• 한국세라믹학회지
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• 제47권1호
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• pp.8-18
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• 2010

When metal oxides are exposed to chemical potential gradients, ions are driven to diffusive mass transport. During this transport process, the divergence of ionic fluxes offers the formation/annihilation of oxides. Therefore, the divergence of ionic flux may play an important role in the void formation in oxides. Kinetic equations were derived for describing chemical potential distribution, ionic fluxes and their divergence in oxides. The divergence was found to be the measure of void formation. Defect chemistry in scales is directly related to the sign of divergence and gives an indication of the void formation behavior. The quantitative estimation on the void formation was successfully applied to a growing magnetite scale in high temperature oxidation of iron at 823 K.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.284-287
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• 2002

During resin transfer molding(RTM) process, in case of thick parts, resin flow and void formation should be modeled three dimensionally even though for parts of small thickness, resin flow and void formation can be modeled two dimensionally. In this study, numerical simulations of three dimensional mold filling and void formation during RTM process.

• Nuclear Engineering and Technology
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• 제50권7호
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• pp.1190-1197
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• 2018

Analysis of the GRSW-A model coupled into the FALCON code is extended by simulation of central void formation in fuel pellets due to high-temperature fuel restructuring. The extended calculation is verified against published, well-known experimental data. Good agreement with the data for a central void diameter in pellets of the rod irradiated in an Experimental Breeder Reactor is shown. The new calculation methodology is employed in comparative analysis of modern BWR fuel behavior under assumed high-power operation. The initial fuel porosity is shown to have a major effect on the predicted central void diameter during the operation in question. Discernible effects of a central void on peak fuel temperature and Pellet-Cladding Mechanical Interaction (PCMI) during a simulated power ramp are shown. A mitigating effect on PCMI is largely attributed to the additional free volume in the pellets into which the fuel can creep due to internal compressive stresses during a power ramp.

• Transactions on Electrical and Electronic Materials
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• 제2권3호
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• pp.12-17
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• 2001

It is shown in the present study that during the HTS (hot temperature storage) test, the metal contamination by impure elements can be highly susceptible to the void formation, leading to the open failure of the power line in the memory device. Such a functional failure associated with the metal contamination was investigated to be dominant in the early stages of the HTS test while the formation of a stress-driven void is mainly observed in the later stages. In particular, it was found that the void formed in the contaminated metal takes on a slit-like shape which has been known to be characteristic of the stress-related voiding. The impure elements leading to the metal degradation were identified to be carbon and oxygen introduced during the metal sputtering process. The experimental works show that the device reliability was significantly improved by reducing the level of such impure elements within metal. It is shown in the present study that during the HTS (hot temperature storage) test, the metal contamination by impure elements can be highly susceptible to the void formation, leading to the open failure of the power line in the memory device. Such a functional failure associated with the metal contamination was investigated to be dominant in the early stages of the HTS test while the formation of a stress-driven void is mainly observed in the later stages. In particular, it was found that the void formed in the contaminated metal takes on a slit-like shape which has been known to be characteristic of the stress-related voiding. The impure elements leading to the metal degradation were identified to be carbon and oxygen introduced during the metal sputtering process. The experimental works show that the device reliability was significantly improved by reducing the level of such impure elements within metal.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.121-122
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• 2011

• Journal of Welding and Joining
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• 제24권3호
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• pp.42-48
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• 2006

Since the voids occur at the CD stud welds, the mechanism of void formation and void reduction method are investigated in this work. It is speculated that the voids are formed because of high short-circuit current above 1000A. When the simple flow model is used to estimate the void trapping condition, the most voids are trapped at the weld mainly due to fast cooling rate of the CD stud weld. Since it is almost impossible to remove the voids completely, a method is proposed to reduce the void by decreasing the short-circuit current at the end of the arcing time. The experimental results show that the void is reduced by decreasing the short-circuit current to 1000A.

• 대한치과보철학회지
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• 제40권2호
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• pp.140-155
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• 2002

Void-free impression taking is important for the fabrication of accurate dental restorations. One of the essential properties of an impression material used for indirect fabrication of precision castings is the reproduction of the fine detail. The objective in this study was to determine the influence of mixing methods on the number of voids and surface detail reproduction. The number of voids and surface detail reproduction were evaluated with the steteomicroscope $SZ-PT^{(R)}$ and photographed. The results were as follows ; 1. In comparison of the void formation according to mixing methods of all impression materials, mechanical mixing was better than hand mixing and there was significant difference(p<0.05) 2. In comparison of the void formation according to hand mixing of alginate impression materials($TOKUSO\;A-1{\alpha}^{(R)},\;CAVEX\;IMPRESSIONAL^{(R)},\;AROMA \;FINE\;DF\;III^{(R)}$), there was no significant difference among alginate groups. But the number of void was increased in the order of $Panasil^{(R)}\;contact,\;TOKUSO\;A-1{\alpha}^{(R)},\;Permlastic^{(R)}$ light bodied and there was significant difference (p<0.05). 3. In comparison of the void formation according to mechanical mixing of alginate impression materials($TOKUSO\;A-1{\alpha}^{(R)},\;CAVEX\;IMPRESSIONAL^{(R)},\;AROMA FINE\;DF\;III^{(R)}$), there was no significant different among alginate groups. But the number of void was decreased in order of $TOKUSO\;A-1{\alpha}^{(R)},\;Permlastic^{(R)}light\;bodied,\;Panasil^{(R)}$ contact and there was significant difference (p<0.05). 4. In comparison of the surface detail reproduction according to mixing methods of 3 types of impression materials($TOKUSO\;A-1{\alpha}^{(R)},\;Permlastic^{(R)}\;light\;bodied,\;Panasil^{(R)}\;contact$), there was no significant difference between hand mixing and mechanical mixing method 5. The surface detail reproduction was only influenced by impression materials, and produced better in order of $TOKUSO\;A-1{\alpha}^{(R)},\;Panasil^{(R)}\;contact,\;Permlastic^{(R)}$ light bodied. There was significat difference among 3 type of impression materials(p<0.05). From the above results, void formation is influenced by mixing methods and surface detail reproduction is influenced by impression materials than mixing methods. Therefore, to fabricate accurate restorations, proper impression material and mechanical mixing method are more effective and available clinically.

• 한국재료학회지
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• 제12권11호
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• pp.883-888
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• 2002

We investigated the void formation in composite-titanium silicide($TiSi_2$) process. We varied the process conditions of polycrystalline/amorphous silicon substrate, composite $TiSi_2$ deposition temperature, and silicidation annealing temperature. We report that the main reason for void formation is the mass transport flux discrepancy of amorphous silicon substrate and titanium in composite layer. Sheet resistance in composite $TiSi_2$ without patterns is mainly affected by silicidation rapid thermal annealing (RTA) temperature. In addition, sheet resistance does not depend on the void defect density. Sheet resistance with sub-0.5 $\mu\textrm{m}$ patterns increase abnormally above $850^{\circ}C$ due to agglomeration. Our results imply that $sub-750^{\circ}C$ annealing is appropriate for sub 0.5 $\mu\textrm{m}$ composite X$sub-750_2$ process.

• 폴리머
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• 제28권1호
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• pp.35-40
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• 2004

복합재료의 물성에 가장 큰 영향을 미치는 기공 결함의 원인에는 각 공정에 따라 다양하게 나타난다. 본 실험을 통해서 폴리에스터 수지 및 에폭시 수지가 경화될 때 결함으로 작용하여 복합재료의 물성을 저하시키는 기공의 생성원인을 분석하였다. 압력에 의한 영향을 알아보기 위하여 진공 챔버를 제작하였고, 작업 및 환경 상 수지가 노출될 수 있는 분위기에 따른 수지의 열분석을 통하여 경화 시 휘발특성을 분석하였다. 휘발가스 성분분석을 위한 GC/MS 분석 결과 폴리에스터 수지 경화 시 반응성 희석제의 스티렌이 80% 이상 차지하였으며 그밖에 소량의 톨루엔이 검출되었다. 에폭시 수지 경화 시에도 저점도 반응성 희석제인 부틸 글리시딜 에테르가 휘발성분의 90% 이상을 차지하였다. 실험 결과 혼합공정에 의하여 수지 자체적으로 기공 생성 자리를 가지고 있으며 수지에 진공을 가하거나 가열하여 이를 효과적으로 제거할 수 있었다. 여러 공정 중 수지에 함유될 수 있는 수분의 경우 초기 휘발특성이 아세톤보다 컸으며 이밖에 반응성 희석제, 첨가제, 반응가스 등이 수지 경화 시 쉽게 휘발되어 기공 성장의 원인이 됨을 알 수 있었다.

• 한국주거학회논문집
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• 제21권6호
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• pp.131-141
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• 2010

This study is aimed to grasp the spatial characteristics exhibited in the modern housing architecture from the aspect of a geometrical manipulation, which transforms basic geometrical shapes and persue the formative diversity, to identify and verify the various characteristics of spatial structure in modern housing architecture. In this regard, this paper analyze and identify the influences of the void spaces that are created by geometrical manipulations on housing architecture, in terms of morphological and environmental aspects. Theoretical approaches define the concept of geometrical manipulation according to the characteristics of residence and examine the spatial features of void spaces. Additionally, case studies result in the classification of void spaces that are created by geometrical manipulation. Furthermore, to understand environment-friendly characteristics of the void space, the researcher elicited the factors that can affect environment friendly housing from previous studies, and analyzed their correlation between those factors and the void spaces that are classified.