• 제목/요약/키워드: transfer mold

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A study on the development of an automated device for the transportation of roof tiles using electromagnetic grippers (전자석 그리퍼를 이용한 기와 받침틀 이송 자동화 장비 개발에 관한 연구)

  • Byung-Soo Kang;Hyeong-Min Yoo
    • Design & Manufacturing
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    • v.17 no.2
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    • pp.1-8
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    • 2023
  • This study aims to enhance the price and quality competitiveness of imported tiles by developing a robotic tile production automation line. The development process involved several steps, such as requirement analysis, derivation of technical specifications, conceptual design, engineering feasibility review, detailed design, and production. Emphasis was placed on the transfer process of the tiles' molds, and technological advancements were achieved through engineering interpretation, feasibility review, and performance evaluation. The developed automation system incorporates key specifications to ensure a transfer success rate of over 90%, thereby ensuring stable transportation of the tiles and minimizing defect rates during production. The maximum weight capacity for tile pick-up was set above 6 kg, allowing effective handling of tiles weighing 6 kg or less in automated tasks. Furthermore, the system enables safe and precise movement of the tiles to the desired location, with a transfer distance of at least 1.3 m and a transfer speed exceeding 0.2 m/sec, thereby increasing production efficiency.

A study on the change of material width by forging processing in fine pitch connector of C5210-H(HP) and NKT322-EH materials (C5210-H(HP)와 NKT322-EH 소재의 협피치 커텍터에서 단조 가공에 의한 소재 폭 변화에 관한 연구)

  • Shin, Mi-Kyung;Lee, Chun-Kyu
    • Design & Manufacturing
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    • v.14 no.3
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    • pp.17-22
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    • 2020
  • As devices such as smartphones, tablet PC, and wearable devices have been miniaturized, the connectors that go into the devices are also designed to be very small. The connector combines the plug and the receptacle to transfer electricity. As devices are miniaturized, the contact shape is formed by partially thinning the thickness of the raw material of the terminal in order to lower the coupling height of the plug and receptacle. The product used in this study is a receptacle terminal used for 0.4mm pitch board to board connector among fine pitch connectors. When the material thickness is reduced by forging the receptacle terminal, the width change of the pin is checked. To reduce the thickness of the material by forging, pre-notching is applied in the first step, forging in the second step, and notching in the third step. After forming the width dimension of the pin to 0.28 mm in the pre-notching process, in the forging process, the material thickness 0.08 mm and 0.02 mm (25%) were forged and the thickness was changed to 0.06 mm and the width change amount of the pin was measured. The facility produced 10,000 pieces at 400 SPM using a Yamada Dobby (MXM-40L) press, and thirty pins were measured and the average value was shown. After forging by using C5210-H (HP) and NKT322-EH, which are frequently used in connectors, analyze the amount of change in each material. The effect of punching oil on forging is investigated by appling FM-200M, which is highly viscous, and FL-212, fast drying oil. This study aims to minimize mold modification by predicting the amount of material change after forging.

A study on the ultra precision machining of free-form molds for advanced head-up display device (첨단 헤드업 디스플레이 장치용 비구면 자유형상 금형의 초정밀 가공에 관한 연구)

  • Park, Young-Durk;Jang, Taesuk
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.1
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    • pp.290-296
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    • 2019
  • Head-up displays for vehicles play an important role in displaying various information about the safety and convenience of driving on the windshield of the vehicle. In this study, ultra-precision machining was performed and evaluated as a method for machining a large-area aspheric free-form mirror that is applicable to augmented reality technology. Precision diamond cutting is highly accurate and suitable for the production of advanced parts with excellent surface integrity, low surface roughness, and low residual stress. By using an aspheric free-form mold, it is possible to improve the optical transfer function, reduce the distortion path, and realize a special image field curvature. To make such a mold, the diamond cutting method was used, and the result was evaluated using an aspherical shape-measuring machine. As a result, it was possible to the mold with shape accuracy (PV) below $1{\mu}m$ and surface roughness (Ra) below $0.02{\mu}m$.

Low-Cost Fabrication of Multimode Optical Waveguides for Optical Interconnects (광 연결을 위한 저가형 멀티모드 광 도파로의 제작)

  • 이병탁;권민석;윤준보;신상영
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.315-318
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    • 1999
  • As low-cost optical waveguides of optical interconnects, we fabricate multimode optical waveguides using a molding process The core size of a optical waveguide is 47 ${\mu}{\textrm}{m}$ $\times$ 41 ${\mu}{\textrm}{m}$. We use the photoresist AZ9260 as a master, polydimethyl-siloxane (PDMS) as a mold. In transferring process to polymeric material, we employ a modified micro-transfer molding process. All processes are simple and low-cost.

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Advances in Vacuum Microelectronics toward Vacuum Nanotechnology for FPDs

  • Nakamoto, Masayuki
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.299-302
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    • 2002
  • Vacuum microelectronics has been expected to provide a number of advanced devices such as flat panel displays, high-frequency devices etc., and rapidly showing tremendous and attractive aspects toward nanotechnology. Nowadays, nanomachining and nanomaterials are coming to new targets in the development for new generation devices. Transfer Mold technique has been developed for the vacuum nanotechnology. Carbon nanotubes (CNTs) are emerging as nanomaterials and expecting the new electron sources for FED. Recent progress of vacuum microelectronics toward vacuum nanotechnology in Japan are described.

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New transfer method of electrodeposited nano metal pattern by using nanowire embedded mold (나노선 임베드 몰드를 이용한 도금 패턴 전사방법)

  • Eom, Hyeon-Jin;Lee, Jae-Min;Lee, Jeong-Yong;Park, In-Gyu;Jeong, Jun-Ho
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.153-154
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    • 2014
  • 전사 방식은 금속 패턴을 다른 기판에 전사시키는 방법으로, 대면적 디스플레이에 응용하기 위해 나노 사이즈 패턴을 반복적으로 전사하는 새로운 공정을 개발하였다. 나노선 임베드 구조체와 전해 도금 방식을 이용하여 나노선 네트워크 구조체를 반복적으로 이종 기판에 전사시키는데 성공하였으며, 기존의 전사 방식인 건식 방식에 비해 공정 속도를 높이고 전사되는 패턴의 사이즈를 효과적으로 낮추는 것을 확인하였다.

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Fabriation of BMI Resin Composite for High Speed Train Transformer (변압기 권선 지지용 BMI 수지 복합재 제조 공정 개발)

  • 엄문광;김종훈;우재희;김세창
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.11a
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    • pp.257-260
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    • 2000
  • The composite composed of glass fabric and BMI resin was fabricated using resin transfer molding(RTM) process. it will be used as a supporting plate of transformer coil for high speed train. To develop a RTM process, permeability of preform was measured and resin properties like a viscosity and gellation time were checked. A resin pre-heating system and a mold system were also designed and developed. Using a vacuum-assisted RTM process, the composite supporting plate was successfully fabricated.

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A Study on Thermal Deformations of AC7A Tire Mold Casting Material by Pre-Heating Temperatures of Permanent Casting System (금형주조장치의 예열온도에 따른 타이어 몰드용 AC7A 주조재의 열변형에 관한 연구)

  • Choi, Je-Se;Choi, Byung-Hui
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.6
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    • pp.2596-2603
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    • 2013
  • The precision and endurance of tire mold are very important factors to decide the quality of tire. However, the investigation on the thermal deformation of tire mold has a lot of trouble because the tire mold is produced in airtight permanent casting material. In this study, the thermal deformations such as temperature, displacement and stress distributions inside the AC7A tire mold casting material were analyzed by numerical analysis according to the preheating temperature of permanent casting device. In order to verify the results of numerical analysis, the experiments for temperature measurement of the AC7A casting material were carried out under the same condition with numerical analysis. For the numerical analysis, "COMSOL Multiphysics" was used. The preheating temperatures were set up $150^{\circ}C$, $200^{\circ}C$, $250^{\circ}C$ and $300^{\circ}C$, respectively. The thermal deformations were calculated in each case. When the preheating temperature is $300^{\circ}C$, displacement and stress are the lowest with 0.25mm and 0.351GPa, but the temperature is the highest with $374.27^{\circ}C$. When the experimental results were compared with the numerical results, there were some temperature differences because of the latent heat by phase change heat transfer. However, the cooling patterns were almost similar except for the latent heat section.

Occurrence of Mold Growth due to Moisture Migration in a Composite Chocolate Product (복합 초콜렛제품에서의 수분이동에 의한 곰팡이의 발생)

  • Kim, Sang-Yong;Noh, Bong-Soo;Oh, Deok-Kun
    • Korean Journal of Food Science and Technology
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    • v.29 no.5
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    • pp.1033-1037
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    • 1997
  • The occurrence of mold growth due to moisture migration in a composite chocolate product filled with marshmallow during storage was investigated. The correlation between water activities and water contents of dark chocolate coating and filling marshmallow at $25^{\circ}C$ was well applied to Kuhn's equation. The marshmallow was found to be more hydrogroscopic than the chocolate. Since the moisture transferred from marshmallow to chocolate, the water activity of marshmallow decreased from 0.88 to 0.80 and that of chocolate increased from 0.22 to 0.76 at $25^{\circ}C$ for 30 days. This water activity, 0.76, can allow mold growth. A mold was isolated on the surface of a composite chocolate product at $25^{\circ}C$after 3 months and then was identified as Aspergillus repens. Growth experiments at varied water activities with A. repens were performed. When the water activity in a chocolate solid medium increased from 0.73 to 0.93, the occurrence time of mold growth decreased from 62 to 15 days. These results suggested that the occurrence of mold growth was due to the increased water activity of the chocolate resulting from the moisture transfer from filling marshmallow dark to chocolate coating.

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Simulation for the Filling Process of Resin Transfer Molding by Incorporating Composity Grids (복합격자법을 이용한 수지이동성형의 충전공정에 대한수치모사)

  • 이성재
    • The Korean Journal of Rheology
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    • v.9 no.3
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    • pp.103-110
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    • 1997
  • 고분자 복합재료 제조방법의 하나인 수지이동성형의 충전공정을 모사하기 위한 수 치모사 코드를 개발하였다. 수지이동성형의 충정공정문제를 수학적 공식으로 표현하기 위하 여 비등방성 다공질체를 통과하는 유동에 대한 이론을 사용하였다. 과도상태로 진행하는 자 유표면의 동적 충전거동을 묘사하기 위하여 수치격자 생성을 포괄하는 경계적합 좌표계의 계산기법을 적용하였다. 이와 아울러 불규칙적인 구저와 다중으로 연결된 금형면의 충전모 사에 저합한 복합격자의 개념을 도입하였다. 복합격자들 간의 가상의 경계에 대해서는 검사 체적 기법을 이용하여 물질보존을 만족시켜 주었다. 임의의 금형 두께와 투과도를 가지는 다수의 금형면이 결합된 두 개의 입구를 지닌 금형을 대상으로 하여 몇가지 예를 시험해 보 았다. 수치모사의결과 복합격자의 개념을 도입한 수치모사 코드는 수지이동성형의 복잡한 충전공정을 보다 정교하게 모사하는데 응용될수 있음을 보여주었다.

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