• Journal of the Korea Institute of Military Science and Technology
• /
• v.4 no.1
• /
• pp.264-273
• /
• 2001

The conjugate heat transfer from a protruding module in a horizontal channel with a variation of air temperature is experimentally investigated. It is an aim of this study is to estimate temperature difference between a module and air. This study is performed with a variation of parameters that are air temperatures($T_i,=25^{\circ}C{\sim}55^{\circ}C),$ thermal resistance($R_c=158 K/W),$ air velocities ( 4V_i=0.1$ m/s~l.5 m/s ), and input power (Q=3 W, 7 W ). The results show that as the thermal resistance increases, the effect of air temperatures are decreased. And input power was most effective parameter on the temperature difference between a module and air.

• Proceedings of the KIPE Conference
• /
• 2005.07a
• /
• pp.279-282
• /
• 2005

Recently, due to the launching of digital broadcasting service, a demand of PDP TV with large screen size is sharply rising. PDP power module is mainly divided into power factor correction (PFC) stage and sustaining power stage. Especially, sustaining power module has pulsating load characteristics. So, the hard switching at light load condition causes low efficiency and thermal problem. Therefore, a new power conversion circuit for sustaining power module of 60' PDP is proposed whose ZVS is obtained by additional ZVS tank. This paper presents properties of the proposed converter through mode analysis, numerical analysis. And a 900w prototype for sustaining power module of 60' PDP is produced to verify the analytic results. As an experimental results, ZVS is achieved from full load to 10% load variation and more than 92% of high efficiency is obtained at 10% load condition.

• Journal of Power Electronics
• /
• v.13 no.4
• /
• pp.584-591
• /
• 2013

In this paper, a hybrid booster power module with Si IGBT and Silicon Carbide (SiC) Schottky Barrier Diode (SBDs) is presented. The switching characteristics of the hybrid booster module are compared with commercial Silicon IGBT/Si PIN diode based modules. We applied the booster power module into a non-isolated on board vehicle charger with a simple buck-booster topology. The performances of the on-vehicle charger are analyzed and measured with different power modules. The test data is measured in the same system, at the same points of operation, using the conventional Si and hybrid Si/SiC power modules. The measured power conversion efficiency of the proposed on-vehicle charger is 96.4 % with the SiC SBD based hybrid booster module. The conversion efficiency gain of 1.4 % is realizable by replacing the Si-based booster module with the Si IGBT/SiC SBD hybrid boost module in the 6.6 kW on-vehicle chargers.

• Journal of the Korea Institute of Information Security & Cryptology
• /
• v.30 no.6
• /
• pp.1279-1289
• /
• 2020

To securely protect users' sensitive information and national secrets, the importance of cryptographic modules has been emphasized. Currently, many companies and national organizations are actively using cryptographic modules. In Korea, To ensure the security of these cryptographic modules, the cryptographic module has been verified through the Korea Certificate Module Validation Program(KCMVP). Most of the domestic cryptographic modules are CPU-based software (S/W). However, CPU-based cryptographic modules are difficult to use in servers that need to process large amounts of data. In this paper, we propose an S/W cryptographic module that provides a high-speed operation using GPU. We describe the configuration and operation of the S/W cryptographic module using GPU and present the changes in the cryptographic module security requirements by using GPU. In addition, we present the performance improvement compared to the existing CPU S/W cryptographic module. The results of this paper can be used for cryptographic modules that provide cryptography in servers that manage IoT (Internet of Things) or provide cloud computing.

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.216-217
• /
• 2007

In this study, we analyzed the electrical loss characteristics between ribbon and output terminal of constituent material according to electrical resistance during interconnection process of PV module. From this result, the electrical output power reduction rate caused by interaction between ribbon and cell's interconnection was 2.88%. There was 1W electrical output power reduction through the 16 solar cells. So it is expected that the wider size of PV module gives the higher loss in electricity production. Also, the average output power of PV module passed lamination process was increased by 0.081W per one solar cell and the increase rate was 3.7%.PV module's electrical loss before and after lamination process according to constituent material's terminal was 0.49W and 0.50W, respectively.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.39C no.3
• /
• pp.234-238
• /
• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Bulletin of the Korean Mathematical Society
• /
• v.57 no.5
• /
• pp.1319-1334
• /
• 2020

In this paper, we study the basic theory of the category of graded w-Noetherian modules over a graded ring R. Some elementary concepts, such as w-envelope of graded modules, graded w-Noetherian rings and so on, are introduced. It is shown that: (1) A graded domain R is graded w-Noetherian if and only if R^g_𝔪 is a graded Noetherian ring for any gr-maximal w-ideal m of R, and there are only finite numbers of gr-maximal w-ideals including a for any nonzero homogeneous element a. (2) Let R be a strongly graded ring. Then R is a graded w-Noetherian ring if and only if R_e is a w-Noetherian ring. (3) Let R be a graded w-Noetherian domain and let a ∈ R be a homogeneous element. Suppose 𝖕 is a minimal graded prime ideal of (a). Then the graded height of the graded prime ideal 𝖕 is at most 1.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.05a
• /
• pp.71-72
• /
• 2006

In this study, automatic assembly and evaluation system fer phone camera module is conceptually designed. The designed core(Auto focus & UV curing, Image Test) equipments adopts a clustering mechanism and compactible structure using index table for minimum tact time. Using a ball screw actuator and absolute encoder in each axis, we can verifies the repeatability and position accuracy of system within ${\pm}3{\mu}m$. In result of simulation test, the proposed system is expected up to 30% in productivity than manual operation.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.26 no.7
• /
• pp.1022-1030
• /
• 2002

The experiments were performed with a $31{\times}31{\times}7mm^3$ simulated 3-dimensional module on the thermal conductive board of a parallel plate channel. The convective thermal conductance for the path from the module surface directly to airflow and conjugate thermal conductance for the path leading from the module to the floor by way of a module support, then, to the airflow were determined with several combinations of module-support-construction(210, 0.32, 0.021 K/W)/floor-material(398, 0.236W/mK) and channel height(15-30mm). As the result, it was found that the conjugate thermal conductance and the temperature distribution around the module depend on the thermal resistance of the module support, and the channel height. These configurations were designed to investigate on the feasibility of using the substrate as an effective heat spreader in the forced convective air-cooling of surface mounted heat source. The experimental results were discussed in the light of interactive nature of heat transfer through two paths, one directed from the module to the airflow and the other via the module support and the floor to the air.

• 한국신재생에너지학회:학술대회논문집
• /
• 2011.05a
• /
• pp.130.1-130.1
• /
• 2011

Nowadays, the number of PV module corporation is increasing due to demand growth of silicon solar module. However almost study of module is research about increasing of efficiency for it. This study is evaluation and development for process of module using the silicone encapsulation material instead of existing EVA sheet. We are changed adding material ratio on silicone and thickness of silicone. So we get better efficiency than EVA sheet through the evaluation for silicone liquid and modulation. Also, we are test after establishing manufacture system being able to quicker than existing modules line. The result of EVA sheet is average 207.47W and silicone material is 211.32W so we think that silicone is better than EVA sheet.