• 마이크로전자및패키징학회지
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• 제18권4호
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• pp.1-9
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• 2011

Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

• The Journal of Advanced Prosthodontics
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• 제8권2호
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• pp.101-109
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• 2016

PURPOSE. To investigate the void parameters within the resin cements used for fiber post cementation by micro-CT (${\mu}CT$) and regional push-out bonding strength. MATERIALS AND METHODS. Twenty-one, single and round shaped roots were enlarged with a low-speed drill following by endodontic treatment. The roots were divided into three groups (n=7) and fiber posts were cemented with Maxcem Elite, Multilink N and Superbond C&B resin cements. Specimens were scanned using ${\mu}CT$ scanner at resolution of $13.7{\mu}m$. The number, area, and volume of voids between dentin and post were evaluated. A method of analysis based on the post segmentation was used, and coronal, middle and apical thirds considered separately. After the ${\mu}CT$ analysis, roots were embedded in epoxy resin and sectioned into 2 mm thick slices (63 sections in total). Push-out testing was performed with universal testing device at 0.5 mm/min cross-head speed. Data were analyzed with Kruskal-Wallis and Mann-Whitney U tests (${\alpha}=.05$). RESULTS. Overall, significant differences between the resin cements and the post level were observed in the void number, area, and volume (P<.05). Super-Bond C&B showed the most void formation ($44.86{\pm}22.71$). Multilink N showed the least void surface ($3.51{\pm}2.24mm^2$) and volume ($0.01{\pm}0.01mm^3$). Regional push-out bond strength of the cements was not different (P>.05). CONCLUSION. ${\mu}CT$ proved to be a powerful non-destructive 3D analysis tool for visualizing the void parameters. Multilink N had the lowest void parameters. When efficiency of all cements was evaluated, direct relationship between the post region and push-out bonding strength was not observed.

• 마이크로전자및패키징학회지
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• 제24권2호
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• pp.23-27
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• 2017

본 논문에서는 고온히터의 주 고장 원인이 되는 단자대 솔더 접합부의 손상 원인을 파악하여 사용 수명을 예측하는 방법을 제시하였다. 고온 히터 사용에 따르는 온도 스트레스로 인한 단자대 솔더 접합부의 영향을 알아보기 위해 동일한 부하 조건을 재현할 수 있는 고온히터 시편을 제작하였다. 고온히터 단자대의 단락은 주로 솔더접합부 내의 금속간 화합물이나 void로 인한 crack발생에서 기인한다. 가속시험을 통한 고장 재현을 위해 고온히터 시편을 $170^{\circ}C$의 오븐에서 장시간 동안 노출시키며 솔더 내부의 금속간 화합물 조성과 void의 변화를 측정하였다. 솔더 내의 금속간 화합물 층의 변화를 확인하기 위해서 주사전자현미경을 이용한 단면 분석을 시행하였고, 시편의 온도 스트레스로 인한 void 변화를 측정하기 위해 저항분광법을 이용한 특정 기준 주파수와 위상에 대한 신호를 실시간으로 측정하는 동시에 microCT를 이용하여 void 분율을 간헐적으로 관찰하였다. 시험결과 고온 노출 시간이 증가함에 따라 솔더 내부의 void의 분율이 증가하는 것을 확인하였으며 위상차 변화와 높은 상관관계가 있음을 확인하였다. 이 상관관계를 통해 온도 스트레스에 노출된 고온히터의 수명을 비파괴적으로 예측할 수 있음을 제시하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집C
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• pp.246-250
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• 2001

In resin transfer molding (RTM), resin is forced to flow through the fiber perform of inhomogeneous permeability. This inhomogeneity is responsible for the mismatch of resin velocity within and between the fiber tows. The capillary pressure of the fiber tows exacerbates the spatial variation of the resin velocity. The resulting microscopic perturbations of resin velocity at the flow front allow numerous air voids to form. In this study, a mathematical model was developed to predict the formation and migration of micro-voids during resin transfer molding. A transport equation was employed to account for the migration of voids between fiber tows. Incorporating the proposed model into a resin flow simulator, the volumetric content of micro-voids in the preform could be obtained during the simulation of resin impregnation.

• 한국결정학회지
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• 제12권3호
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• pp.166-170
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• 2001

실리콘 기판에 도핑되어 있는 도판트는 종류에 따라 코발트와 실리콘 기판과의 반응에 영향을 준다. 인은 붕소나 비소에 비해 코발트와 실리콘과의 반응을 억제하여 저온 열처리 동안에 CoSi₂대신에 CoSi가 형성되도록 한다. CoSi층 내에서의 확산원소는 Si으로, CoSi 층은 Co/CoSi 계면에서 성장하며 반응에 참여하는Si 소모에 의해 생기는 기판의 빈 공간을 태우기 위해 Si 기판쪽으로 이동한다. 게이트 측벽에서는 접촉되어 있는 게이트 산화막과의 결합에 의해 CoSi층의 이동이 억제된다. 따라서 기판의 빈 공간을 태우지 못하게 되어 게이트 측벽 아래에 기공이 형성된다.

• 접착 및 계면
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• 제3권4호
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• pp.19-26
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• 2002

고무입자로 강인화된 폴리카보네이트의 강인화 메커니즘을 연구하기 위하여 synchrotron X-선을 이용한 소각 X-선 산란법을 이용하여 실시간으로 변형 과정에서의 폴리카보네이트 내의 micro-void의 생성과 성장과정을 조사하였다. 시료는 직경 $0.3{\mu}m$의 가교화된 아크릴 고무입자로 강인화된 폴리카보네이트이며 wedge test 방식으로 시료에 변형을 가하면서 X-선을 조사하여 산란빔의 세기 변화를 살펴보았다. 변형이 증가함에 따라 산란빔의 세기가 증가하며 이는 폴리카보네이트 매트릭스 내의 micro-void의 생성에 의한 것으로 추정된다. 이러한 micro-void는 폴리카보네이트 매트릭스 내부에 생선된 것으로서 이는 고무입자와 매트릭스간의 계면분리 현상이나 고무입자 내부의 cavitation에 의한 void는 아닌 것으로 추정된다. 이 micro-void는 큰 void들과는 달리 특정한 변형 정도에 이르러 일정한 크기를 갖고 생성되기 시작하며 변형 정도가 증가하여도 그 크기는 증가하지 않고 단지 그 양만이 계속적으로 증가함을 알 수 있다.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2010년도 춘계 학술발표회
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• pp.577-583
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• 2010

In this study, the effect of void formation resulting from gas hydrate dissociation or loss of some particles within soil structure on the strength of soil is examined. Beag-ma river sands with uniform gradation were used to simulate a gas hydrate bearing or washable soil structure. Empty capsules for medicine are used to mimic large voids, which are bigger than soil particle. Beag-ma river sand was miced with 8% cement ratio and 14% water content and compacted into a shear box. The number and direction embedded into a specimen. After 4 hours curing, a series of direct shear test is performed on the capsule embedded cemented sands. Shear strength of cemented sands with capsules depends on the volume and direction. The volume and direction formed by voids are most important factors in strength. A shear strength of a specimen with large voids decreases up to 39% of a specimen without void. The results of this study can be used to predict the strength degradation of gas hydrate bearing sediments after dissociation and loss of fine particles within soil structure.

• 한국재료학회지
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• 제20권12호
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• pp.645-648
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• 2010

The structure and morphology of epitaxial layer defects in epitaxial Si wafers produced by the Czochralski method were studied using focused ion beam (FIB) milling, scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Epitaxial growth was carried out in a horizontal reactor at atmospheric pressure. The p-type Si wafers were loaded into the reactor at about $800^{\circ}C$ and heated to about $1150^{\circ}C$ in $H_2$. An epitaxial layer with a thickness of $4{\mu}m$ was grown at a temperature of 1080-$1100^{\circ}C$. Octahedral void defects, the inner walls of which were covered with a 2-4 nm-thick oxide, were surrounded mainly by $\{111\}$ planes. The formation of octahedral void defects was closely related to the agglomeration of vacancies during the growth process. Cross-sectional TEM observation suggests that the carbon impurities might possibly be related to the formation of oxide defects, considering that some kinds of carbon impurities remain on the Si surface during oxidation. In addition, carbon and oxygen impurities might play a crucial role in the formation of void defects during growth of the epitaxial layer.

• 소성∙가공
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• 제22권8호
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• pp.456-462
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• 2013

Compression tests were conducted at the various temperatures and strain rates to investigate void formation and microstructures behavior of a 1.9wt%C ultrahigh carbon steel used in forged workrolls. The microstructure, grain size and volume fraction of cementite were determined using specimens deformed in the temperature range from 800 to $1150^{\circ}C$ and strain rates from 0.01 to 10/s. It was found from the microstructural analysis that the grain size is larger at higher temperatures and lower strain rate deformation conditions. In addition, a higher volume fraction of cementite was measured at lower temperatures. The brittle blocky cementite was fractured at $800^{\circ}C$ and $900^{\circ}C$ regardless of strain rate. As a result, numerous new micro voids were formed in the fragmented blocky cementite. It was also found that local melting can occur at temperatures of more than $1130^{\circ}C$. Therefore, the forging temperature should be controlled between $900^{\circ}C$ and $1120^{\circ}C$. The temperature rise, which depends on the anvil stroke and velocity, was estimated through cogging simulation to find the appropriate forging temperature and to prevent local melting due to plastic work.

• Composites Research
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• 제16권6호
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• pp.10-15
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• 2003

RTM 공정에 의하여 생성된 제품은 microvoids의 함유량에 의하여 기계적인 물성치에 큰 영향을 받는다. 본 연구에서는 이러한 microvoid의 형성과 이동을 실험적으로 관찰할 수 있는 방법을 제시하였다. Vacuum assisted RTM공정에서 유동선단에서의 microvoid의 형성과 이동을 DV camera로써 관찰을 한 후, 그것에서 void의 함유량을 구하고, 실험에서 얻어진 결과로 microvoid model에 필요만 factor들을 얻어낼 수 있었다. 이렇게 하여 얻어진 결과를 다시 실험적인 결과와 비교함으로써 서로 일치하는 결과를 얻어낼 수 있었다. 이번 연구에서 얻어진 결과를 수학적인 모델에 대입함으로써 VARTM 공정 중 microvoid의 함유량을 예측할 수 있다.