• Title/Summary/Keyword: wafer inspection

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Local Binary Feature and Adaptive Neuro-Fuzzy based Defect Detection in Solar Wafer Surface (지역적 이진 특징과 적응 뉴로-퍼지 기반의 솔라 웨이퍼 표면 불량 검출)

  • Ko, JinSeok;Rheem, JaeYeol
    • Journal of the Semiconductor & Display Technology
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    • v.12 no.2
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    • pp.57-61
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    • 2013
  • This paper presents adaptive neuro-fuzzy inference based defect detection method for various defect types, such as micro-crack, fingerprint and contamination, in heterogeneously textured surface of polycrystalline solar wafers. Polycrystalline solar wafer consists of various crystals so the surface of solar wafer shows heterogeneously textures. Because of this property the visual inspection of defects is very difficult. In the proposed method, we use local binary feature and fuzzy reasoning for defect detection. Experimental results show that our proposed method achieves a detection rate of 80%~100%, a missing rate of 0%~20% and an over detection (overkill) rate of 9%~21%.

Wafer Map Image Analysis Methods in Semiconductor Manufacturing System (반도체 공정에서의 Wafer Map Image 분석 방법론)

  • Yoo, Youngji;An, Daewoong;Park, Seung Hwan;Baek, Jun-Geol
    • Journal of Korean Institute of Industrial Engineers
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    • v.41 no.3
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    • pp.267-274
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    • 2015
  • In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in the wafer testing phase is a key element to ensure the competitiveness of companies. The prediction of package test can reduce unnecessary inspection time and expense. However, an analysing method is not sufficient to analyze data collected at wafer testing phase. Therefore, many companies have been using a summary information such as a mean, weighted sum and variance, and the summarized data reduces a prediction accuracy. In the paper, we propose an analysis method for Wafer Map Image collected at wafer testing process and conduct an experiment using real data.

Development of a Multi-template type Image Segmentation Algorithm for the Recognition of Semiconductor Wafer ID (반도체 웨이퍼 ID 인식을 위한 다중템플릿형 영상분할 알고리즘 개발)

  • Ahn, In-Mo
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.55 no.4
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    • pp.167-175
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    • 2006
  • This paper presents a method to segment semiconductor wafer ID on poor quality images. The method is based on multiple templates and normalized gray-level correlation (NGC) method. If the lighting condition is not so good and hence, we can not control the image quality, target image to be inspected presents poor quality ID and it is not easy to identify and then recognize the ID characters. Conventional several method to segment the interesting ID regions fails on the bad quality images. In this paper, we propose a multiple template method, which uses combinational relation of multiple templates from model templates to match several characters of the inspection images. To find out the optimal solution of multiple template model in ID regions, we introduce newly-developed snake algorithm. Experimental results using images from real FA environment are presented.

Micro-crack Detection in Silicon Solar Wafer through Optimal Parameter Selection in Anisotropic Diffusion Filter (비등방 확산 필터의 최적조건 선정을 통한 태양전지 실리콘 웨이퍼의 마이크로 크랙 검출)

  • Seo, Hyoung Jun;Kim, Gyung Bum
    • Journal of the Semiconductor & Display Technology
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    • v.13 no.3
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    • pp.61-67
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    • 2014
  • Micro-cracks in crystalline silicon wafer often result in wafer breakage in solar wafer manufacturing, and also their existence may lead to electrical failure in post fabrication inspection. Therefore, the reliable detection of micro-cracks is of importance in the photovoltaic industry. In this paper, an experimental method to select optimal parameters in anisotropic diffusion filter is proposed. It can reliably detect micro-cracks by the distinct extension of boundary as well as noise reduction in near-infrared image patterns of micro-cracks. Its performance is verified by experiments of several type cracks machined.

Implementation of process and surface inspection system for semiconductor wafer stress measurement (반도체 웨이퍼의 스트레스 측정을 위한 공정 및 표면 검사시스템 구현)

  • Cho, Tae-Ik;Oh, Do-Chang
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.8
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    • pp.11-16
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    • 2008
  • In this paper, firstly we made of the rapid thermal processor equipment with the specifically useful structure to measure wafer stress. Secondly we made of the laser interferometry to inspect the wafer surface curvature based on the large deformation theory. And then the wafer surface fringe image was obtained by experiment, and the full field stress distribution of wafer surface comes into view by signal processing with thining and pitch mapping. After wafer was ground by 1mm and polished from the back side to get easily deformation, and it was heated by three to four times thermal treatments at about 1000 degree temperature. Finally the severe deformation between wafer before and after the heat treatment was shown.

Image Processing and Deep Learning-based Defect Detection Theory for Sapphire Epi-Wafer in Green LED Manufacturing

  • Suk Ju Ko;Ji Woo Kim;Ji Su Woo;Sang Jeen Hong;Garam Kim
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.2
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    • pp.81-86
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    • 2023
  • Recently, there has been an increased demand for light-emitting diode (LED) due to the growing emphasis on environmental protection. However, the use of GaN-based sapphire in LED manufacturing leads to the generation of defects, such as dislocations caused by lattice mismatch, which ultimately reduces the luminous efficiency of LEDs. Moreover, most inspections for LED semiconductors focus on evaluating the luminous efficiency after packaging. To address these challenges, this paper aims to detect defects at the wafer stage, which could potentially improve the manufacturing process and reduce costs. To achieve this, image processing and deep learning-based defect detection techniques for Sapphire Epi-Wafer used in Green LED manufacturing were developed and compared. Through performance evaluation of each algorithm, it was found that the deep learning approach outperformed the image processing approach in terms of detection accuracy and efficiency.

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Individual service application for consumers's food safety

  • Lau, Shuai
    • Korean Journal of Artificial Intelligence
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    • v.3 no.1
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    • pp.1-4
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    • 2015
  • These days, men live better lives owing to economic growth. They are interested in basic desire such as clothing, food and dwelling. This study investigated food and/or eating. Men like to take better quality food to be healthy. They can hear food problems easily by news to satisfy desire. On October 13, 2014, Dongsuh Food Company was prohibited to distribute a serial product named 'Post Almond Flake' (Statistics Korea). Dongsuh Food was found to produce finished product by mixing contaminants without inspection of colon bacillus, and Crown Confectionery was found to produce 'Organic farming wafer' and 'Organic farming choco wafer' from March 2009 to early August, 2016 cognizing rejection at inspection not to inform Ministry of Health and to sell product amounting to 3.1 billion KRW .