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Development of the Direct Boundary Element Method for Thin Bodies with General bBundary Conditions (일반 경계 조건을 가진 얇은 물체에 대한 직접 경계 요소법의 개발)

  • 이강덕;이덕주
    • Journal of KSNVE
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    • v.7 no.6
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    • pp.975-984
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    • 1997
  • A direct boundary element method (DBEM) is developed for thin bodies whose surfaces are rigid or compliant. The Helmholtz integral equation and its normal derivative integral equation are adoped simultaneously to calculate the pressure on both sides of the thin body, instead of the jump values across it, to account for the different surface conditions of each side. Unlike the usual assumption, the normal velocity is assumed to be discontinuous across the thin body. In this approach, only the neutral surface of the thin body has to be discretized. The method is validated by comparison with analytic and/or numerical results for acoustic scattering and radiation from several surface conditions of the thin body; the surfaces are rigid when stationary or vibrating, and part of the interior surface is lined with a sound-absoring material.

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Preparation and Characterization of Plasma Polymerized Methyl Methacrylate Thin Films as Gate Dielectric for Organic Thin Film Transistor

  • Ao, Wei;Lim, Jae-Sung;Shin, Paik-Kyun
    • Journal of Electrical Engineering and Technology
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    • v.6 no.6
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    • pp.836-841
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    • 2011
  • Plasma polymerized methyl methacrylate (ppMMA) thin films were deposited by plasma polymerization technique with different plasma powers and subsequently thermally treated at temperatures of 60 to $150^{\circ}C$. To find a better ppMMA preparation technique for application to organic thin film transistor (OTFT) as dielectric layer, the chemical composition, surface morphology, and electrical properties of ppMMA were investigated. The effect of ppMMA thin-film preparation conditions on the resulting thin film properties were discussed, specifically O-H site content in the pMMA, dielectric constant, leakage current density, and hysteresis.

Electrical Properties of Pt/SCT/Pt Thin Film Structure (Pt/SCT/Pt 박막 구조의 전기적인 특성)

  • Kim, Jin-Sa;Shin, Cheol-Gi
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.10
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    • pp.1786-1790
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    • 2007
  • The $(SrCa)TiO_3(SCT)$ thin films are deposited on Pt-coated electrode ($Pt/TiN/SiO_2/Si$) using RF sputtering method at various deposition temperature. The dielectric constant of SCT thin films were increased with the increase of deposition temperature, and changed almost linearly in temperature ranges of $-80{\sim}+90[^{\circ}C]$. Also, SCT thin films was observed the phenomena of dielectric relaxation with the increase of frequency, and the relaxation frequency was observed above 200[kHz]. V-I characteristics of SCT thin films show the increasing leakage current with the increases of deposition temperature. The conduction mechanism of the SCT thin films observed in the temperature range of $25{\sim}100[^{\circ}C]$ can be divided into three characteristic regions with different mechanism by the increasing current. The region 1 below 0.8[MV/cm] shows the ohmic conduction. The region 2 can be explained by the Child's law, and the region 3 is dominated by the tunneling effect.

Synthesis and Absorption Spectra of 1,4-Diketo-3,6-Diphenyl-Pyrrolo-[3,4c]-Pyrrole (1,4-Diketo-3,6-Diphenyl-Pyrrolo-[3,4c]-Pyrrole(DPP)계 유기안료의 합성 및 흡수스펙트라)

  • 김성훈
    • Journal of the Korean Graphic Arts Communication Society
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    • v.14 no.1
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    • pp.1-15
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    • 1996
  • In this paper, the preparation of lead zirconium titanate(PZT) thin film by sol-gel processing was descried. Thin film coated with thickness of 4${\mu}{\textrm}{m}$ on the stainless steel substrates using the multiple spin-coating process. The crystalline phases of PZT powder and film were investigated by X-ray diffraction pattern and PZT thin film has perovskite structure over 600 C annealing temperature. Corona charging characteristics of the ferroelectric PZT thin film at 600 C were investigated by electrophotographic measurement. A difference in the charging characteristics between positive and negative corona charging was found. The charge acceptance depended in the polarity of corona and the poling of film. According to the D-E hysteresis measurment, PZT thin film can be poled by corona charging without use of top electrode. The remnant polarization in the PZT thin film is generally in the order of 48$\mu$C/$\textrm{cm}^2$. From this results, the ferroelectric PZT thin film will be possible to apply for the add-on type imaging formation.

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Fabrication and Characteristics of LB Ultra-thin Film Capacitor (I) (LB 초박막 커패시터의 제작 및 특성 (I))

  • 최용성;신훈규;권영수
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1995.11a
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    • pp.277-280
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    • 1995
  • We had experiment using LB method that can fabricate molecular order ultra-thin film below 100${\AA}$. LB mettled has known as main technology of information society in 21C, because it is nut only free oriention and alignment of molecular but also ability of thickness control as molecular order. In this paper, the fabricated condition and physical properities of functional ultra-thin film of molecular order was investigated and highly efficient ultra-thin film capacitor was fabricated by using ultra-thin LB film for application as electronic device. Possibility of ultra-thin film capacitor was researched by analizing rind measuring electrical properties. Polyimide ultra-thin LB film capacitor was fabricated, ensured theoretically rind experimentally its possibility in range of 10Hz∼ 1MHz through its frequency characteristics.

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Microstructure and Properties of $(Sr_{0.85}Ca_{0.15})TiO_3$ Thin Film with Annealing Temperature (열처리온도에 따른 $(Sr_{0.85}Ca_{0.15})TiO_3$박막의 구조 및 특성)

  • 김진사;조춘남;신철기;최운식;김충혁;이준웅
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.10
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    • pp.802-807
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    • 2001
  • The (S $r_{0.85}$C $a_{0.15}$)Ti $O_{3}$(SCT) thin films are deposited on Pt-coated electrode (Pt/TiN/ $SiO_2$/Si) using RF sputtering method. The composition of SCT thin films deposited on Si substrate at woom temperature is close to stoichiometry(1.102 in A/B ratio). The maximum dielectric constant of SCT thin films is obtained by annealing at 600[$^{\circ}C$]. The capacitance characteristics had a stable value within $\pm$4[%]. The drastic decrease of dielectric constant and increase of dielectric loss in SCT thin films is observed above 200[kHz]. SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequencey.cey.

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Fabrication and Structural Properties of SCT Ceramic Thin Film (SCT 세라믹 박막의 제조 및 구조적 특성)

  • 김진사;조춘남;송민종;소병문;최운식
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.1084-1087
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    • 2001
  • The (Sr$\sub$0.85/Ca$\sub$0.15/)TiO$_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/SiO$_2$/Si) using RF sputtering method. The crystallinity of SCT thin films is increased with increase of substrate temperature in the temperature range of 100[$^{\circ}C$]∼500[$^{\circ}C$]. Also, the crystallinity of SCT thin films are obtained at the substrate temperature above 400[$^{\circ}C$]. SCT thin films had (111) preferred orientation. The dielectric constant changes almost linearly in temperature ranges of-80∼+90[$^{\circ}C$]. The temperature properties of the dielectric loss have a stable value within 0.1. SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequency, and the relaxation frequency is observed above 200[kHz].

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The Dielectric Characteristics of BST Thin Film Devices (BST 박막 소자의 유전특성)

  • 홍경진;민용기;신훈규;조재철
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.660-663
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    • 2001
  • The devices of BST thin films to composite (Ba$\_$0.7/ Sr$\_$0.3/)TiO$_3$using sol-gel method were fabricated by changing of the depositing layer number on Pt/Ti/SiO$_2$/Si substrate. The thin film capacitor to be ferroelectric devices was investigated by structural and electrical properties. The thickness of BST thin films at each coating numbers 3, 4 and 5 times was 2500[${\AA}$], 3500[${\AA}$], 3800[${\AA}$]. The dielectric factor of thin film when the coating numbers were 3, 4 and 5 times was 190, 400 and 460 on frequency 1[MHz]. The dielectric loss of BST thin film was linearly increased by increasing of the specimen area.

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Electrical and Optical Characteristics of PLZT Thin Films in AFE region (AFE 영역 PLZT 박막의 전기 및 광학 특성)

  • 류완균;최형욱;장낙원;강종윤;백동수;박창엽
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1995.11a
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    • pp.1.1-4
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    • 1995
  • In this study, PLZT thin films in AFE region prepared by sol-gel processing were investigated. And PLZT stock solutions were spin-coated on ITO-glass. The PLZT thin films were annealed by RTA. Hysteresis curves, dielectric characteristics and optical transmittances were measured in order to investigates the characteristics far the thin films. The PLZT thin films were crystallized at 750$^{\circ}C$ for 5 mimutes by RTA and the rosette structure composed of perovskite observed in the thin films. In case La content was 2/90/10 antiferroelectric-ferroelectric phase boundary was 2/90/10 PLZT thin film, and its hysteresis curve was good for application of optical information storage.

Bottom Gate Microcrystalline Silicon TFT Fabricated on Plasma Treated Silicon Nitride

  • Huang, Jung-Jie;Chen, Yung-Pei;Lin, Hung-Chien;Yao, Hsiao-Chiang;Lee, Cheng-Chung
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.218-221
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    • 2008
  • Bottom-gate microcrystalline silicon thin film transistors (${\mu}c$-Si:H TFTs) were fabricated on glass and transparent polyimide substrates by conventional 13.56 MHz RF plasma enhanced chemical vapor deposition at $200^{\circ}C$. The deposition rate of the ${\mu}c$-Si:H film is 24 nm/min and the amorphous incubation layer near the ${\mu}c$-Si:H/silicon nitride interface is unobvious. The threshold voltage of ${\mu}c$-Si:H TFTs can be improved by $H_2$ or $NH_3$ plasma pretreatment silicon nitride film.

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