative MUF (melamine-urea-formaldehyde) resin bonded plywood were investigated by performing material bending tests at ambient ($20^{\circ}C$) and cryogenic ($-163^{\circ}C$) temperatures to understand the resin and grain effects on the mechanical behavior of the plywood. In addition, the failure characteristics of the plywood were investigated with regard to the grain orientation and testing temperature.

• Korean Journal of Oriental Medicine
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• v.12 no.2 s.17
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• pp.63-73
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• 2006

In the original plant of Arisaematis Rhizomas, the features of external and internal shape of Arisaema amurense var. serratum $N_{AKAI}$ and A. amurense $_{MAXIM}$. are as follows. 1. In the external shape of original plant, Arisaema amurense var. serratum $N_{AKAI}$ has high stem, an oval-elliptic leaflet and a serrate leaf margin. But A. amurense $M_{AXIM}$ has a relatively low stem, an upside oval leaflet and no serrate leaf margin. 2. On the herbs character of original plant, Ansaema amurense var. serratum $N_{AKAI}$ is small in height and diameter, but A. amurense $M_{AXIM}$ is relatively large in height and diameter. 3. On the gathered herbs character of original plant, the section of Arisaema amurense var. serratum $N_{AKAI}$ is brightly white, easily spilt and strong scent. But the section of A. amurense $M_{AXIM}$ is thin yellowish brown, not easily spilt and weak scent. Also the grade of gathered herbs, both can be classified by diameter and external scent. 4. In the current herbs character, Korean and Sichuan Province products are irregullar shape and have no scent, Jilin Province products are regular shape. Also, Guangxi Province products are small size and concave in one side, Hebei Province products are irregular size and shape. 5. In internal shape of original plant, epidermal cell of Arisaema amurense var. serratum is very tight. With the except of micro difference in parenchyma cell of cortex, on the whole there are nearly no differences with A. amurense $M_{AXIM}$. Also, samely in the internal shape, according to collecting sites, epidermis exhibits a lot layer in curving state and secreting duct is developed and vascular bundle and exists between parenchyma cell of cortex. In the future, additional study is needed to distinguish herb and effect between same genus-degree of relatedness.

• The Journal of Korean Academy of Prosthodontics
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• v.43 no.5
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• pp.684-693
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• 2005

Statement of problem: Ti-6Al-7Nb alloy is used instead of Ti-6Al-4V alloy that was known to have toxicity. Purpose: This study was performed to investigate the effect of electrolyte concentration on the surface characteristics of anodized and hydrothermally-treated Ti-6Al-7Nb alloy Materials and methods: Discs of Ti-6Al-7Nb alloy of 20 mm in diameter and 2 mm in thickness were polished sequentially from #300 to 1,000 SiC paper ultrasonically washed with acetone and distilled water for 5 min, and dried in an oven at $50^{\circ}C$ for 24 hours. Anodizing was performed at current density $30mA/cm^2$ up to 300 V in electrolyte solutions containing $\beta-glycerophosphate$ disodium salt hydrate $(\beta-GP)$ and calcium acetate (CA). Hydrothermal treatment was conducted by high pressure steam at $300^{\circ}C$ for 2 hours using a autoclave. All samples were soaked in the Hanks' solution with pH 7.4 at $36.5^{\circ}C$ for 30 days. Results and conclusion: The results obtained were summarized as follows: 1. After hydrothermal treatment, the precipitated HA crystals showed the dense fine needle shape. However, with increasing the concentration of electrolyte they showed the shape of thick and short rod. 2. When the dense fine needle shape crystals was appeared after hydrothermal treatment, the precipitation of HA crystals in Hanks' solution was highly accelerated. 3. The crystal structures of $TiO_2$ in anodic oxide film were composed of strong anatase peak and weak rutile peak as analyzed with thin-film X-ray diffractometery. 4. The Ca/P ratio of the precipitated HA layer was equivalent to that of HA crystal in Hanks' solution.

• Journal of the Korean Wood Science and Technology
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• v.13 no.4
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• pp.67-72
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• 1985

To improve the bending strength of sawdustboard, verious resin contents of 10, 13, 16, and 19% were applied to the thin shell (face layer) composed with wire net or not. The shell effect of sawdust and wire net composition formed with core sawdustboard were evaluated. Forcusing on the effects of wire net composition and noncomposition including a comparison with chipboard and veneer complyboard, bending properties (Modulus of rupture (MOR), Modulus of elasticity (MOE), Stress at proportional limit ($S_{pl}$). Work to maximum load ($W_{ml}$))were analyzed and discussed. 1. In modulus of rutpute, veneer comply was the highest (621.5 kg/$cm^2$), and next decreasing order was wire net composition (159.1 kg/$cm^2$), chipboard (81.75 kg/$cm^2$), and wire net noncomposition (76.21 kg/$cm^2$) as in modulus of elasticity, work to maximum load, except for stress at proportional limit. 2. The highly significant effects were shown in both wire net composition and noncomposition, at the same time wire net composition exceeded two times of noncomposition throughout resin contents in bending properties. Chipboard was similar to the mean or 16% resin content in noncomposirion. 3. Every board in wire net composition above 10% resin content was beyond 100 kg/$cm^2$ in MOR, minimum allowable strength for structural use according to KS F 3104. In conclusion, the feasibility for improving the bending strength of weak sawdustboard by wire net composed shell was offered.