• ETRI Journal
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• v.29 no.1
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• pp.59-69
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• 2007

We designed and fabricated a vision chip for edge detection with a $160{\times}120$ pixel array by using 0.35 ${\mu}m$ standard complementary metal-oxide-semiconductor (CMOS) technology. The designed vision chip is based on a retinal structure with a resistive network to improve the speed of operation. To improve the quality of final edge images, we applied a saturating resistive circuit to the resistive network. The light-adaptation mechanism of the edge detection circuit was quantitatively analyzed using a simple model of the saturating resistive element. To verify improvement, we compared the simulation results of the proposed circuit to the results of previous circuits.

• Journal of Sensor Science and Technology
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• v.18 no.3
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• pp.190-196
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• 2009

In a conventional camera system, a target tracking system consists of a camera part and a image processing part. However, in the field of the real time image processing, the vision chip for edge detection which was made by imitating the algorithm of humanis retina is superior to the conventional digital image processing systems because the human retina uses the parallel information processing method. In this paper, we present a high speed target tracking system using the function of the CMOS vision chip for edge detection.

• Journal of Sensor Science and Technology
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• v.12 no.6
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• pp.231-240
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• 2003

The problem of power consumption and the limitation of a chip area should be considered when the pixel number of the edge detection circuit increases to fabricate a vision chip for edge detection with high resolution. The numeric increment of the unit circuit causes power consumption to increase and require a larger chip area. An increment of power consumption and a limitation of chip area with several ten milli-meters square supplied by the CMOS foundry company restrict the pixel numbers of the edge detection circuit. In this paper, we proposed a electronic switch to minimize the power consumption owing to the numeric increment of the edge detection circuit to realize a vision chip for edge detection with high resolution. We also applied a method by which photodetector and edge detection circuit are separated to implement a vision chip with a higher resolution. The photodetector circuit with $128{\times}128$ pixels uses a common edge detection circuit with $1{\times}128$ pixels so that resolution was improved at the same chip area. The chip size is $4mm{\times}4mm$ and the power consumption was confirmed to be about 20mW using SPICE.

• Journal of Sensor Science and Technology
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• v.12 no.2
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• pp.57-65
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• 2003

When a vision chip for edge detection using CMOS process is designed, there is a necessity to implement local light adaptive-function for detecting distinctive features of an image at a wide range of light intensities. Local light adaptation is to achive the almost same output level by changing the size of receptive-fields of the local horizontal cell layers according to input light intensities, based on the lateral inhibitive-function of the horizontal cell. Thus, the almost same output level can be obtained whether input light intensities are much or less larger than background. In this paper, the horizontal cells using a resistive network which consists of p-MOSFETs were modeled and analyzed, and the local light adaptive-mechanism of the designed vision chip using the resistive network was verified.

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.836-841
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• 2004

This paper describes ASIC design for brightness revision control, A LED Pixel Matrix (LPM) design and LPM in natural color LED vision. A designed chip has 256 levels of gradation correspond to each Red, Green, Blue LED pixel respectively, which have received 8bit image data. In order to maintain color uniformity by reducing the original rank error of LED, we adjusted the specific character value 'a' and brightness revision value 'b' to pixel unit, module unit and LED vision respectively by brightness characteristic function with 'Y=aX+b'. In this paper, if designed custom chip and brightness revision control method are applied to manufacturing of natural color LED vision, we can obtain good quality of image. Furthermore, it may decrease the cost for manufacturing LED vision or installing the plants.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.6 no.3
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• pp.24-30
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• 2007

The FPCs(Flexible Printed Circuit) are currently used in several electronic products like digital cameras, cellular phones because of flexible material characteristics. Because the FPC is usually small size and flexible, only one FPC should not enter chip mounting process, instead, several FPCs are placed on the large rigid pallette and enter into the chip mounting process. Currently the job of mounting FPC on the pallette is carried by totally manual way. Thus, the goals of the research is develop the automatic machine of FPC mounting on pallette using vision alignment. Instead of using two cameras or using moving one camera, the proposed vision system with only one fixed camera is adopted. Moreover, the two picker heads which can handle two FPCs simultaneously are used to make process time shortened. The procedure of operation is firstly to measure alignment error of FPC, correct alignment errors, and finally mount well-aligned FPC on the pallette. The vision technology is used to measure alignment error accurately, and precision motion control is used in correcting errors and mounting FPC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.661-665
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• 2000

In this study, the control of mounting system for MLGA package was developed using machine vision for the control of rotating position compensation and mounting position of X-Y table. Two type of material (polymer, alumina )were used for the dielectric insulator of the MLGA. And the illumination system and the algorithm of position compensation that be suitable for these materials was developed. Also, the position control order that compensated by machine vision actuated to micro stepping motor and X-Y servo motor by controlled PC and mounted the MLGA on PCB in resolution to$\pm10\mum$ .

• Journal of the Korean Society for Precision Engineering
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• v.18 no.11
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• pp.161-167
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• 2001

In this study, the control of mounting system for MLGA package was developed using machine vision for the control of rotation position compensation and mounting position of X-Y table. Two types of materials, polymer and alumina, were used for the dielectric insulator of the MLGA. The illumination system and the algorithm of position compensation which is suitable for these materials was developed. We found that the mounting accuracy enough to the degree of${\pm}10{\mu}m$ when MLGA was mounted on the PCB.

• Proceedings of the Korean Society for Bioinformatics Conference
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• 2001.10a
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• pp.151-163
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• 2001

- Overview of Bioinformatics and vision of Samsung SDS on it - Overview of Bio Chip and its market - Product roadmap with "Expert system for DNA chip data " - "UniBIO "as an integrated package of DNA chip data analysis - Demo of UniBIO

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.5
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• pp.2113-2120
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• 2013

In this study, an efficient machine vision based inspection system is developed for the in-line measurement of phosphor resin dispensing shapes on LED chip package. Since the phosphor resin (target material) has semitransparent characteristics, illuminated light beam is reflected from the bottom of the chip as well as from the surface. Since such phenomenon can deteriorate inspection reliability, a white LED and a 635nm laser slit beams are experimentally tested to decide suitable illumination optics. Also, specular and diffuse reflection methods are tested to decide suitable optical triangulation. As a result, it can be known that the combination of a white slit beam source and specular reflection method show the best inspection results. The Catmull-Rom spline interpolation is applied to the obtained data to form smoother surface. From the results, it can be conclude that the developed system can be sucessfully applied to the in-line inspection of LED chip packaging process.