• Journal of Periodontal and Implant Science
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• v.30 no.1
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• pp.187-203
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• 2000

The precipitation of calcium phosphate on implant surface has been known to accelerate osseointegration and to enhance osseous adaptation. The present study was performed to examine whether the precipitation of calcium phosphate on Ti-6Al-4V alloy could be affected by the immersion in NaOH solution and heat treatment. Ti-6Al-4V alloy plates of $15{\times}3.5{\times}1mm$ in dimension were polished sequentially from #240 to #2,000 emery paper and one surface of each specimen was additionally polished with $0.1{\mu}m$ alumina paste. Polished specimens were soaked in various concentrations of NaOH solution(0.1, 1.0, 3.0, 5.0, 7.0, 10.0 M) at $60^{\circ}C$ for 24 hours for alkali treatment, and 5.0 M NaOH treated specimens were heated for 1 hour at each temperature of 400, 500, 600, 700, $800^{\circ}C$. After the alkali and heat treatments, specimens were soaked in the Hank's solution with pH 7.4 at $36.5^{\circ}C$ for 30days.The surface ingredient change of Ti-6Al-4V alloy was evaluated by thin-film X-ray diffractometer(TF-XRD) and the surface microstructure was observed by scanning electron microscope(SEM), and the elements of surface were analyzed by X-ray photoelectron spectroscopy(XPS). The results were obtained as follows ; 1. The precipitation of calcium phosphate on Ti-6Al-4V alloy was accelerated by the immersion in NaOH solution and heat treatment. 2. In Alkali treatment for the precipitation of calcium phosphate on Ti-6Al-4V alloy, the optimal concentration of NaOH solution was 5.0 M. 3. In heat treatment after alkali treatment in 5.0 M NaOH solution, the crystal formation on alloy surface was enhanced by increasing temperature. In heat treated alloys at $600^{\circ}C$, latticed structure and prominences of calcium phosphate layer were most dense. On heat treated alloy surface at the higher temperature(${\geq}700^{\circ}C$), main crystal form was titanium oxide rather than apatite. The above results suggested that the precipitation of calcium phosphate on the surface of Ti-6Al-4V alloy could be induced by alkali treatment in 5.0 M-NaOH solution and by heat treatment at $600^{\circ}C$.

• Journal of the Korean Chemical Society
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• v.41 no.4
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• pp.180-185
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• 1997

Zinc, cadmium, lead and copper were simultaneously determined by depositing metals at - 1.200 V vs. a Ag/AgCl(sat. KCl) reference electrode for 150 seconds on a hanging mercury drop electrode(HMDE) or a thin mercury film electrode(TMFE), followed by scanning towards anodic direction using differential pulse voltammetric(DPASV) and square wave voltammetric(SWASV) techniques. The linear calibration curves were obtained for four metal ions simultaneously determined by DPASV with a HMDE in the concentration range between 20 and 100 ppb. However, the linear calibration plots were obtained only for $Cd^{2+}$ and $Pb^{2+}$ in the simultaneous determinations with a TMFE in the concentration range up to 100 ppb using DPASV and up to 10 ppb using SWASV. DPASV with a TMFE was about 15 times more sensitive than DPASV with a HMDE for simultaneous determinations of $Cd^{2+}$ and $Pb^{2+}$. SWASV was about 5 times more sensitive than DPASV at a TMFE. Concentrations of zinc in seven different sediment samples determined by DPASV with a HMDE and inductively coupled plasma-mass spectrometry were compared, resulting with an excellent correlation coefficient of 0.9993 and with no significant difference between two methods after t-test.

• Journal of the Korean Vacuum Society
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• v.20 no.2
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• pp.77-85
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• 2011

The silicon-germanium (SiGe) alloy, which is compatible with silicon semiconductor technology and has a smaller band gap and a lower thermal conductivity than silicon, has been used to fabricate electronic devices such as transistors, photodetectors, solar cells, and thermoelectric devices. This paper reviews the application of SiGe alloys to electronic devices and related technical issues. Since the SiGe alloy comprises germanium whose band gap is smaller than silicon, its band gap is also smaller than that of silicon irrespective of the ratio of silicon to germanium. This narrow band gap of SiGe enables the base thickness of bipolar transistors to decrease without a loss in current gain so that it is possible to improve the speed of bipolar transistors by adopting the SiGe-base. In addition, the conversion efficiency of solar cells is enhanced by the absorption of long-wavelength light in the SiGe absorption layer. Phonon scattering caused by the irregular distribution of alloying elements induces the lower thermal conductivity of SiGe than those of pure silicon and germanium. Because a thin film layer with a low thermal conductivity suppresses thermal conduction through a thermal sink, the SiGe alloy is considered to be a promising material for silicon-based thermoelectric systems.

• Journal of the Korean Vacuum Society
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• v.18 no.1
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• pp.1-8
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• 2009

Hydrophilic Surface modification of Polysarene (PS) was performed by Atmospheric Pressure Plasma (APP). Air or 0, gases were used for carrier gases and RF power was changed from 150 to 350 W. We controlled the treatment time as 1 time to 4 time passing through the plasma region. when the carrier gas was air, the water contact angle on the PS surface was decreased from $91^{\circ}$ to $20^{\circ}$. And the surface energy increased from 45.74 dyne/cm to 68.48 dyne/cm. In case of the $O_2$ plasma treatment, at 300 W of RF power and 4 times treatment, the water contact angle on the PS. Surface was decreased from $91^{\circ}$ to $17^{\circ}$ and the surface energy was increased from 45.74 dyne/cm to 69.73 dyne/cm. The surface energy was increased by polar force not by dispersion force. Improvement of surface properties can be explained by the formation of new hydrophilic groups which is identified as C-O, C=O by XPS analysis. The contact angle of APP treated PS surface kept in air was increased with time elapse, but maintained same value when it was kept in water. We treated the PS surface by APP and deposited Cu as $4,000\;{\AA}$ and $8,000\;{\AA}$ by thermal evaporation. The adhesion between sample and Cu thin film improvement of treated PS surface against untreated sample. could be verifiable by Tape test (ASTM D3359)

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.215-220
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• 2001

Amorphous Ti-Si-N films of approximately 200 and 650 thickness were reactively sputtered on Si wafers using a dc magnetron sputtering system at various $N_2$/Ar flow ratios. Their barrier properties between Cu (750 ) and Si were investigated by using sheet resistance measurements, XRD, SEM, RBS, and AES depth profiling focused on the effect of the nitrogen content in Ti-Si-N thin film on the Ti-Si-N barrier properties. As the nitrogen content increases, first the failure temperature tends to increase up to 46 % and then decrease. Barrier failure seems to occur by the diffusion of Cu into the Si substrate to form Cu$_3$Si, since no other X- ray diffraction intensity peak (for example, that for titanium silicide) than Cu and Cu$_3$Si Peaks appears up to 80$0^{\circ}C$. The optimal composition of Ti-Si-N in this study is $Ti_{29}$Si$_{25}$N$_{46}$. The failure temperatures of the $Ti_{29}$Si$_{25}$N$_{465}$ barrier layers 200 and 650 thick are 650 and $700^{\circ}C$, respectively.ely.

• Korean Chemical Engineering Research
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• v.54 no.2
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• pp.145-151
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• 2016

In response to the cavitation caused by the partial vacuum caused by the fluid flow, a paint was developed by dispersing the lamella-shaped glass-flake in resin for anti-cavitation. This composite paint was developed by using the inorganic filler (lamella shaped glass-flake) and the NBR (Acrylonitrile-butadiene rubber) which was modified epoxy resin. Especially, the glass-flake was a thin film with a thickness of about 100~200 nm and length of about $20{\sim}30{\mu}m$, the aspect ratio was about 200 to 300 times that of the plate-shaped. So the paint for anti-cavitation have shown excellent performance in corrosion resistance. The results of evaluating anti-cavitation performance was below, tensile strength $4.8{\sim}6N/mm^2$ or more, rupture elongation 30% or higher, abrasive speed $10mm^2/h$ or less. In particular, it showed more than twice the superior performance compared to existing advanced foreign products in anti-cavitation performance evaluation.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.37-43
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• 1999

Modules of the system that requires large capacity and high-speed information processing are implemented in the form of MCM that allows high-speed data processing, high density circuit integration and widely applied to such fields as ATM, GPS and PCS. Hence we developed the ATM switching module that is consisted of three chips and 2.48 Gbps data throughput, in the form of 10 multi-layer by Cu/Photo-BCB and 491pin PBGA which size is $48 \times 48 \textrm {mm}^2$. hnologies required for the development of the MCM includes extracting parameters for designing the substrate/package through the interconnect characterization to implement the high-speed characteristics, thermal management at the high-density MCM, and the generation of the testability that is one of the most difficult issues for developing the MCM. For the development of the ATM Switching MCM, we extracted signaling delay, via characteristics and crosstalk parameters through the interconnect characterization on the MCM-D. For the thermal management of 15.6 Watt under the high-density structure, we carried out the thermal analysis. formed 1.108 thermal vias through the substrate, and performed heat-proofing processing for the entire package so that it can keep the temperature less than $85^{\circ}C$. Lastly, in order to ensure the testability, we verified the substrate through fine pitch probing and applied the Boundary Scan Test (BST) for verifying the complex packaging/assembling processes, through which we developed an efficient and cost-effective product.

• Journal of the Microelectronics and Packaging Society
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• v.4 no.1
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• pp.1-12
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• 1997

본 연구에서는 용액성장법에 의해 양자 입자로 구성된 CdS 박막을 슬라이드 유리기 판위에 성장시키고 이들의 구조적 광학적 특성에 대하여 연구하였고 이들 결과를 토대로 용 액성장법으로 성장된 CdS 박막의 양자 사이즈 효과에 대하여 연구하였다. 성장시간은 1, 3, 10, 20분이었고 성장온도는 75$^{\circ}C$였다. X-선 회절 분석결과 본 연구에서 합성된 CdS 박막은 hexagonal상의 결정구조를 갖는 것으로 나타났고 성장시간에 따라 막의 투께는 61~195nm, 입자사이즈는 8.5~22.5nm로 나타났다. 광에너지 변화에 따른 투과도 측정결과 본 연구의 CdS 시료는 성장시간에 따라 에너지 밴드갭이 2.43~2.51 eV로 나타나서 벌크 CdS의 에너 지 밴드갭인 2.42 ev보다 높은 에너지 밴드갭을 갖게 되어 양자 사이즈 효과에 의한 blue shift 현상이 용액성장법에 의해 합성된 CdS 시료에도 존재한다는 것이 밝혀졌다 그리고 이 같은 용액성장법으로 성장된 CdS에 대해 최초로 수행된 Raman 산란 실험결과 이성장방법 으로 성장된 CdS에는 1TO, E2, 1LO 포논 모드가 존재함을 알수 있었고 또한 입자 사이즈 감소에 의한 1LO포논 모드의저주파수 shift 현상 즉 포논 모드의 softening 현상이 있음이 밝혀졌고 softening은 최대6.2%까지 발생하였다. 이와같은 높은 softening은 본연구의 CdS 박막 내 양자 입자의 입도가 작은것에 기인하는 것으로 밝혀졌다. 또한 본 CdS 시료의 양 자 사이즈 효과의 결과로 1TO 포논도 나타났는데 이 1TO 포논과 E2 포논의 Raman shift 는 성장시간 즉 막의 두께와는 무관한 것으로 나타났다.행렬모형(二重比例行列模型)을 이용하여, 산업구조의 변화로 인한 직업별 인력수요 변화가 충분히 고려되도록 하였다. 전망의 결과에 따르면 향후 우리 경제는 지식기반경제(knowledge-based economy)로 이행하고 있다고 볼 수 있다. 우선 산업구조면에서 지식집약적산업으로의 구조조정이 일어나게 되고 이에 따라 산업별 취업구조에서도 고기술산업의 취업준비중이 급속히 증가하게 된다. 직업별 취업분포에 있어서도 전문기술직 행정관리직 등의 고숙련 사무직의 비중은 크게 증가하는 반면 생산관련직과 농림어업직의 비중은 감소하게 된다. 이처럼 경제가 지식집약화되어 감에 따라 고학력자에 대한 수요는 지속적으로 증가하지만 현재 적절한 인력양성과 공급이 이루어지지 않고 있어 향후 기술이나 기능에 따른 수급부일정(需給不一政)(skill mismatch)현상이 매우 심해질 것으로 보인다. 따라서 앞으로의 인력정책에서 가장 주안점을 두어야 할 부분은 첨단기술산업과 관련된 인력의 양성에 있다고 하겠다.2시간까지 LPDG용액은 MEC용액보다 비교적 나은 회복을 보였고 재관류 3일과 7일의 폐기능 평가에서 두 용액 모두에서 폐기능의 점차적 소실을 보였으며 이는 병리조직검사에서 보듯이 폐혐에 의한 외적인 요소라고 생각되며 따라서 LPDG용액은 허혈재관류손상 방지 및 급성폐렴 등 염증을 잘 관리한다면 20시간 이상 LPDG용액의 안전한 폐보존의 가능성 을 얻을 수 있었다.ic 형태로 외래유전자가 발현되었지만 대조구에서 87.0% (26/30개) 배반포기가 $\beta$-Gal 활력을 보인 반면, G418 처리구에서는 모든 배반포기가 $\beta$-Gal 활력을 보였다 (P<0.05). 그러나 대조구 및 G418 처리구의 ICM

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.1
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• pp.1026-1029
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• 2005

The feasibility of graphoepitaxial growth of compound semiconductors has been studied. Two kinds of substrates were prepared; one is smooth substrate, the other one is a periodic structured substrate. ZnO film was formed on both substrates by thermal evaporation of elemental Zn and natural oxidation of the deposited Zn. Thermal treatment was performed to improve the crystal quality and to investigate the effect of the periodic structure. Atomic force microscopy (AFM) and photoluminescence (PL) were used to characterize the samples. As a result, the improvement of crystallinity as annealing temperature increase, has been observed from both samples. The samples, annealed at 800 $^{\circ}$C, show the best crystal quality in terms of PL linewidth. Also the sample grown on grating structure shows better crystal quality than the sample grown on flat substrate. It implies that the periodic structure affects the crystallinity of the films, and the graphoepitaxy of compound semiconductors is possible by using appropriate surface structure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.805-810
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• 2012

Transparent conducting oxides (TCOs) have wide range of application areas in transparent electrode for display devices, Transparent coating for solar energy heat mirrors, and electromagnetic wave shield. $SnO_2$ is intrinsically an n-type semiconductor due to oxygen deficiencies and has a high energy-band gap more than 3.5 eV. It is known as a transparent conducting oxide because of its low resistivity of $10^{-3}{\Omega}{\cdot}cm$ and high transmittance over 90% in visible region. In this study, co-doping effects of Al and Y on the properties of $SnO_2$ were investigated. The addition of Y in $SnO_2$ was tried to create oxygen vacancies that increase the diffusivity of oxygen ions for the densification of $SnO_2$. The addition of Al was expected to increase the electron concentration. Once, we observed solubility limit of $SnO_2$ single-doped with Al and Y. $\{(x/2)Al_2O_3+(x/2)Y_2O_3\}-SnO_2$ was used for the source of Al and Y to prevent the evaporation of $Al_2O_3$ and for the charge compensation. And we observed the valence changes of aluminium oxide because generally reported of valence changes of aluminium oxide in Tin - Aluminium binary system. The electrical properties, solubility limit, densification and microstructure of $SnO_2$ co-doped with Al and Y will be discussed.