• Title/Summary/Keyword: waveguide transition

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Design and Fabrication of 25 W Ka-Band SSPA Based on GaN HPA MMICs (GaN HPA MMIC 기반 Ka 대역 25 W SSPA 설계 및 제작)

  • Ji, Hong-gu;Noh, Youn-sub;Choi, Youn-ho;Kwak, Chang-soo;Youm, In-bok;Seo, In-jong;Park, Hyung-jin;Jo, In-ho;Nam, Byung-chang;Kong, Dong-uk
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.26 no.12
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    • pp.1083-1090
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    • 2015
  • We designed and manufactured Ka-band SSPA include drive amplifier and high power amplifier MMICs by $0.15{\mu}m$ GaN commercial process. Also, we fabricated main components micro-strip line to WR28 waveguide transition and WR28 wave guide power combiner for Ka-band SSPA. This Ka-band SSPA shows saturated output power 44.2 dBm, power added efficiency 16.6 % and power gain 39.2 dB at 29~31 GHz frequency band.

Domestic Development and Module Manufacturing Results of W-band PA and LNA MMIC Chip (W-대역 전력증폭 및 저잡음증폭 MMIC의 국내개발 및 모듈 제작 결과)

  • Kim, Wansik;Lee, Juyoung;Kim, Younggon;Yu, Kyungdeok;Kim, Jongpil;Seo, Mihui;Kim, Sosu
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.21 no.3
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    • pp.29-34
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    • 2021
  • For the purpose of Application to the small radar sensor, the MMIC Chips, which are the core component of the W-band, was designed in Korea according to the characteristics of the transceiver and manufactured by 60nm GaN and 0.1㎛ GaAs pHEMT process. The output power of PA is 28 dBm at center frequency of W-band and Noise figure is 6.7 dB of switch and LNA MMIC. Output power and Noise figure of MMIC chips developed in domestic was applied to the transmitter and receiver module through W-band waveguide low loss transition structure design and impedance matching to verify the performance after the fabrication are 26.1~27.7 dBm and 7.85~10.57 dB including thermal testing, and which are close to the analysis result. As a result, these are judged that the PA and Switch and LNA MMICs can be applied to the small radar sensor.

Nonlinear guided-wave properties in planar waveguides with two nonlinear bounding thin films (비선형 박막으로 둘러싸인 평면 광도파로에서의 비선형 도파광 특성)

  • 정종술;송석호;이일항
    • Korean Journal of Optics and Photonics
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    • v.7 no.2
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    • pp.136-141
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    • 1996
  • We present a novel description of TE nonlinear guided waves in planar waveguides with two nonlinear bounding thin films. The nonlinear dispersion relations of the nonlinear waveguides are obtained by adopting the nonlinear transfer matrix. The optical properties obtained from these equations include: the power dependence of mode indices, the transition of the field maximum location, and the power distribution. The planar waveguide with self-focusing nonlinear layers shows the optical bistability of power-dependent mode indices, and the critical powers for the optical bistability increase with decreasing thickness of the nonlinear layers. The power distributions display the optical bistabilities, similar to those of nonlinear Fabry-Perot etalon.

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Development of V-band Wireless Transceiver using MMIC Modules (MMIC 모듈을 이용한 V-band 무선 송수신 시스템의 구축)

  • Lee, Sang-Jin;An, Dan;Lee, Mun-Kyo;Go, Du-Hyun;Jin, Jin-Man;Kim, Sung-Chan;Kim, Sam-Dong;Park, Hyun-Chang;Park, Hyung-Moo;Rhee, Jin-Koo
    • Proceedings of the IEEK Conference
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    • 2005.11a
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    • pp.575-578
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    • 2005
  • We report on a low-cost V-band wireless transceiver with no use of any local oscillator in the receiver block using a self-heterodyne architecture. V-band Microwave monolithic IC (MMIC) modules were developed to demonstrate the wireless transceiver using coplanar waveguide (CPW) and GaAs PHEMT technologies. The MMIC modules such as the MMIC low noise amplifier (LNA), medium power amplifier (MPA) and the up/down-mixer were installed in the transceiver system. To interface the MMIC chips with the component modules for the transceiver system, CPW-to-waveguide fin-line transition modules of WR-15 type were designed and fabricated. The fabricated LNA modules showed a $S_{21}$ gain of 8.4 dB and a noise figure of 5.6 dB at 58 GHz. The MPA modules exhibited a gain of 6.9 dB and a $P_1$ $_{dB}$ of 5.4 dBm at 58 GHz. The conversion losses of the up-mixer and the down-mixer module were 14.3 dB at a LO power of 15 dBm, and 19.7 dB at a LO power of 0 dBm, respectively. From the measurement of V-band wireless transceiver, a conversion gain of 0.2 dB and a P $_{1dB}$ of 5.2 dBm were obtained in the transmitter block. The receiver block showed a conversion gain of 2.1 dB and a P $_{1dB}$ of -18.6 dBm. The wireless transceiver system demonstrated a successful data transfer within a distance of 5 meters.

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V-band Self-heterodyne Wireless Transceiver using MMIC Modules

  • An, Dan;Lee, Mun-Kyo;Lee, Sang-Jin;Ko, Du-Hyun;Jin, Jin-Man;Kim, Sung-Chan;Kim, Sam-Dong;Park, Hyun-Chang;Park, Hyung-Moo;Rhee, Jin-Koo
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.5 no.3
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    • pp.210-219
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    • 2005
  • We report on a low-cost V-band wireless transceiver with no use of any local oscillator in the receiver block using a self-heterodyne architecture. V-band millimeter-wave monolithic IC (MMIC) modules were developed to demonstrate the wireless transceiver using coplanar waveguide (CPW) and GaAs PHEMT technologies. The MMIC modules such as the MMIC low noise amplifier (LNA), medium power amplifier (MPA) and the up/down-mixer were installed in the transceiver system. To interface the MMIC chips with the component modules for the transceiver system, CPW-to-waveguide fin-line transition modules of WR-15 type were designed and fabricated. The fabricated LNA modules showed a $S_{21}$ gain of 8.4 dB and a noise figure of 5.6 dB at 58 GHz. The MPA modules exhibited a gain of 6.9 dB and a $P_{1dB}$ of 5.4 dBm at 58 GHz. The conversion losses of the up-mixer and the down-mixer module were 14.3 dB at a LO power of 15 dBm, and 19.7 dB at a LO power of 0 dBm, respectively. From the measurement of V-band wireless transceiver, a conversion gain of 0.2 dB and a $P_{1dB}$ of 5.2 dBm were obtained in the transmitter block. The receiver block showed a conversion gain of 2.1 dB and a $P_{1dB}$ of -18.6 dBm. The wireless transceiver system demonstrated a successful data transfer within a distance of 5 meters.

Dispersion Analysis for Rectangular Coaxial Line and TEM Cell (네모 동축선과 TEM 셀의 분산관계 해석)

  • Cho, Yong-Heui
    • The Journal of the Korea Contents Association
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    • v.7 no.1
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    • pp.124-130
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    • 2007
  • A rectangular coaxial line is mainly utilized as a transition structure from a coaxial line to a rectangular waveguide. A TEM cell is also widely used to measure the EMC characteristics of a DUT. In order to understand the operations of a rectangular coaxial line and a TEM cell, it is essential to analyze the dispersion relations of a rectangular coaxial line and a TEM cell. In this paper, we present simple yet accurate dispersion relations of the TE and TM higher modes based on the TEM mode. Manipulating a mode-matching technique and a Green's function approach allows us to obtain the analytic dispersion equations of a rectangular coaxial line and a TEM cell. In our approach, a rectangular coaxial line is divided into four L-blocks and its electromagnetic fields representations are easily obtained with a superposition. To verify the convergence of our dispersion relations, we perform numerical computations and compare our results with those of FDTD.

A Study on Optimization of a Multi-Layered Metallic Disk Array Structure for Shaping of Flat-Topped Element Patterns (구형 빔 패턴 형성을 위한 다층 원형 도체 배열 구조의 최적화 연구)

  • 엄순영;박한규
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.10
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    • pp.985-995
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    • 2003
  • In this paper, a study on optimization of three dimensional multi-layered metallic disk array structure(MDAS) excited by circular waveguides was performed to shape efficient flat-topped element patterns(FTEP) of ${\pm}$20$^{\circ}$ beam width. Each radiating element of the MDAS is composed of input, transition and radiation circular waveguides and finite metal disks stacked on radiation circular waveguide. It has an array structure of a hexagonal lattice appropriate for the conical beam scanning. The analytic algorithm for the MDAS was proposed and the code was also programmed using it. Optimal design parameters of the MDAS were determined through the optimal simulation process to obtain ${\pm}$20$^{\circ}$ FTEP. Also, bandwidth characteristics for FTEP and reflection coefficients of the MDAS were investigated and, as the results, it was shown that the MDAS could shape good FTEPs of ${\pm}$20$^{\circ}$ beam width in main planes at least within a 5.6 % frequency band.

Design and Fabrication of the Ka-Band Receive Module for Millimeter Wave Seeker (밀리미터파 탐색기를 위한 Ka-대역 수신기 모듈의 설계 및 제작)

  • Yang, Seong-Sik;Lim, Ju-Hyun;Song, Sung-Chan
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.49 no.1
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    • pp.78-84
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    • 2012
  • In this paper, we introduced the design technique about a Ka band receive module for millimeter wave seekers. The receiver module consists of a waveguide, circulator and transition for antenna connection, and a limiter and gain control amplifier for receiver protection. This module is comprised of a sum, azimuth and elevation channel for receiving monopules signal, and a SLB channel for the acquisition of jamming signal. In this paper, receiver gain and range of gain control dependent on ADC nonlinear characteristic was analyzed and designed for wide dynamic range receive. In the test result of the fabricated Ka-band receive, the frequency band is 1 GHz, the noise figure is as low as 8.2 dB, the gain is $56{\pm}2dB$, the dynamic range is 135 dB, the gain congtrol is more than 86 dB, the channel isolation is more than 35 dB.

A Very Compact 60 GHz LTCC Power Amplifier Module (초소형 60 GHz LTCC 전력 증폭기 모듈)

  • Lee, Young-Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.11 s.114
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    • pp.1105-1111
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    • 2006
  • In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

Development and Manufacture of W-band MMIC Chip and manufacture of Transceiver (W-대역 MMIC 칩 국내 개발 및 송수신기 제작)

  • Kim, Wansik;Jung, Jooyong;Kim, Younggon;Kim, Jongpil;Seo, Mihui;Kim, Sosu
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.19 no.6
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    • pp.175-181
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    • 2019
  • For the purpose of Application to the small radar sensor, the MMIC Chip, which is the core component of the W-band, was designed in Korea according to the characteristics of the transceiver and manufactured by 0.1㎛ GaAs pHEMT process, and compared with the MMIC chip purchased overseas. The noise figure of low noise amplifier, insertion loss of the switch and image rejection performance of the down-converted mixer MMIC chip showed better characteristics than those of commercial chips. The MMIC chip developed in domestic was applied to the transmitter and receiver through W-band waveguide low loss transition structure design and impedance matching to verify the performance after the fabrication is 9.17 dB, which is close to the analysis result. As a result, it is judged that the transceiver can be applied to the small radar sensor better than the MMIC chip purchased overseas.