• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2001년도 춘계학술대회 논문집
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• pp.16-19
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• 2001

Rapid Prototyping (RP) and Rapid Tooling (RT) were introduced to reduce time-to-market and cost by shortening not only the development phase but also the production phase of the manufacturing process. RP generally builds up a prototype layer by layer, rapidly generating a fully three-dimensional free form shape. RT enables the manufacture of production tools. The integration of RP and RT has the potential for rapid net shaping of thee-dimensional parts, which have geometrical complexity. In this study, net shaping techniques for making three-dimensional parts using RP and RT are described and a sample part are shown. A three-dimensional metal part is manufactured by a new RP process, Variable Lamination Manufacturing by using Expandable Polystyrene Foam (VLM-S), and its application to RT for making a clover punch. In addition, we discussed the technology fusion between metal forming md RP/RT.

• 대한기계학회논문집B
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• 제23권1호
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• pp.82-91
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• 1999

A numerical analysis based on the three-dimensional Reynolds-averaged Navier-Stokes equation has been conducted to investigate the flow within a NASA rotor 67 transonic fan. General coordinate transformations are used to represent the complex blade geometry and an H-type grid is used. The governing equations are solved using implicit LU-SGS scheme for the time-marching integration and a standard ${\kappa}-{\varepsilon}$ model is used with wall functions for the turbulence modeling. The computations are compared with the experimental data and a detailed study of the flow structures near peak efficiency and near stall is presented. The calculated overall aerodynamic efficiency and three-dimensional shock system agree well with the laser anemometer data.

• 대한기계학회논문집B
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• 제23권10호
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• pp.1296-1309
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• 1999

A three dimensional compressible Navier-Stokes code is developed to analyze flowfields and performance of a vaned diffuser in a centrifugal compressor. It employs scalar implicit approximate factorization, finite volume formulation, second order upwind differencing and a two-equation $q-{\omega}$ turbulence model based on the integration to the wall. Pressure recovery and loss coefficients of a vaned diffuser are evaluated using a developed computer code. The simulated three dimensional flows show how through flow structure affects pressure recovery performance and loss coefficients of a vane for design and off-design inlet flow angles. Development of complex three dimensional flow over the inlet region and leading edge are very influential to the overall flow and performance.

• Journal of Advanced Marine Engineering and Technology
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• 제26권1호
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• pp.108-115
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• 2002

This paper suggests a new analysis algorithm for the time historical response of three dimensional rectilinear structure which is frequently found in a pipe line system of plant by the combination of the transfer stiffness coefficient method(TSCM) and the Newmark method. The present analysis algorithm for a time historical response can improve the computational accuracy and time remarkably owing to advantages of the TSCM in comparison with transfer matrix method(TMM). The structural system is modeled as a lumped mass system in this method. The analysis algorithm was formulated far the three dimensional rectilinear structure. We confirmed the validity of the present algorithm by comparing the numerical computation results of TSCM with those of TMM.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집A
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• pp.637-642
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• 2000

This paper suggests new analysis algorithm for tile dynamic response of three dimensional structure which is frequently found in pipe line system of plant by the combination of the transfer stiffness coefficient method(TSCM) and Newmark method. Presented analysis algorithm for dynamic response can improve the computational accuracy remarkably owing to advantages of tile TSCM in comparison of transfer matrix method(TMM). Analysis system was modeled as a lumped mass system in this mettled. The analysis algorithm for dynamic response was formulated for the three dimensional structure. The validity of the this method is demonstrated through the results of numerical experiment for simple computational model by the TSCM and TMM.

• Wind and Structures
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• 제1권2호
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• pp.127-144
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• 1998

In this paper, the wake structures behind a square cylinder at the Reynolds number of 22,000 are simulated using the large eddy simulation, and the main features of the wake structure associated with unsteady vortex-shedding are investigated. The Smagorinsky model is used for parametrization of the subgrid scales. The finite element method with isoparametric linear elements is employed in the computations. Unsteady computations are performed using the explicit method with streamline upwind scheme for the advection term. The time integration incorporates a subcycling strategy. No-slip condition is enforced on the wall surface. A comparative study between two-and three-dimensional computations puts a stress on the three-dimensional effects in turbulent flow simulations. Simulated three-dimensional wake structures are compared with numerical and experimental results reported by other researchers. The results include time-averaged, phase-averaged flow fields and numerically visualized vortex-shedding pattern using streaklines. The results show that dynamics of the vortex-shedding phenomenon are numerically well reproduced using the present method of finite element implementation of large eddy simulation.

• 대한기계학회논문집
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• 제18권11호
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• pp.2922-2931
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• 1994

We propose a modified 6-node element, where the sampling point of Gauss quadrature moved in the thickness direction. The modified 6-node element has been applied to static problems and forced motion analyses. In this study, this method is extended to the finite element analysis of the natural frequencies of two dimensional problems. We also propose a modified 16-node element for three dimensional problems, which behaves much like a 20-node element with smaller degree of freedom. The modified 6-node and 16-node elements have been applied to the modal analyses of beams and plates, respectively. The results agree well with the results of the 8-node or 20-node element models.

• 소성∙가공
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• 제10권6호
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• pp.500-508
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• 2001

The integration of Rapid prototyping (RP) and Rapid Tooling (RT) has the potential for rapid net shaping of thee-dimensional parts, which have a geometrical complexity. In this study, a new R)P process, (VLM-SP), was proposed to manufacture net shapes of three-dimensional prototypes and it was shown that VLM-SP is an effective and economic process through the comparison of building time, building cost and dimensional accuracy for the test parts with the commercial RP processes ; LOM and FDM. In addition, the metal parts, which are a spanner shape and a clover punch, were produced by the plaster casting as one of RT using the prototypes of VLM-SP.

• 전자공학회논문지
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• 제53권7호
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• pp.131-137
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• 2016

본 논문에서는 기존의 2D IC의 성능을 개선하고 3D IC의 집적도와 전기적인 특성을 개선하기 위한 목적으로 연구되고 있는 TSV (Through Silicon Via)의 임피던스를 해석하였다. 향후 Full-chip 3D IC 시스템 설계에서 TSV는 매우 중요한 기술이며, 높은 집적도와 광대역폭 시스템 설계를 위해서 TSV에 대한 전기적인 특성에 관한 연구가 매우 중요하다. 따라서 본 연구에서는 Full-chip 3D IC를 설계하기 위한 목적으로 다중 TSV-to-TSV에서 거리와 주파수에 따른 TSV의 임피던스 영향을 해석하였다. 또한 이 연구 결과는 Full-chip 3D IC를 제조하기 위한 반도체 공정과 설계 툴에 적용할 수 있다.

• 반도체디스플레이기술학회지
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• 제22권4호
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.