• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.79-83
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• 2012

신뢰성이 우수하며, 소형화가 가능하고, 우수한 열전도도의 은 전극을 이용할 수 있는 LTCC (Low temperature co-fired ceramic) 패키징은 환경 및 열에 약한 플라스틱 패키징을 대체할 것으로 기대받고 있다. 현재 LTCC 패키징의 원료 분말로는 주로 $Al_2O_3$을 사용하는데, 본 연구에서는 $Al_2O_3$보다 열전도도가 2배 우수한 ZnO을 일부 첨가 또는 대체한 조성 변화를 통하여 패키징의 열 특성 변화에 대해 연구하였다. 소량의 ZnO를 첨가하여 열전도도가 최대 25%까지 상승하는 결과가 나타났으며, 이 결과로 LED 수명이 증가할 것으로 예상된다. ANSYS 시뮬레이션 결과 열 유속의 값이 ZnO가 첨가된 경우 최대 56% 증가함을 확인할 수 있었다. 실제 LED 패키징을 제작하여 측정한 결과도 ZnO를 첨가한 LTCC 패키징은 $Al_2O_3$로만 이루어진 패키징보다 열저항이 최대 14.9% 감소하였다.

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2002년도 춘계학술대회
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• pp.193-197
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• 2002

The certification of software products can provide a greater level of acceptance and feeling of security to customers of these products. This paper presents a certification method for the quality of package software. First of all, the evaluation criteria are derived from IS0/1EC 9126 and 12119 standards, and then the evaluation module are designed considering the measurement scale type. The results can be applied to construct the certification scheme of software product quality for the commercial purpose.

• 한국석유지질학회지
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• 제6권1_2
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• pp.1-7
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• 1998

울릉분지 남서연변부의 다중채널 탄성파단면도를 이용하여 중기에서 말기 마이오세동안의 시퀀스 층서분석을 정밀 분석 하였다. 해퇴층서는 오랜 융기되고 변형된 하부층을 기저로 한 해침층서 위에 발달하였다. 뚜렷한 응축층이 해침과 해퇴층서사이를 구분 짓는다. 해침층서는 하부의 융기되고 변형된 지층위로 상향걸침한다. 해퇴층서는 구분 가능한 저해수준, 고해수준, 그리고 해침 체계역으로 구성된 여섯 개의 전진형 퇴적 시퀀스를 포함한다. 대부분의 퇴적 시퀀스는 분지선상지, 사면선상지, 그리고 전진복합체로 이루어진 저해수준 체계역이다. 잠재적인 석유 저류층은 분지선상지의 사암, 사면 선상지의 해저수로 충진 사암과 오버뱅크의 사암, 그리고 대륙붕지역의 침식곡 충진 사암들이다. 또한 해침퇴적층서내 천해사암층도 유망하다. 성공적인 탐사활동을 위해 연구 주변지역에 대한 정밀 시퀀스 층서분석, 탄성파 자료의 재처리, 그리고 3-D탄성파 탐사의 실시를 제안한다.

• 한국IT서비스학회지
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• 제20권2호
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• pp.57-76
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• 2021

Today's ERP system has become a core system of IT·SW that not only supports and manages enterprise resources efficiently, but also encompasses major business tasks. In other words, the ERP system is an essential strategic element for the survival of a company as a powerful means to innovate the management of an organization. This study analyzed the impact on the utilization of IT·SW from the perspective of the entire organization's process without limiting the performance evaluation of the ERP system itself, which is a core system of a company. The measurement data for evaluating the performance of the ERP system was the 2018 domestic company IT·SW utilization survey result report (subject to survey : 3,017 domestic companies with 10 or more employees). Based on this data, this study analyzed the impact of the ERP system on the entire enterprise's IT·SW utilization. In particular, attention was paid to whether there would be a difference in the use of IT·SW if the type of ERP system introduction was changed through the improvement of the business process of the company. Multiple regression analysis was performed using the statistical package SPSS 25. As a result, among the ERP system introduction types, the greatest degree of (+)influence on the company's IT·SW utilization is when the ERP package SW or ASP service is used as it is. Although the difference is insignificant, the second case was to build an ERP system through self-development or outsourcing, followed by customizing the package SW or system through self-development or outsourcing. Through the results of this study, it is expected that the organization will improve the business process and use the standard ERP package SW as it is without modification, thereby effectively enhancing the use of IT·SW of the company and leading to management performance.

• 조명전기설비학회논문지
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• 제29권4호
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• pp.1-10
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• 2015

The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Journal of Welding and Joining
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• 제18권2호
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)

• Journal of Welding and Joining
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• 제18권2호
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• pp.95-99
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB banking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB banking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate.

• 한국전산구조공학회논문집
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• 제14권2호
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• pp.143-150
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• 2001

원자력발전소의 1차 계통에서 오염된 장비들을 취급이 용이하고 안전하게 운반하기 위한 운반용기는 내부의 방사성 물질에 대한 방사능 평가에 의하여 방사성물질 A형 운반용기로 분류된다. 방사성물질 A형 운반용기는 IAEA Safety Standard Series No. ST-1 및 국내 원자력법 등 관련규정의 기술기준을 만족하여야 하는데, 운반용기는 중량에 따라 0.3∼1.2m의 높이에서 소성이 일어나지 않는 단단한 바닥면으로 가장 심각한 손상을 주는 방향으로 낙하시키는 정상운반조건(normal transport conditions)에 대하여 구조적 건전성을 유지하여야 한다. 여기서는 ABAQUS/Explicit 코드를 이용하여 컨테이너형태의 A형 운반용기에 대하여 최대손상이 야기되는 0.9m 경사낙하조건에 대한 3차원 충격해석을 수행하고 구조적 건전성을 평가하였는데, 운반용기는 경사낙하시 코너피팅(corner fitting)의 분쇄(crush)에 의하여 대부분의 충격을 흡수하였으며 운반용기의 격납경계는 구조적 건전성을 유지하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.72-75
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• 2009

In this paper, we have designed a novel lens for LED's package that can expend the radiation angle of LED from $120^{\circ}$ to $170^{\circ}$ successfully. At the same brightness and uniformity condition of 37" LED BLU system, using novel lens LED package can be reduced amounts of LED 40% or thickness of BLU 30% respectively. Besides, the power consumption of BLU also can be reduced 25%.