• 마이크로전자및패키징학회지
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• 제25권1호
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• pp.1-10
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• 2018

최근 플렉서블 OLED, 플렉서블 반도체, 플렉서블 태양전지와 같은 유연전자소자의 개발이 각광을 받고 있다. 유연소자에 밀봉 혹은 봉지(encapsulation) 기술이 매우 필요하며, 봉지 기술은 유연소자의 응력을 완화시키거나, 산소나 습기에 노출되는 것을 방지하기 위해 적용된다. 본 연구는 봉지막(encapsulation layer)이 반도체 칩의 내구성에 미치는 영향을 고찰하였다. 특히 다층 구조 패키지의 칩의 파괴성능에 미치는 영향을 칩의 center crack에 대한 파괴해석을 통하여 살펴보았다. 다층구조 패키지는 폭이 넓어 칩 위로만 봉지막이 덮고있는 "wide chip"과 칩의 폭이 좁아 봉지막이 칩과 기판을 모두 감싸고 있는 "narrow chip"의 모델로 구분하였다. Wide chip모델의 경우 작용하는 하중조건에 상관없이 봉지막의 두께가 두꺼울수록, 강성이 커질수록 칩의 파괴성능은 향상된다. 그러나 narrow chip모델에 인장이 작용할 때 봉지막의 두께가 두껍고 강성이 커질수록 파괴성능은 악화되는데 이는 외부하중이 바로 칩에 작용하지 않고 봉지막을 통하여 전달되기에 봉지막이 강하면 강한 외력이 칩내의 균열에 작용하기 때문이다. Narrow chip모델에 굽힘이 작용할 경우는 봉지막의 강성과 두께에 따라 균열에 미치는 영향이 달라지는데 봉지막의 두께가 작을 때는 봉지막이 없을 때보다 파괴성능이 나쁘지만 강성과 두께의 증가하면neutral axis가 점점 상승하여 균열이 있는 칩이 neutral axis에 가까워지게 되므로 균열에 작용하는 하중의 크기가 급격히 줄어들게 되어 파괴성능은 향상된다. 본 연구는 봉지막이 있는 다층 패키지 구조에 다양한 형태의 하중이 작용할 때 패키지의 파괴성능을 향상시키기 위한 봉지막의 설계가이드로 활용될 수 있다.

• Mycobiology
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• 제30권3호
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• pp.170-174
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• 2002

A total of twenty-nine species and one species variety belonging to 12 genera was isolated from 30 samples of molasses on 1% glucose(10 genera, 22 species and 1 variety) and 50% sucrose(7, 21 and 1) Czapek's agar at $25^{\circ}C$ media. Aspergillus, Mucor, Mycosphaerella and Penicillium were the most common genera on the two types of media. From the above genera, the most prevalent species were: Aspergillus flavus, A. fumigatus, A. niger, Mycosphaerella tassiana, Penicillium chrysogenum, P. oxalicum and P. purpurogenum. Also, some species were only isolated on 50% sucrose such as Eurotium amstelodami, E. chevalieri, E. repens, Humicola fuscoatra, Penicillium aurantiogriseum and P. puberulum. About 65 fungal isolates isolated from 50% sucrose agar were tested for their ability to produce invertase enzyme in liquid medium and 93.8% of the isolates could produce this enzyme. From the positive isolates, 32 showed high invertase activity, 21 had moderate activity and the remaining 8 isolates were of weak activity. Sixty isolates of Aspergillus, Emericella, Eurotium, Mycosphaerella and Penicillium from the preceding study were screened for the presence of their respective mycotoxins. Larva of brine shrimp(Artema sauna L.) were used for toxicity test of the fungal crude extracts. Three isolates out of 60 tested were toxic. Using thin-layer chromatographic technique, 5 different known mycotoxin were detected aflatoxins : B1, B2, G1, G2 and citrinin.

• 한국재료학회지
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• 제5권6호
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• pp.732-742
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• 1995

다이아몬드 증착시 기판의 표면처리를 변화시켰을 때 다이아몬드의 핵생성 밀도에 미치는 영향에 대하여 연구하였다. 실험장치는 열 필라멘트 CVD 장치를 사용하였고, 반응가스로 메탄과 수소가스를 사용하였다. 기판의 표면 처리는 탄소 상을 기판에 증착시키는 방법, Soot에 의한 기판 표면처리, 혹연에 의한 기판 표면처리로 크게 3가지로 행하였다. 모든 경우에 핵생성 밀도가 증가하였으나 탄소 상을 증착시킨 경우와 soot에 의한 사전처리의 경우의 핵생성 밀도의 증가가 혹연에 의한 처리보다 더 현저하였다. 또한 탄소강의 증착의 경우 표면에 굴곡이 없는 매우 평탄하고 균일한 다이아몬드 막을 얻을 수 있었다. 사전증착처리 한 기판에 탄소 층을 형성시켰을 때 탄소 층과 기판과의 접착력이 약한 것을 이용하여 다이아몬드 막을 쉽게 분리시켜 free standing 다이아몬드 박막을 얻을 수 있음을 알았다.

• 한국표면공학회지
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• 제55권2호
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• pp.91-95
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• 2022

ZnO single layer (60 nm thick) and ZnO with Ag interlayer (ZnO/Ag/ZnO; ZAZ) films were deposited on the glass substrates by using radio frequency (RF) and direct current (DC) magnetron sputter to evaluate the effectiveness of Ag interlayer on the optical visible transmittance and the conductivity of the films. In the ZAZ films, the thickness of ZnO layers was kept at 30 nm, while the Ag thickness was varied as 5, 10, 15 and 20 nm. In X-ray diffraction (XRD) analysis, ZnO films show the (002) diffraction peak and ZAZ films also show the weak ZnO (002) peak and Ag (111) diffraction peak. As a thickness of Ag interlayer increased to 20 nm, the grain size of the Ag films enlarged to 11.42 nm and the optical band gap also increased from 4.15 to 4.22 eV with carrier concentration increasing from 4.9 to 10.5×10²¹ cm^-3. In figure of merit measurements, the ZAZ films with a 10 nm thick Ag interlayer showed the higher figure of merit of 4.0×10^-3 Ω^-1 than the ZnO single layer and another ZAZ films. From the experimental result, it is assumed that the Ag interlayer enhanced effectively the opto-electrical performance of the ZAZ films.

• 한국정보통신학회논문지
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• 제9권3호
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• pp.576-581
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• 2005

강유전체$(SrTiO_3)$ 박막을 게이트 절연층으로 하여 수소화 된 비정질 실리콘 박막 트랜지스터를 유리 기판 위에 제조하였다. 강유전체는 기존의 $SiO_2,\;SiN$ 등과 같은 게이트 절연체에 비하여 유전특성이 매우 뛰어나 TFT의 ON 전류를 증가시키고 문턱전압을 낮추며 항복특성을 개선하여 준다. PECVD에 의하여 증착된 a-Si:H는 FTIR 측정 결과 $2,000cm^{-1}$과 $876cm^{-1}$에서 흡수 밴드가 나타났으며, $2,000cm^{-1}$과 $635cm^{-1}$은 $SiH_1$의 stretching과 rocking 모드에 기인한 것이며 $876cm^{-1}$의 weak 밴드는 $SiH_2$ vibration 모드에 의한 것이다. a-SiN:H는 optical bandgap이 2.61 eV이고 굴절률은 $1.8\~2.0$, 저항률은 $10^{11}\~10^{15}\Omega-cm$ 정도로 실험 조건에 따라 약간 다르게 나타난다. 강유전체$(SrTiO_3)$ 박막의 유전상수는 $60\~100$ 정도이고 항복전계는 IMV/cm 이상으로 우수한 절연특성을 갖고 있다. 강유전체를 이용한 TFT의 채널 길이는 $8~20{\mu}m$, 채널 넓이는 $80~200{\mu}m$로서 드레인 전류가 게이트 전압 20V에서 $3.4{\mu}A$이고 $I_{on}/I_{off}$ 비는 $10^5\~10^8,\;V_{th}$는 $4\~5\;volts$이다.

• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.37-43
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• 2020

Fan-out wafer level packaging (FOWLP) 재배선 적용을 위한 Ti 박막과 WPR 절연층 사이의 계면 신뢰성을 평가하기 위해, O₂ 플라즈마 전처리 및 후속 열처리 시간에 따라 90° 필 테스트를 진행하였다. O₂ 플라즈마 전처리 시간이 증가 할수록 계면 접착력이 감소하다가 유지되는 거동을 보였으며, 이는 과도한 O₂ 플라즈마 전처리가 WPR 절연층 내의 C-O-C 또는 C=O 결합을 끊어 WPR 표면이 손상을 받아 계면 접착력이 저하된 것으로 판단된다. 또한 O₂ 플라즈마 전처리를 30초 진행한 시편을 150℃ 후속 열처리 진행한 결과, 계면 접착력이 0시간에서 24시간까지는 감소하였으나, 100시간까지 유지되는 거동을 보였다. 이는 고온에 취약한 WPR 절연층이 과도한 열처리로 인해 손상되어 계면 접착력이 급격히 감소하다가 유지되는 것으로 판단된다. 따라서, 절연층 소재에 대한 최적의 플라즈마 전처리 조건을 확보하는 것이 FOWLP 재배선의 계면신뢰성 향상을 위한 핵심요소임을 알 수 있다.

• 한국해양공학회지
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• 제31권3호
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• pp.241-247
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• 2017

Plywood, which is created by bonding an odd number of thin veneers perpendicular to the grain orientation of an adjacent layer, was developed to supplement the weak points such as contraction and expansion of conventional wood materials. With structural merits such as strength, durability, and good absorption against impact loads, plywood has been adopted as a structural material in the insulation system of a membrane type liquefied natural gas (LNG) carrier. In the present study, as an attempt to resolve recent failure problems with plywood in an LNG insulation system, conventional PF (phenolic-formaldehyde) resin plywood and its alternative MUF (melamine-urea-formaldehyde) resin bonded plywood were investigated by performing material bending tests at ambient ($20^{\circ}C$) and cryogenic ($-163^{\circ}C$) temperatures to understand the resin and grain effects on the mechanical behavior of the plywood. In addition, the failure characteristics of the plywood were investigated with regard to the grain orientation and testing temperature.

• 한국한의학연구원논문집
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• 제12권2호통권17호
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• pp.63-73
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• 2006

In the original plant of Arisaematis Rhizomas, the features of external and internal shape of Arisaema amurense var. serratum $N_{AKAI}$ and A. amurense $_{MAXIM}$. are as follows. 1. In the external shape of original plant, Arisaema amurense var. serratum $N_{AKAI}$ has high stem, an oval-elliptic leaflet and a serrate leaf margin. But A. amurense $M_{AXIM}$ has a relatively low stem, an upside oval leaflet and no serrate leaf margin. 2. On the herbs character of original plant, Ansaema amurense var. serratum $N_{AKAI}$ is small in height and diameter, but A. amurense $M_{AXIM}$ is relatively large in height and diameter. 3. On the gathered herbs character of original plant, the section of Arisaema amurense var. serratum $N_{AKAI}$ is brightly white, easily spilt and strong scent. But the section of A. amurense $M_{AXIM}$ is thin yellowish brown, not easily spilt and weak scent. Also the grade of gathered herbs, both can be classified by diameter and external scent. 4. In the current herbs character, Korean and Sichuan Province products are irregullar shape and have no scent, Jilin Province products are regular shape. Also, Guangxi Province products are small size and concave in one side, Hebei Province products are irregular size and shape. 5. In internal shape of original plant, epidermal cell of Arisaema amurense var. serratum is very tight. With the except of micro difference in parenchyma cell of cortex, on the whole there are nearly no differences with A. amurense $M_{AXIM}$. Also, samely in the internal shape, according to collecting sites, epidermis exhibits a lot layer in curving state and secreting duct is developed and vascular bundle and exists between parenchyma cell of cortex. In the future, additional study is needed to distinguish herb and effect between same genus-degree of relatedness.

• 대한치과보철학회지
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• 제43권5호
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• pp.684-693
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• 2005

Statement of problem: Ti-6Al-7Nb alloy is used instead of Ti-6Al-4V alloy that was known to have toxicity. Purpose: This study was performed to investigate the effect of electrolyte concentration on the surface characteristics of anodized and hydrothermally-treated Ti-6Al-7Nb alloy Materials and methods: Discs of Ti-6Al-7Nb alloy of 20 mm in diameter and 2 mm in thickness were polished sequentially from #300 to 1,000 SiC paper ultrasonically washed with acetone and distilled water for 5 min, and dried in an oven at $50^{\circ}C$ for 24 hours. Anodizing was performed at current density $30mA/cm^2$ up to 300 V in electrolyte solutions containing $\beta-glycerophosphate$ disodium salt hydrate $(\beta-GP)$ and calcium acetate (CA). Hydrothermal treatment was conducted by high pressure steam at $300^{\circ}C$ for 2 hours using a autoclave. All samples were soaked in the Hanks' solution with pH 7.4 at $36.5^{\circ}C$ for 30 days. Results and conclusion: The results obtained were summarized as follows: 1. After hydrothermal treatment, the precipitated HA crystals showed the dense fine needle shape. However, with increasing the concentration of electrolyte they showed the shape of thick and short rod. 2. When the dense fine needle shape crystals was appeared after hydrothermal treatment, the precipitation of HA crystals in Hanks' solution was highly accelerated. 3. The crystal structures of $TiO_2$ in anodic oxide film were composed of strong anatase peak and weak rutile peak as analyzed with thin-film X-ray diffractometery. 4. The Ca/P ratio of the precipitated HA layer was equivalent to that of HA crystal in Hanks' solution.

• Journal of the Korean Wood Science and Technology
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• 제13권4호
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• pp.67-72
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• 1985

To improve the bending strength of sawdustboard, verious resin contents of 10, 13, 16, and 19% were applied to the thin shell (face layer) composed with wire net or not. The shell effect of sawdust and wire net composition formed with core sawdustboard were evaluated. Forcusing on the effects of wire net composition and noncomposition including a comparison with chipboard and veneer complyboard, bending properties (Modulus of rupture (MOR), Modulus of elasticity (MOE), Stress at proportional limit ($S_{pl}$). Work to maximum load ($W_{ml}$))were analyzed and discussed. 1. In modulus of rutpute, veneer comply was the highest (621.5 kg/$cm^2$), and next decreasing order was wire net composition (159.1 kg/$cm^2$), chipboard (81.75 kg/$cm^2$), and wire net noncomposition (76.21 kg/$cm^2$) as in modulus of elasticity, work to maximum load, except for stress at proportional limit. 2. The highly significant effects were shown in both wire net composition and noncomposition, at the same time wire net composition exceeded two times of noncomposition throughout resin contents in bending properties. Chipboard was similar to the mean or 16% resin content in noncomposirion. 3. Every board in wire net composition above 10% resin content was beyond 100 kg/$cm^2$ in MOR, minimum allowable strength for structural use according to KS F 3104. In conclusion, the feasibility for improving the bending strength of weak sawdustboard by wire net composed shell was offered.