• Title/Summary/Keyword: thermomechanical properties

Search Result 173, Processing Time 0.017 seconds

Thermomechanical Characteristics of Poly(vinyl alcohol)/Chitosan Films and Its Blend Hydrogels (폴리(비닐 알코올)/키토산 블렌드와 블렌드 수화젤의 열특성)

  • Park Jun Seo;Park Jang Woo;Kim Byung Ho
    • Polymer(Korea)
    • /
    • v.29 no.2
    • /
    • pp.183-189
    • /
    • 2005
  • Films of poly(vinyl alcohol)(PVA)/chitosan blends and its blend hydrogels were prepared by the solution casting method. The state of miscibility of the blends and blend hydrogels were examined over the entire composition range by differential scanning carorimetry (DSC), thermogravimetry (TGA), and dynamic mechanical analysis (DMA). DSC analysis shows the depression of melting point of PVA in the blends and the decrease of crystallization temperature of PVA in the blends were observed with increasing chitosan content in the blends. TGA analysis indicates that chitosan was thermally more stable than PVA and the thermal stability of PVA in the blends was higher than that of pure PVA, due to some interactions between two component polymers in the blend. The glass transition temperature $(T_g)$ of the chitosan and of PVA, measured by DMA, were at 160 and $90^{\circ}C$, respectively. The $T_g$ of the blends was changed with the content of chitosan in the blends. The results of thermal and viscoelastic analysis indicate some miscibility between component polymers in the blend exists. Moisture and cross linking in the blend and blend hydrogel, which strongly change thermal and physical properties of hydrophilic polymers, affected the miscibility of chitosan and PVA to a small extent.

Effect of Die Attach Film Composition for 1 Step Cure Characteristics and Thermomechanical Properties (다이접착필름의 조성물이 1단계 경화특성과 열기계적 물성에 미치는 영향에 관한 연구)

  • Sung, Choonghyun
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.21 no.12
    • /
    • pp.261-267
    • /
    • 2020
  • The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

Numerical Analysis of Pile Foundation Considering the Thawing and Freezing Effects (융해-동결작용을 고려한 말뚝 기초에 관한 수치해석 연구)

  • Park, Woo-Jin ;Park, Dong-Su;Shin, Mun-Beom;Seo, Young-Kyo
    • Journal of the Korean Geotechnical Society
    • /
    • v.39 no.5
    • /
    • pp.51-63
    • /
    • 2023
  • Numerical analysis was conducted to determine the effect of soil behavior by thawing and freezing of seasonal frozen soil on pile foundations. The analysis was performed using the finite element method (FEM) to simulate soil-pile interaction based on the atmosphere temperature change. Thermomechanical coupled modeling using FEM was applied with the temperature-dependent nonlinear properties of the frozen soil. The analysis model cases were applied to the MCR and HDP models to simulate the elastoplastic behavior of soil. The numerical analysis results were analyzed and compared with various conditions having different length and width sizes of the pile. The results of the numerical analysis showed t hat t he HDP model was relat ively passive, and t he aspect and magnit ude of t he bearing capacit y and displacement of the pile head were similar depending on the length and width of the pile conditions. The vertical displacement of the pile head by thawing and freezing of the ground showed a large variation in displacement for shorter length conditions. In the MCR model, the vertical displacement appeared in the maximum thaw settlement and frost heaving of 0.0387 and 0.0277 m, respectively. In the HDP model, the vertical displacement appeared in the maximum thaw settlement and frost heaving of 0.0367 and 0.0264 m, respectively. The results of the pile bearing capacity for the two elastoplastic models showed a larger difference in the width condition than the length condition of the pile, with a maximum of about 14.7% for the width L condition, a maximum of about 5.4% for M condition, and a maximum of about 5.3% for S condition. The significance of the effect on the displacement of the pile head and the bearing capacity depended on the pile-soil contact area, and the difference depended on the presence or absence of an active layer in the soil and its thickness.