• Journal of the Korean institute of surface engineering
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• v.38 no.1
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• pp.28-36
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• 2005

In this study, the reflow characteristics of copper thin films which is expected to be used as interconnection materials in the next generation semiconductor devices were investigated. Cu thin films were deposited on the TaN diffusion barrier by metal organic chemical vapor deposition (MOCVD) and annealed at the temperature between 250℃ and 550℃ in various ambient gases. When the Cu thin films were annealed in the hydrogen ambience compared with oxygen ambience, sheet resistance of Cu thin films decreased and the breakdown of TaN diffusion barrier was not occurred and a stable Cu/TaN/Si structure was formed at the annealing temperature of 450℃. In addition, reflow properties of Cu thin films could be enhanced in H₂ ambient. With Cu reflow process, we could fill the trench patterns of 0.16～0.24 11m with aspect ratio of 4.17～6.25 at the annealing temperature of 450℃ in hydrogen ambience. It is expected that Cu reflow process will be applied to fill the deep pattern with ultra fine structure in metallization.

• Fashion & Textile Research Journal
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• v.4 no.2
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• pp.176-187
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• 2002

The aim of this research is to establish basic materials for fashion merchandising by observing the street fashion of the juveniles and by analyzing their wearing, coordination and fashion trend. We have taken the photograph of the street fashion of 202 male teenagers and 265 female teenagers in Busan, and analyzed in the category of style, item, color, pattern, materials, hair style, shoes and accessories. We have concluded that the most frequent items were shirts (male), turtle neck (female) and jeans. The main style was casual just as jumper-look, sweater-look, gardigan-look. The typical female fashions that were hip-hop-look, twin neat-look, trench coat-look, were more various than male. For the color coordination, contrast color coordination was more dominant than similarity color coordination. Dominant patterns were solid, and also check and stripe patterns were frequently found in upper garment. The representative materials were soft for upper garment, and hard for trousers. Male teenagers prefer middle-length hair style and female teenagers prefer long hair style. The juveniles in Busan are wearing sports shoes and leather shoes in similar frequency. Their favorite accessories are bag, muffler and hat.

• Journal of the Semiconductor & Display Technology
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• v.9 no.4
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• pp.13-18
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• 2010

Extreme ultraviolet (EUV) lithography using 13.5 nm wavelengths is expected to be adopted as a mass production technology for 32 nm half pitch and below. One of the new issues introduced by EUV lithography is the shadowing effect. Mask shadowing is a unique phenomenon caused by using mirror-based mask with an oblique incident angle of light. This results in a horizontal-vertical (H-V) biasing effect and ellipticity in the contact hole pattern. To minimize the shadowing effect, a refilled mask is an available option. The concept of refilled mask structure can be implemented by partial etching into the multilayer and then refilling the trench with an absorber material. The simulations were carried out to confirm the possibility of application of refilled mask in 32 nm line-and-space pattern under the condition of preproduction tool. The effect of sidewall angle in refilled mask is evaluated on image contrast and critical dimension (CD) on the wafer. We also simulated the effect of refilled absorber thickness on aerial image, H-V CD bias, and overlapping process window. Finally, we concluded that the refilled absorber thickness for minimizing shadowing effect should be thinner than etched depth.

• Transactions of the Society of Information Storage Systems
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• v.3 no.3
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• pp.144-148
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• 2007

In this paper, we analyzed the effect of the pattern height on the readback signal characteristics of the magnetic nanopillar tops and trench bottoms. In addition, we discuss the applicability of the present method to the production of patterned magnetic media, which can be obtained by depositing magnetic thin films on the molded nanopillars with passive heating. We found that the individual magnetic island deposited on each molded nanopillars with passive heating is a single magnetic domain and confirmed that its magnetization can be successfully reversed by applying an external magnetic field.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.93-94
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• 2005

Cu metallization using electrochemical plating(ECP) has played an important role in back end of line(BEOL) interconnect formation. In this work, we studied the optimized copper thickness using Bottom-up Gap-fill in Cu ECP, which is closely related with the pattern dependencies in Cu ECP and Cu dual damascene process at 0.13 ${\mu}m$ technology node. In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge, Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness.

• Journal of the Korean Geophysical Society
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• v.9 no.3
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• pp.249-262
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• 2006

The 29 May 2004 offshore Uljin, Korea earthquake was predominantly thrust-faulting at a depth of approximately 12 (±2) km. The mainshock attained the seismic moment of M0 =5.41 (±1.87)  1016 N m (Mw = 5.1). The focal mechanism indicates a subhorizontal P-axis trending 264° and plunging 2°. The orientation of P- and T-axis is consistent with the direction of absolute plate motion generally observed within the plates, hence the cause of the May 29 shock is the broad-scale stress pattern from the forces acting on the downgoing slab along the Japan trench and inhibiting forces balancing it. The 29 May 2004 earthquake occurred along a deep seated (~12 km), pre-existing feature that is expressed on the surface as the basement escarpment along the western and southern slopes of the Ulleung basin. The concentrated seismicity along this basement escarpment suggests that this feature may qualify as a seismic zone - the Ulleung basement escarpment seismic zone (UBESZ).

• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.9 no.1
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• pp.1-12
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• 2004

Sedimentary facies and high-resolution echo facies were analyzed to elucidate sedimentation pattern of the late Quaternary glacial-marine deposits in the northern continental margin of the South Shetland Islands. Six sedimentary facies are classified, based on grain texture and sedimentary structures in gravity cores. The high-resolution (3.5 ㎑) echo characters are classified into 6 echo facies on the basis of clarity, continuity, and shape of bottom and subbottom echoes together with seafloor topography. Distribution of the echo and sedimentary facies suggest that there was a significant change in sedimentation pattern between the Last Glacial Maximum (LGM) and subsequent glacier-retreating period. When the grounded glaciers extended to the present shelfbreak during LGM, coarse-grained subglacial tills were widespread in the shelf area, and deep troughs in the shelf were carved beneath the fast-flowing ice steam. As the glacial margin retreated landward after LGM, dense meltwater plumes released from the retreating ice-front were funneled along the glacier-carved troughs, and accumulated channel- or cannyon-fill deposits in the shelf and the upper to mid slope. At that time, slope sediments seem to have been reworked by slope failures and unsteady contour currents, and further transported by fine-grained turbidity currents along the South Shetland Trench. After the glacial retreat, sediments in the shelf and slope areas have been mainly introduced by persistent (hemi) pelagic settling, and fine-grained turbidity currents frequently occur along the axis of the South Shetland Trench.

• The Research Journal of the Costume Culture
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• v.24 no.3
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• pp.349-357
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• 2016

As a solemn and serious uniform, military uniform can be differentiated easily from any other clothing in the aspects of color, material and style. Inspired by military uniform, fashion designers have been applying military uniform elements into modern fashion design in recent years, which helps to bring military uniform from the trench onto international fashion runway. The primary method of this research is theory analysis method and exampling study method. Based on the collected materials of modern military uniform, this paper takes the fashion and cultural study theory of the famous American scholar Susan B. Kaiser as the leading theory to analyze four subject positions embodied in military uniform, including nation, rank, gender and time and space. By analyzing the subject positions embodied in military uniform, it shows the rich cultural connotation of military uniform and the function of various small details. Meanwhile, by giving specific examples, this paper explores the influences of military uniform on modern fashion design in respect to color, style, material, pattern and accessory. Through the conduct of this research, it comes to the conclusion that military uniform also has the characteristics and properties described in the fashion and cultural theory of Susan B. Kaiser, in addition, designers can be inspired by every specific object around them, which shows the talents of designers.

• Journal of IKEEE
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• v.20 no.2
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• pp.163-166
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• 2016

It is important to operate the driving circuit under the optimal condition through precisely sensing the power consumption causing the temperature made mainly by the MOSFET (metal-oxide semiconductor field-effect transistor) when a BLDC (Brushless Direct Current) motor operates. In this letter, a Super-junction (SJ) power TMOSFET (trench metal-oxide semiconductor field-effect transistor) with an ultra-low specific on-resistance of $0.96m{\Omega}{\cdot}cm^2$ under the same break down voltage of 100 V is designed by using of the SILVACO TCAD 2D device simulator, Atlas, while the specific on-resistance of the traditional power MOSFET has tens of $m{\Omega}{\cdot}cm^2$, which makes the higher power consumption. The SPICE simulation for measuring the power distribution of 25 cells for a chip is carried out, in which a unit cell is a SJ Power TMOSFET with resistor arrays. In addition, the power consumption for each unit cell of SJ Power TMOSFET, considering the number, pattern and position of bonding, is computed and the power distribution for an ANSYS model is obtained, and the SJ Power TMOSFET is designed to make the power of the chip distributed uniformly to guarantee it's reliability.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.124-131
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• 1999

Copper film, which is expected to be used as interconnection material for 1 giga DRAM integrated circuits was deposited on hole and trench patterns by Metal Organic Chemical Vapor Deposition(MOCVD) method. After a reflow process, contact and L/S patterns were filled by copper and the characteristics of the Cu reflow process were investigated. When deposited Cu films were reflowed, grain growth and agglomeration of Cu have occurred in surfaces and inner parts of patterns as well as complete filling in patterns. Also Cu thin oxide layers were formed on the surface of Cu films reflowed in $O_2$ambient. Agglomeration and oxidation of Cu had bad influence on the electrical properties of Cu films especially, therefore, their removal and prevention were studied simultaneously. As a pattern size is decreased, preferential reflow takes place inside the patterns and this makes advantages in filling patterns of deep submicron size completely. With Cu reflow process, we could fill the patterns with the size of deep sub-micron and it is expected that Cu reflow process could meet the conditions of excellent interconnection for 1 giga DRAM device when it is combined with Cu MOCVD and CMP process.