• The Journal of the Korean dental association
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• v.46 no.4
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• pp.222-231
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• 2008

Various maxillary sinus floor augmentation techniques were common performed and in the most cases, many kinds of bone graft materials were used. The graft materials are autogenous bone or other biomaterials of human, animal or synthetic origin. But these cases report describes a new surgical technique by which dental implants are inserted in a void space created by elevating the sinus membrane without additional graft material in atrophic posterior maxilla. We created lateral bony window using piezoelectric device and elevated the schneiderian membrane in five patients and was repositioned with bony window in five patients, without any bone graft. From the clinical and histological results, it is found there is potential capacity for bone formation and placement of implants in the maxillary sinus without the use of bone grafts or bone substitutes.

• Journal of Surface Science and Engineering
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• v.44 no.6
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• pp.239-245
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• 2011

Magnesium alloys is the lightest by structural metals, but it is not good corrosion resistant because of pit, void. Particularly, AZ31B magnesium alloy sheets that have slag, scratch by rolling process indicate some defects. The objective of this research is to perform uniform plating on AZ31B by studying etching and zincate process. Especially, zincate treatment by zinc salt and pyrophosphate is the most important in the decoration plating. Dissolution of magnesium is reduced by the formation of uniform zinc conversion layer during strick and post process, which decreases defects for plating process.

• Advances in materials Research
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• v.1 no.1
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• pp.83-92
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• 2012

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

• Journal of Korean Neurosurgical Society
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• v.46 no.1
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• pp.60-64
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• 2009

Nontraumatic intracranial subarachnoid hemorrhage (SAH) attributable to the thoracolumbar dural arteriovenous fistulas (DAVFs) has been extremely rare. A 41-year-old male patient was admitted with severe acute headache, neck stiffness, and pronounced low-back pain radiating to both legs. The T2-weighted MR imaging showed irregular signal void and enlarged, varix like pouch formation with spinal cord compression at the T11-12 level. The angiogram revealed a DAVF. We report a DAVF case with SAH that revealed an extensive infarction from C5 to the conus medullaris after undergoing operative treatment.

• Journal of the Korean Ceramic Society
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• v.15 no.2
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• pp.89-97
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• 1978

The basic mechanism of adherence in sintered high purity alumina ceramic-to-metal bonding was studied. Emphasis was placed on flux composition, porosity of the fired ceramics, and metallizing mixtures. The study was conducted on 95 and 99.5% alumina, using molydbenum-manganese, molybdenum-manganese-silicon dioxide metallizing compositions. Metallizing was performed in wet hydrogen (dew point, ＋17$^{\circ}C$) at 145$0^{\circ}C$ for 45min. This experiment indicated that adhernece mechanism of ultra high purity alumina ceramic was attributed to formation of $MnAl_2O_$4, and in the case of 95% alumina containing glass, the migration of glass from the interface into the void of the metal coating was the main role to the adhrence. It showed also that greater the bond-strength was resulted as porosity was increased.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1158-1161
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• 2004

Shell shaped hollow carbon nanoparticles are synthesized in the oxygen-hydrogen diffusion flame with $C_{2}H_{2}$ as precursor when it is irradiated with $CO_{2}$ laser of certain power. Below this power of laser, we couldn't get any other but amorphous soot. This shell shaped hollow carbon nanoparticles shows outer wall of high degree of crystallinity with void space inside of itself. And size distribution of these nanoparticles is measured with TEM image analysis. Also the structural comparison between this carbon nanoparticle and soot is done by Raman and XRD measurement. These results show this carbon nanoparticles are of grapheme structure, which means it has good crystallinity when compared with soot.

• Journal of the Korean Ceramic Society
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• v.30 no.4
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• pp.332-338
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• 1993

TiN/Ti is the best buffer layer between PZT thin film and si substrate among the Ti, TiN, ZrN, TiN/Ti, ZrN/Ti. The amorphous PZT films deposited on TiN/Ti buffer layer directly transform into perovskite phase when rapid thermal annealed for 30sec above 55$0^{\circ}C$. As Rapid Thermal Annealing(RTA) temperature increased, the remanent polarization(Pr) and dielectric constant($\varepsilon$r) increased and then showed Pr=21 $\varepsilon$r=593 when rapid thermal annealed 80$0^{\circ}C$ for 30sec. On the contrary the leakage current increased with increasing RTA temperature due to the formation of void made by Pb evaporationand grain cohesion.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.49-54
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• 1993

This paper discusses the reliability of solder joints of electronic devices on printed circuit board. Solder application is usually done by screen printing method for the bonding between outer leads of devices and thick film(Ag/Pd) pattern on Hybrid IC as wel1 as Cu lands on PCB. As result of thermal stresses generated at the solder joints due to the differences of thermal expansion coefficients between packge body and PCB, Micro cracking often occurs due to thermal fatigue failure at solder joints. The initiation and the propagate of solder joint crack depends on the environmental conditions, such as storage temperature and thermal cycling. The principal mechanisms of the cracking pheno- mana are the formation of kirkendal void caused by the differences in diffusion rate of materials, ant the thermal fatigue effect due to the differences of thermal expansion coefficient between package body and PCB. Finally, This paper experimentally shows a way to supress solder joints cracks by using low-${\alpha}$ PCB and the packages with thin lead frame, and investigates the phenomena of diffusion near the bonding interfaces.

• Korea-Australia Rheology Journal
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• v.21 no.1
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• pp.71-79
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• 2009

The incomplete saturation and the void formation during the resin infiltration into fibrous porous media in the resin transfer molding process cause failure in the final product during its service. In order to better understand flow behavior during the filling process, a finite-element scheme for transient flow simulation across the micro-structured fibrous media is developed in the present work. A volume-of- fluid (VOF) method has been incorporated in the Eulerian frame to capture the evolution of flow front and the vertical periodic boundary condition has been combined to avoid unwanted wall effect. In the microscale simulation, we investigated the transient filling process in various fiber structures and discussed the mechanism leading to the flow fingering in the case of random fiber distribution. Effects of the filling pressure, the shear-thinning behavior of fluid and the volume fraction on the flow front have been investigated for both intra-tow and the inter-tow flows in dual-scale fiber tow models.

• Journal of Welding and Joining
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• v.8 no.2
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• pp.70-79
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• 1990

Stainless clad steels were made through hot rolling process. Backing plates employed in this study were HSLA steel and mild steel. The shear bond strength increased with an increase of the soaking temperature and time. It was also found that the shear bond strength increased with an increase of the reduction ratio. The threshold deformation was observed to be 20% and 10% respectively when the soaking conditions of 15 min. at 900.deg. C and 30 min. at 1000.deg. C were applied. Either the rolling or the transverse direction did not give any significant difference in the shear bond strength. Stainless steel-HSLA steel was superior to stainless steel-mild steel in the same range of magnitude. Because the above experimental results were in contrary to the existing mechanisms, the new model was proposed to describe the bonding mechanism and the void formation.