Thermo-mechanical Analysis of Filp Chip PBGA Package Using $Moir\acute{e}$ Interferometry
(모아레 간섭계를 이용한 Flip Chip PBGA 패키지의 온도변화에 대한 거동해석)
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- Proceedings of the KSME Conference
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- 2003.11a
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- pp.1027-1032
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- 2003