• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.4
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• pp.64-72
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• 1998

This paper a new approach to the design of machine vision technique with a camera modeling that accounts for major sources of geometric distortion, namely, radial, decentering, and thin prism distortion. Radial distortion causes an inward or outward displacement of a given image point from its ideal location. Actual optical systems are subject to various degrees of decentering , that is , the optical centers of lens design and manufacturing as well as camera assembly. It is our propose to develop the vision system for the pattern recognition and the automatic test of parts and to apply the line of manufacturing. The performance of proposed vision system is illustrated by simulation and experiment.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.4
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• pp.202-209
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• 2004

Quality control is essential to the final product in BGA-type PCB fabrication. So, many automatic vision systems have been developed to achieve speedy, low cost and high quality inspection. A multiple threshold selection algorithm is a very important technique for machine vision based inspection. In this paper, an inspected image is modeled by using fuzzy sets and then the parameters of specified membership functions are estimated to be in maximum fuzzy entropy with the probability of the fuzzy sets, using the exhausted search method. Fuzzy c-partitions with the estimated parameters are automatically generated, and then multiple thresholds are selected as the crossover points of the fuzzy sets that form the estimated fuzzy partitions. Several experiments related to flip chip BGA images show that the proposed algorithm outperforms previous ones using both entropy and variance, and also can be successfully applied to AVI systems.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.423-424
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• 2011

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.2
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• pp.212-218
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• 2012

A stereo vision is able to build three-dimensional maps of its environment. It can provide much more complete information than a 2D image based vision but has to process, at least, that much more data. In the past decade, real-time stereo has become a reality. Some solutions are based on reconfigurable hardware and others rely on specialized hardware. However, they are designed for their own specific applications and are difficult to extend their functionalities. This paper describes a vision system based on a System on a Chip (SoC) platform. A real-time stereo image correlator is implemented using Sum of Absolute Difference (SAD) algorithm and is integrated into the vision system using AMBA bus protocol. Since the system is designed on a pre-verified platform it can be easily extended in its functionality increasing design productivity. Simulation results show that the vision system is suitable for various real-time applications.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.153-154
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• 2006

Development of sorting machine for photo diode and its control system is addressed. The sorting machine for optical communication device requires high positional precision because the alignment is one of the most important point in the sorting process. This sorting method describes how to detect the target chip's angle and position from the wafer. The machine vision system is used for the feedback control. This sorting machine is implemented by motion controller, machine vision and various solenoid valve and is interfaced with RS-232c, GPIB and PCI communication. This system gets the position accuracy within $1{\mu}m$ with our experiments.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.1316-1319
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• 1996

This paper proposes the algorithm for the correction of a position and orientation of small object such as chip in the precise construction process. In the past, it is general to correct position and orientation of object using human sight and simple vision sensors. But recently, researches using image processing devices have been studied to improve the corrective precision of a position and orientation of object. In this piper, maximum-axis moment and p-theta algorithm are used to correct the position and orientation. Algorithm of maximum-axis moment is widely applied to hetero-object except being applied to a perfect rectangle. This is reason that moments of the X and Y-axis are equal. Therefore, being the shape of a perfect rectangle, the object is applied to other algorithm. In the light of time problem, real-time control is as important as correction of object. To solve it, we use the DSP(Digital Signal Processing) which is far more fast than PC.

• 제어로봇시스템학회:학술대회논문집
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• 1991.10a
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• pp.292-298
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• 1991

A new 6-axis robot controller with a high-speed 32-bit floating-point DSP TMS32OC30 has been developed in Samsung Electronics. The controller composed of Intel 80386 microprocessor for the main controller, and TKS32OC30 DSP chip for joint position controller. The characteristics of the controller are high sampling rate of 200us and fast reponsibility. The main controller supports MS-DOS, kinematics, trajectory planning, and sensor fusion functions which are vision, PLC, and MAP. The one high speed DSP chip is used for controlling 6 axes of a robot in 200us simultaneously. The control law applied is PID controller including a velocity feedforvard in joint position controller. The performance tests, such as command following, CP, were conducted for the controller integrated with a 6 axes robot developed in Samsung Electronics. The results showed a good performance. This controller can also perform the system control with other controllers, the communication with high priority controllers, and visual information processing.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.9 s.174
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• pp.99-106
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• 2005

In recent years, vision sensors are widely used to mobile robot for navigation or exploration. The analog signal transmission of visual data being used in this area, however, has some disadvantages including noise weakness in view of the data storage. A large amount of data also makes it difficult to use this method for a mobile robot. In this paper, a digital data compressing technology based on MPEG4 which substitutes for analog technology is proposed to overcome the disadvantages by using DWT(Discreate Wavelet Transform) instead of DCT(Discreate Cosine Transform). The TI Company's DSP chip, TMS320C6711, is used for the image encoder, and the performance of the proposed method is evaluated by PSNR(Peake Signal to Noise Rates), QP(Quantization Parameter) and bitrate.

• Journal of Broadcast Engineering
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• v.20 no.6
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• pp.963-966
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• 2015

This paper introduces a programmable multi-format video decoder(MFD) to support HEVC(High Efficiency Video Coding) standard and for other video coding standards. The goal of the proposed MFD is the high-end FHD(Full High Definition) video decoder needed for a DTV(Digital Tele-Vision) SoC(System on Chip). The proposed platform consists of a hybrid architecture that is comprised of reconfigurable processors and flexible hardware accelerators to support the massive computational load and various kinds of video coding standards. The experimental results show that the proposed architecture is operating at a 300MHz clock that is capable of decoding HEVC bit-stream of FHD 30 frames per second.