• Title/Summary/Keyword: thin film hardness

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Deposition of Diamond Like Carbon Thin Films by PECVD (PECVD법에 의한 DLC 박막의 증착)

  • 김상호;김동원
    • Journal of the Korean institute of surface engineering
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    • v.35 no.2
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    • pp.122-128
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    • 2002
  • This study was conducted to synthesize the diamond like carbon films by plasma enhanced chemical vapor deposition (PECVD). The effects of gas composition on growth and mechanical properties of the films were investigated. A little amount of hydrogen or oxygen were added to base gas mixture of methane and argon. Methane dissociation and diamond like carbon nucleation were enhanced by installing negatively bias grid near substrate. The deposited films were indentified as hard diamond like carbon films by micro-Raman spectroscopy. The surface and fractured cross section of the films which were observed by scanning electron microscopy showed that film growth is very slow as about 0.3$\mu\textrm{m}$/hour, and relatively uniform with hydrogen addition. Vickers hardness of tungsten carbide (WC) cutting tool increased from about 1000 to 1600~1800 by deposition of DLC film, that of commercial TiN coated tool was about 1270. In cutting test of aluminum 6061 alloy, DLC coated cutting tool showed 1/3 or lower crater and flank wear than TiN coated or non-coated WC cutting tools.

Investigations of DLC Films for Protection of Organic Photoconductors in Electrophotography

  • Ko, Myoung-Wan;Kim, Seong-Young;Shin, Seoung-Yong;Lee, Sang-Hyun;Akihiro Tanaka;Kazunori Umeda;Kazuyuki Mizuhara
    • The Korean Journal of Ceramics
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    • v.3 no.2
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    • pp.88-91
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    • 1997
  • The diamondlike (DLC) films were deposited by RF plasma CVD system which had cathode consisting of mesh sheet, for the purpose of a protection from wear of OPC surface of the electrophotographic photosensitive body. Material charateristics and tribological properties of the films were also investigated and finally copying performance was evaluated with DLC deposited OPC samples. The surface resistance of the DLC film unaffected by the surface potential of the OPC was about $10^{11}{\Omega}$ and its hardness was about 1200 kg/$\textrm{mm}^2$. In this case the film showed typical material strcture of dimondlike hydrocarbon. The friction coefficient of the film was lowered to 0.2~0.3 at the optimum condition in this investigation and their wear resistant was inproved by DLC-deposition on the OPC surface. DLC-deposited OPC samples with a good copying performance without image flow and draft could be obtained at some depositing conditions.

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EFFECT OF ION BEAM ASSISTED CLEANING ON ADHESION OF ALUMINIUM TO POLYMER SUBSTRATE OF PC AND PMMA

  • Kwon, Sik-Chol;Lee, Gun-Hwan;Lee, Chuel-Yong;Gob, Han-Bum;Lim, Jun-Seop;Goh, Sung-Jin
    • Journal of the Korean institute of surface engineering
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    • v.32 no.3
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    • pp.428-432
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    • 1999
  • As metallic surface has its unique lustrous appearance and optical reflectance in visible range of light, the metallization of plastic surface has been an essential drive toward weight reduction for fuel economy and decorations in transportation industry and has been put into practiced from wet chemical-electrochemial to dry vacuum process in view of an environmental effect. Electron-beam metallization was used in this work with an aim at improving the scratchproof surface hardness of plastic substrate with metallic finish character. Thin film of Al ($1000\AA$) and $SiO_2$($7000\AA$) were metallized on substrate of PC and PMMA and the films were evaluated by pencil test for surface hardness and by cross-cut tape test for adhesion. The ion beam treatment improved around twice as hard as non-treat surface. The ion beam is effect on its hardness and adhesion to surface hardened PC substrate.

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Influence of Cu Composition on the Mechanical Properties and Microstructure of Ti-Al-Si-Cu-N thick films (Ti-Al-Si-Cu-N 후막의 Cu 조성에 따른 기계적 특성과 미세구조 변화에 관한 연구)

  • Yeon-Hak Lee;Sung-Bo Heo;In-Wook Park;Daeil Kim
    • Journal of the Korean institute of surface engineering
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    • v.56 no.5
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    • pp.335-340
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    • 2023
  • Quinary component of 3㎛ thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5-7 nm in dia.) and a thin layer of amorphous Si3N4 phase.

Fabrication of ATO thin film for IR-cut off by sol-gel method (솔-젤 법에 의한 적외선 차단 ATO 박막 제조)

  • Kim, Jin-Ho;Lee, Kwang-Hee;Lee, Mi-Jai;Hwang, Jonghee;Lim, Tae-Young
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.23 no.5
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    • pp.230-234
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    • 2013
  • IR cut-off thin films consisted of ATO nanoparticles were successfully fabricated by sol-gel method. The coating solution was synthesized with organic/inorganic hybrid binder and ATO colloidal solution and ATO thin films were coated on a slide glass with the withdrawal speed of 5~40 mm/s. As the withdrawal speed increased from 5 mm/s to 40 mm/s, the thickness of coating thin films also increased from $1.05{\mu}m$ to $4.25{\mu}m$ and the IR cut-off in wavelength of 780~2500 nm increased from 49.5 % to 66.7 %. In addition, the pencil hardness of ATO thin films dried at $80^{\circ}C$ was ca. 5H and the coating films were not removed after a cross cutter tape test because of the hybrid binder synthesized with tetraethylorthosilicate and methyltrimethoxysilane. The surface morphologies, optical properties and film thickness of prepared thin films with a different withdrawal speed were measured by field emission scanning electron microscope (FE-SEM), UV-Vis spectrophotometer, and Dektak.

Surface Physical Properties of W-N Nano Thin Films by Nanotribological Analysis (나노트라이볼로지 분석을 이용한 W-N 나노박막의 표면 물성 연구)

  • Kim, Soo-In;Lee, Kyu-Young;Kim, Joo-Young;Lee, Chang-Woo
    • Journal of the Korean Vacuum Society
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    • v.20 no.6
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    • pp.456-460
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    • 2011
  • Recently, the size of currently-researched components and devices reduces nano-scale. Thus, it is important and emphasizes the analyses of physical properties in nano scale. Especially, the mechanical properties are not over micro-scale components but nano-scale components with different characteristics that has been reported. However, most analytical methods for currently studying in nano-scale are related to spectroscopy and electronics, affected the limitation of viewing size that these methods give only average information. In this research, the representative nanotribology analyses, nano-indenter study the physical and mechanical properties of W-N thin film for nano region and nano depth within nano-scale that the thickness of W-N diffusion barrier has less than tens of nanometers. The Scanning probe microscopy (SPM) study the surface image. From these results, the hardness of W-N thin film underneath the nano-surface decreased from 57.67 GPa to 9.1 GPa according to the increase of nitrogen gas flow. The elastic modulus of W-N thin film underneath the nano-surface also decreased from 575.53 GPa to 178.1 GPa.

Effect of Diamond-Like Carbon Passivation on Physical and Electrical Properties of Plasma Polymer (플라즈마 폴리머의 물리적, 전기적 특성에서 다이아몬드상 탄소 패시베시션이 미치는 영향)

  • Park, Y.S.;Cho, S.J.;Boo, J.H.
    • Journal of the Korean Vacuum Society
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    • v.21 no.4
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    • pp.193-198
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    • 2012
  • In this study, we have fabricated the polymer insulator and diamond-like carbon (DLC) thin films by using plasma enhanced chemical vapor deposition methods. we fabricated the DLC films with various thicknesses as the passivation layer on plasma polymer and investigated the structural, physical, and electrical properties of DLC/plasma polymer films. The plasma polymer synthesized in this work had the low leakage current and low dielectric constant. The values of hardness and elastic modulus in DLC/plasma polymer films are increased, and the value of rms surface roughness is decreased, and contact angle value is increased with increasing DLC film thickness. In the electrical properties of DLC/plasma polymer, the value of the dielectric constant is increased, however the leakage current property of the DLC/plasma polymer is improved than that of plasma polymer film with increasing DLC film thickness.

Development of Thin and Lightweight Bulletproof Windows Using Strengthened SLS Glass by Ion Exchange

  • Shim, Gyu-In;Kim, Seong-Hwan;Ahn, Deok-Lae;Park, Jong-Kyoo;Choi, Se-Young
    • Journal of the Korean Ceramic Society
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    • v.52 no.2
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    • pp.123-127
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    • 2015
  • Soda-lime silicate (SLS) glass was strengthened by ion exchange for application of thin and lightweight bulletproof windows. The optimal conditions for ion exchanged SLS glass (thickness of 3 and 10 mm) at $480^{\circ}C$ were 10 and 17 min, respectively. The Vickers hardness values of the strengthened SLS glass samples with thicknesses of 3 and 10 mm were $5.9{\pm}0.22$ and $6.7{\pm}0.17GPa$, respectively, which values were about 22% higher than those of parent SLS glass. By laminating a multilayer defense film and polycarbonate sheet with ion exchanged SLS glass, we were able to make a thin and lightweight bulletproof window (24.25 mm, 4.57 kg, $50.06kg/m^2$, $V_{50}$ 901.8 m/s). As a result, the thickness of the bulletproof window was decreased by about 39% from 40 to 24.25 mm. The light transmittance in the visible range satisfied the standard (over 76%) for bulletproof windows.

The Study of Color and Hardness of TiN Thin Film by UBM Sputtering System (UBM Sputtering System에 의한 TiN막의 색상과 경도에 관한 연구)

  • Park, Moon Chan;Lee, Jong Geun;Joo, Kyung Bok
    • Journal of Korean Ophthalmic Optics Society
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    • v.14 no.1
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    • pp.57-62
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    • 2009
  • Purpose: TiN films were deposited on sus304 by unbalanced magnetron sputtering system which was designed and developed as unbalancing the strength of the magnets in the magnetron electrode. The color and hardness of deposited TiN films was investigated. Methods: The cross sections of deposited films on silicon wafer were observed by SEM to measure the thickness of the films, the components of the surface of the films were identified by XPS, the components of the inner parts of the films were observed by XPS depth profiling. XPS high resolution scans and curve fittings of deposited films were performed for quantitative chemical analysis, Vickers micro hardness measurements of deposited films were performed with a nano indenter equipment. Results: The colors of deposited films gradually changed from light gold to dark gold, light violet, and indigo color with increasing of the thickness. It could be seen that the color change come from the composite change of three compound,$TiO_{x}N_{y}$, $TiO_2$, TiN. Especially, the composite change of$TiO_{x}N_{y}$ compound was thought to affect the color change with respect to thickness. Conclusions: Deposited films had lower than the value of general TiN film in Vickers hardness, which was caused by mixing three TiN, $TiO_2$,$TiO_{x}N_{y}$ compound in the deposited films. The increasing and decreasing of micro hardness with respect to thickness was thought to have something to do with the composite of TiN in the films.

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Study on Lowering of the Polarization in SiOC Thin FIlms by Post Annealing (SiOC 박막에서 열처리에 의한 분극의 감쇄현상에 관한 연구)

  • Oh, Teresa
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.16 no.8
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    • pp.1747-1752
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    • 2012
  • The SiOC film of carbon centered system was prepared using bistrimethylsilylmethane (BTMSM) and oxygen mixed precursor by the chemical vapor deposition. The dielectric constant is measured by MIS(metal/insulator/Si) structure, but it could decrease the reliability because the uniformity is not assured. To research the dielectric constant of SiOC film, the range of low polarization was researched in SiOC film using the optical analysis and hardness, and then calculated the dielectric constant of SiOC film with amorphous structure of high degree. After annealing, the dielectric constant of SiOC film was decreased owing to the lowering of polarization, and FTIR spectra of the main bond was shifted to higher wave number. The main bond of 950~1200 cm-1 was composed of the Si-C and Si-O bonds. The intensity increases in Si-O bond infers the bonding strength became stronger than that of deposited film. Annealed SiOC film showed 2.06 in dielectric constant.