• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.16-19
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• 2001

Rapid Prototyping (RP) and Rapid Tooling (RT) were introduced to reduce time-to-market and cost by shortening not only the development phase but also the production phase of the manufacturing process. RP generally builds up a prototype layer by layer, rapidly generating a fully three-dimensional free form shape. RT enables the manufacture of production tools. The integration of RP and RT has the potential for rapid net shaping of thee-dimensional parts, which have geometrical complexity. In this study, net shaping techniques for making three-dimensional parts using RP and RT are described and a sample part are shown. A three-dimensional metal part is manufactured by a new RP process, Variable Lamination Manufacturing by using Expandable Polystyrene Foam (VLM-S), and its application to RT for making a clover punch. In addition, we discussed the technology fusion between metal forming md RP/RT.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.23 no.1
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• pp.82-91
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• 1999

A numerical analysis based on the three-dimensional Reynolds-averaged Navier-Stokes equation has been conducted to investigate the flow within a NASA rotor 67 transonic fan. General coordinate transformations are used to represent the complex blade geometry and an H-type grid is used. The governing equations are solved using implicit LU-SGS scheme for the time-marching integration and a standard ${\kappa}-{\varepsilon}$ model is used with wall functions for the turbulence modeling. The computations are compared with the experimental data and a detailed study of the flow structures near peak efficiency and near stall is presented. The calculated overall aerodynamic efficiency and three-dimensional shock system agree well with the laser anemometer data.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.23 no.10
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• pp.1296-1309
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• 1999

A three dimensional compressible Navier-Stokes code is developed to analyze flowfields and performance of a vaned diffuser in a centrifugal compressor. It employs scalar implicit approximate factorization, finite volume formulation, second order upwind differencing and a two-equation $q-{\omega}$ turbulence model based on the integration to the wall. Pressure recovery and loss coefficients of a vaned diffuser are evaluated using a developed computer code. The simulated three dimensional flows show how through flow structure affects pressure recovery performance and loss coefficients of a vane for design and off-design inlet flow angles. Development of complex three dimensional flow over the inlet region and leading edge are very influential to the overall flow and performance.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.108-115
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• 2002

This paper suggests a new analysis algorithm for the time historical response of three dimensional rectilinear structure which is frequently found in a pipe line system of plant by the combination of the transfer stiffness coefficient method(TSCM) and the Newmark method. The present analysis algorithm for a time historical response can improve the computational accuracy and time remarkably owing to advantages of the TSCM in comparison with transfer matrix method(TMM). The structural system is modeled as a lumped mass system in this method. The analysis algorithm was formulated far the three dimensional rectilinear structure. We confirmed the validity of the present algorithm by comparing the numerical computation results of TSCM with those of TMM.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.637-642
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• 2000

This paper suggests new analysis algorithm for tile dynamic response of three dimensional structure which is frequently found in pipe line system of plant by the combination of the transfer stiffness coefficient method(TSCM) and Newmark method. Presented analysis algorithm for dynamic response can improve the computational accuracy remarkably owing to advantages of tile TSCM in comparison of transfer matrix method(TMM). Analysis system was modeled as a lumped mass system in this mettled. The analysis algorithm for dynamic response was formulated for the three dimensional structure. The validity of the this method is demonstrated through the results of numerical experiment for simple computational model by the TSCM and TMM.

• Wind and Structures
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• v.1 no.2
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• pp.127-144
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• 1998

In this paper, the wake structures behind a square cylinder at the Reynolds number of 22,000 are simulated using the large eddy simulation, and the main features of the wake structure associated with unsteady vortex-shedding are investigated. The Smagorinsky model is used for parametrization of the subgrid scales. The finite element method with isoparametric linear elements is employed in the computations. Unsteady computations are performed using the explicit method with streamline upwind scheme for the advection term. The time integration incorporates a subcycling strategy. No-slip condition is enforced on the wall surface. A comparative study between two-and three-dimensional computations puts a stress on the three-dimensional effects in turbulent flow simulations. Simulated three-dimensional wake structures are compared with numerical and experimental results reported by other researchers. The results include time-averaged, phase-averaged flow fields and numerically visualized vortex-shedding pattern using streaklines. The results show that dynamics of the vortex-shedding phenomenon are numerically well reproduced using the present method of finite element implementation of large eddy simulation.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.11
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• pp.2922-2931
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• 1994

We propose a modified 6-node element, where the sampling point of Gauss quadrature moved in the thickness direction. The modified 6-node element has been applied to static problems and forced motion analyses. In this study, this method is extended to the finite element analysis of the natural frequencies of two dimensional problems. We also propose a modified 16-node element for three dimensional problems, which behaves much like a 20-node element with smaller degree of freedom. The modified 6-node and 16-node elements have been applied to the modal analyses of beams and plates, respectively. The results agree well with the results of the 8-node or 20-node element models.

• Transactions of Materials Processing
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• v.10 no.6
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• pp.500-508
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• 2001

The integration of Rapid prototyping (RP) and Rapid Tooling (RT) has the potential for rapid net shaping of thee-dimensional parts, which have a geometrical complexity. In this study, a new R)P process, (VLM-SP), was proposed to manufacture net shapes of three-dimensional prototypes and it was shown that VLM-SP is an effective and economic process through the comparison of building time, building cost and dimensional accuracy for the test parts with the commercial RP processes ; LOM and FDM. In addition, the metal parts, which are a spanner shape and a clover punch, were produced by the plaster casting as one of RT using the prototypes of VLM-SP.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.7
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• pp.131-137
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• 2016

In this paper, we analyze the impedance analysis of vertical interconnection through-silicon vias (TSV) that is being studied for the purpose of improving the degree of integration and an electric feature in 3D IC. Also, it is to improve the performance and the degree of integration of the three-dimensional integrated circuit system which can exceed the limits of conventional two-dimensional a IC. In the future, TSV technology in full-chip 3-dimensional integrated circuit system design is very important, and a study on the electrical characteristics of the TSV for high-density and high-bandwidth system design is very important. Therefore, we study analyze the impedance influence of the TSV in accordance with the distance and frequency in a multiple TSV-to-TSV for the purpose of designing a full-chip three-dimensional IC. The results of this study also are applicable to semiconductor process tools and designed for the manufacture of a full-chip 3D IC.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.