• Journal of Korean Neurosurgical Society
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• v.53 no.1
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• pp.59-61
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• 2013

Authors report a rare case of acute intracranial subdural and intraventricular hemorrhage that were caused by intracranial hypotension resulted from cerebrospinal fluid leakage through an unidentified dural tear site during spinal surgery. The initial brain computed tomography image showed acute hemorrhages combined with preexisting asymptomatic chronic subdural hemorrhage. One burr hole was made over the right parietal skull to drain intracranial hemorrhages and subsequent drainage of cerebrospinal fluid induced by closure of the durotomy site. Among various methods to treat cerebrospinal fluid leakage through unidentified dural injury site, primary repair and spinal subarachnoid drainage are well known treatment options. The brain imaging study to diagnose intracranial hemorrhage should be taken before selecting the treatment method, especially for spinal subarachnoid drainage. Similar mechanism to its spinal counterpart, cranial cerebrospinal fluid drainage has not been mentioned in previous article and could be another treatment option to seal off an unidentified dural tear in particular case of drainage of intracranial hemorrhage is needed.

• International Journal of Fluid Machinery and Systems
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• v.1 no.1
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• pp.24-32
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• 2008

Bleeding away a part of the boundary layer next to the wall is an effective method for controlling boundary-layer distortions from incident shock waves or curvature in geometry. When the boundary-layer flow is supersonic, the physics of bleeding with and without an incident shock wave is more complicated than just the removal of lower momentum fluid next to the wall. This paper reviews CFD studies of shock-wave/boundary-layer interactions on a flat plate with bleed into a plenum through a single hole, three holes in tandem, and four rows of staggered holes in which the simulation resolves not just the flow above the plate, but also the flow through each bleed hole and the plenum. The focus is on understanding the nature of the bleed process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1897-1901
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• 2003

Recently, with the development of semiconductor technology the miniaturization of products as well as parts and the products with high precision are being required. In addition as a national competitive power is increasingly effected by micro part development through micro machining and the secure of micro machining technology, the study of micro machining technology is being conducted in many countries. The goal of this study is to fabricate micro tool under the size of 30$\mu\textrm{m}$ and machine micro holes through micro tool fabrication by grinding, the application of ELID to grinding wheel and the measurement of surface roughness for micro tool.

• Archives of Plastic Surgery
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• v.41 no.1
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• pp.85-88
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• 2014

To improve the cosmetic results of removing epidermal cysts, minimally invasive methods have been proposed. We proposed a new minimally invasive method that completely removes a cyst through a small hole made by a $CO_2$ laser. Twenty-five patients with epidermal cysts, which were 0.5 to 1.5 cm in diameter, non-inflamed, and freely movable, were treated. All of the patients were satisfied with the cosmetic results. This method is simple and results in minimal scarring and low recurrence rates without complications.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.1
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• pp.71-77
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• 2001

Experimental study if die-sinking electrical discharge machining(EDM) was conducted with rotating electrode system including inside hole for increasing the material removal rate(MRR). With the help of dielectric fluid flow through the inside according to the different internal diameter of the hole, the molten workpiece debris could be removed and flushed out during the EDM, Cold die alloy(SKD-1) was executed for different peak current and duty factor. From this study, the MRR was found to be increased with the peak current. The more MRR was obtained for the case of electrode inside diam-eter of 10 mm, but the MRR was decreased as the diameter near at the 4mm and 6mm. The values of surface roughness and roundness were analyzed under various conditions, and these were affected by the inside diameter change of electrode.

• Journal of Mechanical Science and Technology
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• v.17 no.5
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• pp.726-739
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• 2003

A multi-dimensioanl model is being increasingly used to predict the thermo-flow field in the gas turbine combustor. This article addresses an integrated survey of modeling of the liquid spray formation and fuel distribution in gas turbine with high-shear nozzle/swirler assembly. The processes of concern include breakup of a liquid jet injected through a hole type orifice into air stream, spray-wall interaction and spray-film interaction, breakup of liquid sheet into ligaments and droplet,5, and secondary droplet breakup. Atomization of liquid through hole nozzle is described using a liquid blobs model and hybrid model of Kelvin-Helmholtz wave and Rayleigh-Taylor wave. The high-speed viscous liquid sheet atomization on the pre-filmer is modeled by a linear stability analysis. Spray-wall interaction model and liquid film model over the wall surface are also considered.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.73-73
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• 2000

Assembly is usually performed by one robot and fixtures. This type of assembly system has Low flexibility in terms of variety of parts and part-presentation that the system can handle. This paper addresses assembly without fixtures using two-manipulator robot. An active method using force feedback is proposed for the peg-in-hole assembly in highly uncertain environment. Assembly states are described by extended contact relations. Qualitative templates for events are easily derived from the token vector of the Petrinet model. The states are recognized through identification of the events using two 6-d.o.f force/moment sensors. The proposed method is verified and evaluated through experiments with round peg- in-hole assembly.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.346-349
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• 2004

In the previous experimental study about extru-bending of angle product, the bending of extruded angle products with the '${\wedge}$' section and 'ㄱ' section can be abtained by the hot metal extru-bending machine with the two punches moving in the different velocity. The bending curvature can be controlled by the different velocity of billets through the two-hole container. This paper describes simulation of extru-bending process by the difference of punch velocities. The result of the forming simulation by $DEFORM^{TM}-3D$ shows that the bending phenomenon at the die exit during extrusion can be abtained by the two punches moving in the different velocity. And it is possible to design extrusion dies and to control the curvature of product through the simulation of extru-bending process by analysis

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.229-231
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• 2007

Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1061-1064
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• 2009

Through dark injection space-charge-limited current (DI-SCLC) and trap-free SCLC measurements, it has been demonstrated that an indium tin oxide (ITO)/buckminsterfullerene ($C_{60}$) electrode can form a quasi-Ohmic contact with N, N'-bis (naphthalen-1-yl)-N, N'-bis(phenyl) benzidine (NPB). The DI-SCLC results show a clear peak current along with a shift of the peak position as the field intensity varies, implying an Ohmic (or quasi-Ohmic) contact. A theoretical simulation of the SCLC also shows that ITO/$C_{60}$ forms an Ohmic contact with NPB. The Ohmic contact makes it possible to estimate the NPB hole mobility through the use of both DI-SCLC and trap-free SCLC analysis. This also contributes to a reduction in power consumption.