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http://dx.doi.org/10.5757/JKVS.2012.21.4.193

Effect of Diamond-Like Carbon Passivation on Physical and Electrical Properties of Plasma Polymer  

Park, Y.S. (Department of Photoelectronics Information, Chosun College of Science & Technology)
Cho, S.J. (Department of Chemistry, Sungkyunkwan University)
Boo, J.H. (Department of Chemistry, Sungkyunkwan University)
Publication Information
Journal of the Korean Vacuum Society / v.21, no.4, 2012 , pp. 193-198 More about this Journal
Abstract
In this study, we have fabricated the polymer insulator and diamond-like carbon (DLC) thin films by using plasma enhanced chemical vapor deposition methods. we fabricated the DLC films with various thicknesses as the passivation layer on plasma polymer and investigated the structural, physical, and electrical properties of DLC/plasma polymer films. The plasma polymer synthesized in this work had the low leakage current and low dielectric constant. The values of hardness and elastic modulus in DLC/plasma polymer films are increased, and the value of rms surface roughness is decreased, and contact angle value is increased with increasing DLC film thickness. In the electrical properties of DLC/plasma polymer, the value of the dielectric constant is increased, however the leakage current property of the DLC/plasma polymer is improved than that of plasma polymer film with increasing DLC film thickness.
Keywords
Plasma polymer; Diamond-like carbon; Plasma enhanced chemical vapor deposition; Dielectric constant; Leakage current; Hardness;
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  • Reference
1 S. P. Murarka, M. Eizenverg, and A. K. Sinha, Interlayer Dielectrics for Semiconductor Technologies (Elsevier Academic Press, UK, 2003), p. 157.
2 G. Maier, Prog. Polym. Sci. 26, 3 (2001).   DOI   ScienceOn
3 D. T. Price, R. J. Gutmann, and S. P. Murarka, Thin Solid Films 308-309, 523 (1997).   DOI
4 H. Treichel, G. Ruhl, P. Ansmann, R. Würl, C. H. Muller, and M. Dietlmeier, Microelectronic Engineering 40, 1 (1998).   DOI
5 H. Zhou, H. K. Kim, F. G. Shi, B. Zhao, and J. Yota, Microelectronics Journal 33, 221 (2002).   DOI
6 H. Zhou, F. G. Shi, and B. Zhao, Microelectronics Journal 34, 259 (2003).   DOI
7 L. Trabzon and O. O. Awadelkarim, Microelectronic Engineeing 65, 463 (2003).   DOI
8 X. T. Chen, D. Gui, Z. Q. Mo, A. Y. Du, D. Z. Chi, W. D. Wang, D. Lu, L. J. Tang, W. H. Li, and L. Y. Wong, Thin Solid Films 504, 248 (2006).   DOI