• Title/Summary/Keyword: two-chip technology

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Study on the Machinability of Pinus densiflora at Chunyang District for Wood Patterns - Effect of Chip-Tool Contact Stress Distribution in Workpiece During of Wood Machining - (목형용(木型用) 춘양목(春陽木)의 절삭가공(切削加工) 특성(特性)에 관(關)한 연구(硏究)(제1보(第1報)) - 절삭중(切削中) 공구면(工具面)의 응력분포에 미치는 접촉(接觸)칩의 영향(影響) -)

  • Kim, Jeong-Du
    • Journal of the Korean Wood Science and Technology
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    • v.16 no.4
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    • pp.54-60
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    • 1988
  • Machinabilities means inherent properties of pinus densiflora at Chunyang district to be CNC machined easily or not, and processing abilities of the tool and machine together. This explanation signifies that machinabilities have two phases of signification, depended on considering and stress either materials or tools preferentially. This paper discuss machinabilities, the following items are usually employed as the indices of stress distribution at the cutting tool rake face. The stress distributions on the chip - tool contact surface at the early stage of the chip forming and under the stage of fringe pattern in wood cutting were analyzed the photoelastic method. The tool used in the present experiment was the special cutting tool H.S.S. one made in laboratory. And isochromatic fringe pattern and isolinic line of work piece by chip-behavior during the cutting operation were photographed with the feed camera continuously. The effects on the stress, distribution on the rake face of the epoxy tool and the strain distribution in the work piece of wood plate by chip behavior are cleared in pre cent experiment.

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Prediction of Serrated Chip Formation due to Micro Shear Band in Metal (미소 전단 띠 형성에 의한 톱니형 칩 생성 예측)

  • 임성한;오수익
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.427-733
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    • 2003
  • Adiabatic shear bands have been observed in the serrated chip during high strain rate metal cutting process of medium carbon steel and titanium alloy. The recent microscopic observations have shown that dynamic recrystallization occurs in the narrow adiabatic shear bands. However the conventional flow stress models such as the Zerilli-Armstrong model and the Johnson-Cook model, in general, do not predict the occurrence of dynamic recrystallization (DRX) in the shear bands and the thermal softening effects accompanied by DRX. In the present study, a strain hardening and thermal softening model is proposed to predict the adiabatic shear localized chip formation. The finite element analysis (FEA) with this proposed flow stress model shows that the temperature of the shear band during cutting process rises above 0.5T$\sub$m/. The simulation shows that temperature rises to initiate dynamic recrystallization, dynamic recrystallization lowers the flow stress, and that adiabatic shear localized band and the serrated chip are formed. FEA is also used to predict and compare chip formations of two flow stress models in orthogonal metal cutting with AISI 1045. The predictions of the FEA agreed well with the experimental measurements.

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Integration of Current-mode VSFD with Multi-valued Weighting Function

  • Go, H.M.;Takayama, J.;Ohyama, S.;Kobayashi, A.
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.921-926
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    • 2003
  • This paper describes a new type of the spatial filter detector (SFD) with variable and multi-valued weighting function. This SFD called variable spatial filter detector with multi-valued weighting function (VSFDwMWF) uses current-mode circuits for noise resistance and high-resolution weighting values. Total weighting values consist of 7bit, 6-signal bit and 1-sign bit. We fabricate VSFDwMWF chip using Rohm 0.35${\mu}$m CMOS process. VSFDwMWF chip includes two-dimensional 10${\times}$13 photodiode array and current-mode weighting control circuit. Simulation shows the weighting values are varied and multi-valued by external switching operation. The layout of VSFDwMWF chip is shown.

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Design and fabrication of condenser microphone with rigid backplate and vertical acoustic holes using DRIE and wafer bonding technology (기판접합기술을 이용한 두꺼운 백플레이트와 수직음향구멍을 갖는 정전용량형 마이크로폰의 설계와 제작)

  • Kwon, Hyu-Sang;Lee, Kwang-Cheol
    • Journal of Sensor Science and Technology
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    • v.16 no.1
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    • pp.62-67
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    • 2007
  • This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. The MEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn) eutectic solder bonding. The membrane chip has 2.5 mm${\times}$2.5 mm, $0.5{\mu}m$ thick low stress silicon nitride membrane, 2 mm${\times}$2 mm Au/Ni/Cr membrane electrode, and $3{\mu}m$ thick Au/Sn layer. The backplate chip has 2 mm${\times}$2 mm, $150{\mu}m$ thick single crystal silicon rigid backplate, 1.8 mm${\times}$1.8 mm backplate electrode, and air gap, which is fabricated by bulk micromachining and silicon deep reactive ion etching. Slots and $50-60{\mu}m$ radius circular acoustic holes to reduce air damping are also formed in the backplate chip. The fabricated microphone sensitivity is $39.8{\mu}V/Pa$ (-88 dB re. 1 V/Pa) at 1 kHz and 28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.

Bonding Technologies for Chip to Textile Interconnection (칩-섬유 배선을 위한 본딩 기술)

  • Kang, Min-gyu;Kim, Sungdong
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.4
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    • pp.1-10
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    • 2020
  • This paper reviews the recent development of electronic textile technology, mainly focusing on chip-textile bonding. Before the chip-textile bonding, a circuit on the textile should be prepared to supply the electrical power and signal to the chip mounted on the fabrics. Either embroidery with conductive yarn or screen-printing with the conductive paste can be applied to implement the circuit on the fabrics depending on the circuit density and resolution. Next, chip-textile bonding can be performed. There are two choices for chip-textile bonding: fixed connection methods such as soldering, ACF/NCA, embroidery, crimping, and secondly removable connection methods like a hook, magnet, zipper. Following the chip-textile bonding process, the chip on the textile is generally encapsulated using PDMS to ensure reliability like water-proof.

Design and Fabrication of Mold Insert for Injection Molding of Microfluidic tab-on-a-chip for Detection of Agglutination (응집반응 검출을 위한 미세 유체 Lab on a chip의 사출성형 금형 인서트의 디자인 및 제작)

  • Choi, Sung-Hwan;Kim, Dong-Sung;Kwon, Tai-Hun
    • Transactions of Materials Processing
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    • v.15 no.9 s.90
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    • pp.667-672
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    • 2006
  • Agglutination is one of the most commonly employed reactions in clinical diagnosis. In this paper, we have designed and fabricated nickel mold insert for injection molding of a microfluidic lab-on-a-chip for the purpose of the efficient detection of agglutination. In the presented microfluidic lab-on-a-chip, two inlets for sample blood and reagent, flow guiding microchannels, improved serpentine laminating micromixer(ISLM) and reaction microwells are fully integrated. The ISLM, recently developed by our group, can highly improve mixing of the sample blood and reagent in the microchannel, thereby enhancing reaction of agglutinogens and agglutinins. The reaction microwell was designed to contain large volume of about $25{\mu}l$ of the mixture of sample blood and reagent. The result of agglutination in the reaction microwell could be determined by means of the level of the light transmission. To achieve the cost-effectiveness, the microfluidic lab-on-a-chip was realized by the injection molding of COC(cyclic olefin copolymer) and thermal bonding of two injection molded COC substrates. To define microfeatures in the microfluidic lab-on-a-chip precisely, the nickel mold inserts of lab-on-a-chip for the injection molding were fabricated by combining the UV photolithography with a negative photoresist SU-8 and the nickel electroplating process. The microfluidic lab-on-a-chip developed in this study could be applied to various clinical diagnosis based on agglutination.

Voltage-Mode 1.5 Gbps Interface Circuits for Chip-to-Chip Communication

  • Lee, Kwang-Jin;Kim, Tae-Hyoung;Cho, Uk-Rae;Byun, Hyun-Geun;Kim, Su-Ki
    • ETRI Journal
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    • v.27 no.1
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    • pp.81-88
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    • 2005
  • In this paper, interface circuits that are suitable for point-to-point interconnection with an over 1 Gbps data rate per pin are proposed. To achieve a successful data transfer rate of multi-gigabits per-second between two chips with a point-to-point interconnection, the input receiver uses an on-chip parallel terminator of the pass gate style, while the output driver uses the pullup and pulldown transistors of the diode-connected style. In addition, the novel dynamic voltage level converter (DVLC) has solved such problems as the access time increase and valid data window reduction. These schemes were adopted on a 64 Mb DDR SRAM with a 1.5 Gbps data rate per pin and fabricated using a 0.10 ${\mu}m$ dual gate oxide CMOS technology.

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Feasibility of Copper Powder Fabrication by Ball Milling of Copper Chip Scrap Occurred During Cutting Process of Copper Pipe (구리 관(管)의 절단(切斷) 공정(工程)중 발생한 구리칩 스크랩의 볼밀링에 의한 구리 분말(粉末) 제조(製造) 가능성(可能性))

  • Hong, Seong-Hyeon
    • Resources Recycling
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    • v.20 no.6
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    • pp.37-42
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    • 2011
  • Copper chip scrape has been occurred by cutting of copper pipe. The feasibility of copper chip scrape into the copper powder by milling was studied. Two milling type such as rod milling and horizontal balling milling were applied in this research. Copper chip can not fragmented into powder by using rod milling. In contrast to rod milling, copper chip can be changed into powder by horizontal ball milling for above 36 hours. It was found that recycling of copper chip scraps into copper powder by horizontal ball milling is possible and powder fraction percent ($75{\sim}150{\mu}m$) of milled copper chip for 48 hours is 25.3%.

Fabrication of $TiH_2$ Powders from Titanium Tuning Chip by Mechanical Milling

  • Jang, Jin-Man;Lee, Won-Sik;Ko, Se-Hyun
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.969-970
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    • 2006
  • In present work, manufacturing technologies of titanium hydride powder were studied for recycling of titanium tuning chip and for this, attrition ball milling was carried out under $H_2$ pressure of 0.5 MPa. Ti chips were completely transformed into $TiH_2$ within several hundred seconds. Dehydrogenation process $TiH_2$ powders is consist of two reactions: one is reaction of $TiH_2$ to $TiH_x$ and the other decomposition of $TiH_x$ to Ti and $H_2$. The former reaction shows relatively low activation energy and it is suggested that the reaction is caused by introduction of defects due to milling.

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Diagnostic Paper Chip for Reliable Quantitative Detection of Albumin using Retention Factor (체류 인자를 이용한, 알부민의 정량 분석용 종이 칩)

  • Jeong, Seong-Geun;Lee, Sang-Ho;Lee, Chang-Soo
    • KSBB Journal
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    • v.28 no.4
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    • pp.254-259
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    • 2013
  • Herein we present a diagnostic paper chip that can quantitatively detect albumin without external electronic reader and dispensing apparatus. We fabricated a diagnostic paper chip device by printing wax barrier on the paper and wicking it with citrate buffer and tetrabromophenol blue to detect albumin in sample solution. The paper chip is so simple that we dropped a sample solution at sample pad and measure the ratio of two travel distances of the sample solvent and albumin under the name of retention factor. Our result confirmed that the retention factor was constant in the samples with same concentration of albumin and useful determinant for the measurement of albumin concentration. The paper chip is affordable and equipment-free, and close to ideal point-of-care test in accordance with the assured criteria, outlined by the World Health Organization. We assume that this diagnostic paper chip will expand the concept of colorimetric determination and provide a inexpensive diagnostic method to aging society and developing country.