• Tribology and Lubricants
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• v.30 no.3
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• pp.177-182
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• 2014

To stop a high speed train running at the speed of 300 km/h, the disc brake for the train should be able to dissipate enormous kinetic energy of the train into frictional heat energy. Sintered pin-type metals are mostly used for friction materials of high speed brake pads. A pad comprises several friction pins, and the topology, length, flexibility, composition, etc. have a great influence on the tribological properties of the disc brake. In this study, the topology of the friction pins in a pad was our main concern. We presented the optimization of the topology of a railcar brake pad with nine-pin-type friction materials by thermo-mechanical contact analysis. We modeled the brake pad with/without a back plate. To simulate a continuous braking, the pad or friction materials were rotated at constant velocity on the friction surface of the disc. We varied the positions of the nine friction materials to compare the temperature distributions on the disc surface. In a non-optimized brake pad, the distance between two neighboring friction materials in the radial direction from the rotational center of the disc was not equal. In an optimized pad, the distance between two neighboring friction materials in the radial direction was equal. The temperature distribution on the disc surface fluctuated more for the former than the latter. Optimizing the pad reduced the maximum temperature of the brake disc by more than 10%.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.04a
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• pp.193-197
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• 2003

As one of the core technologies in the field of the optical communication with WDM, the optical cross connector with movements of micro mirrors is getting important day by day. The packaging structure of 2-dimensional NxN MOEMS switch should be determined by the harmonization of the following items such as the geometrical compatability between optical and structural components, the characteristics of optical input and output parts with device, and the electrical performance for the operation of micro mirrors. Therefore, the packaging process could be defined as the integrated technology completed by the optical and electrical science and the material science for the understanding of its thermo-mechanical properties with packaging materials. In the present study, the harmonization between the optical and structural components as well as the optical characteristics of lens system used will be investigated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.63-68
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• 2008

We investigated the recycling method to re-plasticize cross-linked polyethylene by using supercritical methanol. The cross-linked polyethylene is successfully fragmented to thermoplasticized polyethylene with little degradation reactions in supercritical fluids. The thermo-plasticization reaction was accelerated with increase in temperature in the range from $360^{\circ}C$ to $400^{\circ}C$, resulting in decrease in crosslinking density, molecular weight and mechanical properties. However, the thermoplasticized polyethylene at $360^{\circ}C$ showed comparable tensile strength and impact strength with a raw resin of crosslinked polyethylene. Chemical structure of main chain of polyethylene was not affected by reaction condition.

• Journal of Korean Society of Steel Construction
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• v.23 no.4
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• pp.483-491
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• 2011

The fabrication of steel structural members always involves welding process such as flux cored arc welding. Therefore, for the application of structural steels to cold regions, it is a prerequisite to clarify the service temperature of the welded joints in order to ensure the structural integrity of the welded parts. In this study, the Charpy impact test was conducted to evaluate the service temperature of structural steel weld. The Charpy impact test is a commercial quality control test for steels and other alloys used in the construction of metallic structures. The test allows the material properties for service conditions to be determined experimentally in a simple manner with a very low cost. Standard V-notch Charpy specimens were prepared and tested under dynamic loading condition. The service temperatures of the weld metal, HAZ (heat affected zone) and base metal were derived by the absorbed energy and the impact test requirements; thus the applicability of the structural steels to cold regions was discussed in detail.

• Composites Research
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• v.22 no.2
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• pp.37-42
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• 2009

This paper presents an experimental approach to design a bending-type actuator by using a shape memory alloy wire (SMA), composite strip, and spring. The SMA wire is attached to two edges of the bent strip to apply pre-stress to the SMA wire. The spring is used to provide recovery force right after actuation of the SMA wire. To investigate thermo-mechanical characteristics of the SMA wire, a series of DSC tests have been conducted and tensile tests under various levels of pre-stress and input power have been performed. Based on the measured properties of the SMA wire, bending-type actuators are designed and tested for different combination of strip, number of springs, and input power. It has been found that a bending-type actuator with a proper combination shows fast actuation performance and low power consumption.

• Asian Pacific Journal of Cancer Prevention
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• v.15 no.1
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• pp.49-54
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• 2014

Background: Hydrogels are a class of polymers that can absorb water or biological fluids and swell to several times their dry volume, dependent on changes in the external environment. In recent years, hydrogels and hydrogel nanocomposites have found a variety of biomedical applications, including drug delivery and cancer treatment. The incorporation of nanoparticulates into a hydrogel matrix can result in unique material characteristics such as enhanced mechanical properties, swelling response, and capability of remote controlled actuation. Materials and Methods: In this work, synthesis of hydrogel nanocomposites containing magnetic nanoparticles are studied. At first, magnetic nanoparticles ($Fe_3O_4$) with an average size 10 nm were prepared. At second approach, thermo and pH-sensitive poly (N-isopropylacrylamide -co-methacrylic acid-co-vinyl pyrrolidone) (NIPAAm-MAA-VP) were prepared. Swelling behavior of co-polymer was studied in buffer solutions with different pH values (pH=5.8, pH=7.4) at $37^{\circ}C$. Magnetic iron oxide nanoparticles ($Fe_3O_4$) and doxorubicin were incorporated into copolymer and drug loading was studied. The release of drug, carried out at different pH and temperatures. Finally, chemical composition, magnetic properties and morphology of doxorubicin-loaded magnetic hydrogel nanocomposites were analyzed by FT- IR, vibrating sample magnetometry (VSM), scanning electron microscopy (SEM). Results: The results indicated that drug loading efficiency was increased by increasing the drug ratio to polymer. Doxorubicin was released more at $40^{\circ}C$ and in acidic pH compared to that $37^{\circ}C$ and basic pH. Conclusions: This study suggested that the poly (NIPAAm-MAA-VP) magnetic hydrogel nanocomposite could be an effective carrier for targeting drug delivery systems of anti-cancer drugs due to its temperature sensitive properties.

• Elastomers and Composites
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• v.40 no.3
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• pp.166-173
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• 2005

Effect of thermal aging on the weight loss and water absorption of epoxy adhesives was investigated in the presence of three types of different hardeners, such as D-230, G-5022, and HN-2200. Thermal and mechanical properties of the cured epoxy resins were also studied througth the glass transition temperature and shear adhesion strength measurements. Weight losses of DGEBA/D-230 and DGEBA/HN- 2200 systems were not varied. However, the weight of DGEBA/G-5022 system was significantly decreased with increasing the thermal aging time. The water absorption of the specimens was increased as the thermal aging time increased except that using G-5022. DEGBA/HN-2200 system showed higher $T_g$ value than those of other systems, due to the formation of the fine three-dimensional network structure containing aliphatic ring. Shear adhesion strength of all systems was increased with increasing the thermal aging tine, which is attributed to increased degree of cure and fine three-dimensional network structure formation. And $T_g$ values and shear adhesion strength of all specimens exposed to water was decreased as the immersion time increased.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.5
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• pp.27-34
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• 2018

Recently, liquid desiccant systems have received attention for the dehumidification of air. LiCl and LiBr are widely used in liquid desiccant systems due to their excellent thermo-physical properties. In this study, dehumidification tests were conducted with Celdek elements using LiCl and LiBr. During the tests, the dry and wet-bulb air temperatures were maintained at $35^{\circ}C$ and $28^{\circ}C$, respectively. The solution temperature was $20^{\circ}C$, the solution concentration was 50%, the solution circulation rate was 50 kg/h, and the frontal air velocity was varied from 2.0 to 4.0 m/s. The results show that the amount of dehumidification increased as the frontal velocity increased. On average, LiCl showed 27% higher dehumidification performance than LiBr, which was probably due to the lower saturation of the absolute humidity of LiCl compared with that of LiBr. On the other hand, LiBr yielded 12% larger pressure drop than LiCl. In general, the Sherwood numbers of LiCl and LiBr were approximately the same, showing that the effect of the desiccant on the Sherwood number was insignificant. Existing correlations highly overpredicted the present Sherwood numbers.