• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.1-9
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• 2011

Understanding the void characterization in the solder joints has become more important because of the application of lead free solder materials and its reliability in electronic packaging technology. According to the JEDEC 217 standard, it describes void types formed in the solder joints, and divides into some categories depending on the void position and formation cause. Based on the previous papers and the standards related to the void, reliability of the BGA solder joints is determined by the size of void, as well as the location of void inside the BGA solder ball. Prior to reflow soldering process, OSP(organic surface preservative) finished Cu electrode was exposed under $85^{\circ}C$/60%RH(relative humidity) for 168 h. Voids induced by the exposure of $85^{\circ}C$/60%RH became larger and bigger with increasing aging times. The void position has more influence on mechanical strength property than the amount of void growth does.

• The Journal of Advanced Prosthodontics
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• v.8 no.2
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• pp.101-109
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• 2016

PURPOSE. To investigate the void parameters within the resin cements used for fiber post cementation by micro-CT (${\mu}CT$) and regional push-out bonding strength. MATERIALS AND METHODS. Twenty-one, single and round shaped roots were enlarged with a low-speed drill following by endodontic treatment. The roots were divided into three groups (n=7) and fiber posts were cemented with Maxcem Elite, Multilink N and Superbond C&B resin cements. Specimens were scanned using ${\mu}CT$ scanner at resolution of $13.7{\mu}m$. The number, area, and volume of voids between dentin and post were evaluated. A method of analysis based on the post segmentation was used, and coronal, middle and apical thirds considered separately. After the ${\mu}CT$ analysis, roots were embedded in epoxy resin and sectioned into 2 mm thick slices (63 sections in total). Push-out testing was performed with universal testing device at 0.5 mm/min cross-head speed. Data were analyzed with Kruskal-Wallis and Mann-Whitney U tests (${\alpha}=.05$). RESULTS. Overall, significant differences between the resin cements and the post level were observed in the void number, area, and volume (P<.05). Super-Bond C&B showed the most void formation ($44.86{\pm}22.71$). Multilink N showed the least void surface ($3.51{\pm}2.24mm^2$) and volume ($0.01{\pm}0.01mm^3$). Regional push-out bond strength of the cements was not different (P>.05). CONCLUSION. ${\mu}CT$ proved to be a powerful non-destructive 3D analysis tool for visualizing the void parameters. Multilink N had the lowest void parameters. When efficiency of all cements was evaluated, direct relationship between the post region and push-out bonding strength was not observed.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.23-27
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• 2017

This paper proposes an approach to predict the reliability of high temperature heaters by identifying their primary failure modes and mechanisms in the field. Test specimens were designed to have the equivalent stress conditions with the high temperature heaters in the field in order to examine the effect of stress conditions on the solder joint failures. There failures often result from cracking due to intermetallic compound (IMC) or void formation within a solder joint. Aging tests have been performed by exposing the test specimens to a temperature of $170^{\circ}C$ in order to reproduce solder joint failures in the field. During the test, changes in IMC formation were investigated by scanning electron microscopy (SEM) on the cross-sections of the test specimens, while changes in void formation were monitored both by resistance spectroscopy and by micro-computed tomography (microCT), alternately. The test results demonstrated the void volume within the solder increased as the time at the high temperature increased. Also, the phase shift of high frequency resistance was found to have high correlation with the void volume. These results implied the failure of high temperature heaters can be non-destructively predicted based on the correlation.

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.246-250
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• 2001

In resin transfer molding (RTM), resin is forced to flow through the fiber perform of inhomogeneous permeability. This inhomogeneity is responsible for the mismatch of resin velocity within and between the fiber tows. The capillary pressure of the fiber tows exacerbates the spatial variation of the resin velocity. The resulting microscopic perturbations of resin velocity at the flow front allow numerous air voids to form. In this study, a mathematical model was developed to predict the formation and migration of micro-voids during resin transfer molding. A transport equation was employed to account for the migration of voids between fiber tows. Incorporating the proposed model into a resin flow simulator, the volumetric content of micro-voids in the preform could be obtained during the simulation of resin impregnation.

• Korean Journal of Crystallography
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• v.12 no.3
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• pp.166-170
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• 2001

Dopants implanted in silicon substrate affect the reaction between cobalt and silicon substrate. Phosphorous, unlike boron and arsenic, suppressing the reaction between cobalt and silicon induces CoSi formation during a low temperature thermal treatment instead of CoSi₂formation. The CoSi layer should move to the silicon substrate to fill the vacant volume that is generated in the silicon substrate due to the silicon out-diffusion into the cobalt/CoSi interface. The movement of CoSi at gate sidewall spacer region is suppressed by a cohesion between gate oxide and CoSi layers, resulting in a void formation at the gate sidewall spacer edge.

• Journal of Adhesion and Interface
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• v.3 no.4
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• pp.19-26
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• 2002

In order to study the toughening mechanism of rubber modified polycarbonate, the sequence of development of micro-voids was investigated by real-time small angle X-ray scattering with Synchrotron radiation (SR-SAXS). The used test method was wedge test. The scattering intensity increases with increasing penetration depth of wedge, i.e. applied strain. The increase is due to the micro-void formation during deformation. This micro-void was uniformly developed in matrix and was different from large-void due to internal cavitation of rubber particle and/or debonding between rubber particle and polycarbonate matrix. The micro-void was developed at the critical strain and the radius of micro-void is around $600{\AA}$. Above the critical strain the size of micro-void remains almost constant with increasing applied strain. However, the population of micro-void increased with applied strain.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.03a
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• pp.577-583
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• 2010

In this study, the effect of void formation resulting from gas hydrate dissociation or loss of some particles within soil structure on the strength of soil is examined. Beag-ma river sands with uniform gradation were used to simulate a gas hydrate bearing or washable soil structure. Empty capsules for medicine are used to mimic large voids, which are bigger than soil particle. Beag-ma river sand was miced with 8% cement ratio and 14% water content and compacted into a shear box. The number and direction embedded into a specimen. After 4 hours curing, a series of direct shear test is performed on the capsule embedded cemented sands. Shear strength of cemented sands with capsules depends on the volume and direction. The volume and direction formed by voids are most important factors in strength. A shear strength of a specimen with large voids decreases up to 39% of a specimen without void. The results of this study can be used to predict the strength degradation of gas hydrate bearing sediments after dissociation and loss of fine particles within soil structure.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.645-648
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• 2010

The structure and morphology of epitaxial layer defects in epitaxial Si wafers produced by the Czochralski method were studied using focused ion beam (FIB) milling, scanning electron microscopy (SEM), and transmission electron microscopy (TEM). Epitaxial growth was carried out in a horizontal reactor at atmospheric pressure. The p-type Si wafers were loaded into the reactor at about $800^{\circ}C$ and heated to about $1150^{\circ}C$ in $H_2$. An epitaxial layer with a thickness of $4{\mu}m$ was grown at a temperature of 1080-$1100^{\circ}C$. Octahedral void defects, the inner walls of which were covered with a 2-4 nm-thick oxide, were surrounded mainly by $\{111\}$ planes. The formation of octahedral void defects was closely related to the agglomeration of vacancies during the growth process. Cross-sectional TEM observation suggests that the carbon impurities might possibly be related to the formation of oxide defects, considering that some kinds of carbon impurities remain on the Si surface during oxidation. In addition, carbon and oxygen impurities might play a crucial role in the formation of void defects during growth of the epitaxial layer.

• Transactions of Materials Processing
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• v.22 no.8
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• pp.456-462
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• 2013

Compression tests were conducted at the various temperatures and strain rates to investigate void formation and microstructures behavior of a 1.9wt%C ultrahigh carbon steel used in forged workrolls. The microstructure, grain size and volume fraction of cementite were determined using specimens deformed in the temperature range from 800 to $1150^{\circ}C$ and strain rates from 0.01 to 10/s. It was found from the microstructural analysis that the grain size is larger at higher temperatures and lower strain rate deformation conditions. In addition, a higher volume fraction of cementite was measured at lower temperatures. The brittle blocky cementite was fractured at $800^{\circ}C$ and $900^{\circ}C$ regardless of strain rate. As a result, numerous new micro voids were formed in the fragmented blocky cementite. It was also found that local melting can occur at temperatures of more than $1130^{\circ}C$. Therefore, the forging temperature should be controlled between $900^{\circ}C$ and $1120^{\circ}C$. The temperature rise, which depends on the anvil stroke and velocity, was estimated through cogging simulation to find the appropriate forging temperature and to prevent local melting due to plastic work.

• Composites Research
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• v.16 no.6
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• pp.10-15
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• 2003

In RTM process, the content of microvoids can be critical due to the fact that the presence of microvoids degrades mechanical properties on the fabricated composite parts. The present paper proposes an experimental method of observation in void formation and transport. VARTM processes are performed under observation with a digital video camera and then the microvoid formation in the flow front and transport are videotaped and observed both in channels and tows. The obtained data are used in the mathematical model in order to determine the model constants. Experimental results and expected results from the mathematical model show a good agreement with each other.