• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.362-362
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• 2014

Atomic layer deposition (ALD) can be regarded as a special variation of the chemical vapor deposition method for reducing film thickness. ALD is based on sequential self-limiting reactions from the gas phase to produce thin films and over-layers in the nanometer scale with perfect conformality and process controllability. These characteristics make ALD an important film deposition technique for nanoelectronics. Tantalum pentoxide ($Ta_2O_5$) has a number of applications in optics and electronics due to its superior properties, such as thermal and chemical stability, high refractive index (>2.0), low absorption in near-UV to IR regions, and high-k. In particular, the dielectric constant of amorphous $Ta_2O_5$ is typically close to 25. Accordingly, $Ta_2O_5$ has been extensively studied in various electronics such as metal oxide semiconductor field-effect transistors (FET), organic FET, dynamic random access memories (RAM), resistance RAM, etc. In this experiment, the variations of chemical and interfacial state during the growth of $Ta_2O_5$ films on the Si substrate by ALD was investigated using in-situ synchrotron radiation photoemission spectroscopy. A newly synthesized liquid precursor $Ta(N^tBu)(dmamp)_2$ Me was used as the metal precursor, with Ar as a purging gas and $H_2O$ as the oxidant source. The core-level spectra of Si 2p, Ta 4f, and O 1s revealed that Ta suboxide and Si dioxide were formed at the initial stages of $Ta_2O_5$ growth. However, the Ta suboxide states almost disappeared as the ALD cycles progressed. Consequently, the $Ta^{5+}$ state, which corresponds with the stoichiometric $Ta_2O_5$, only appeared after 4.0 cycles. Additionally, tantalum silicide was not detected at the interfacial states between $Ta_2O_5$ and Si. The measured valence band offset value between $Ta_2O_5$ and the Si substrate was 3.08 eV after 2.5 cycles.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.434-435
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• 2012

Plasma enhanced chemical vapor deposition (PECVD) silicon dioxide thin films have many applications in semiconductor manufacturing such as inter-level dielectric and gate dielectric metal oxide semiconductor field effect transistors (MOSFETs). Fundamental chemical reaction for the formation of SiO2 includes SiH4 and O2, but mixture of SiH4 and N2O is preferable because of lower hydrogen concentration in the deposited film [1]. It is also known that binding energy of N-N is higher than that of N-O, so the particle generation by molecular reaction can be reduced by reducing reactive nitrogen during the deposition process. However, nitrous oxide (N2O) gives rise to nitric oxide (NO) on reaction with oxygen atoms, which in turn reacts with ozone. NO became a greenhouse gas which is naturally occurred regulating of stratospheric ozone. In fact, it takes global warming effect about 300 times higher than carbon dioxide (CO2). Industries regard that N2O is inevitable for their device fabrication; however, it is worthwhile to develop a marginable nitrous oxide free process for university lab classes considering educational and environmental purpose. In this paper, we developed environmental friendly and material cost efficient SiO2 deposition process by substituting N2O with O2 targeting university hands-on laboratory course. Experiment was performed by two level statistical design of experiment (DOE) with three process parameters including RF power, susceptor temperature, and oxygen gas flow. Responses of interests to optimize the process were deposition rate, film uniformity, surface roughness, and electrical dielectric property. We observed some power like particle formation on wafer in some experiment, and we postulate that the thermal and electrical energy to dissociate gas molecule was relatively lower than other runs. However, we were able to find a marginable process region with less than 3% uniformity requirement in our process optimization goal. Surface roughness measured by atomic force microscopy (AFM) presented some evidence of the agglomeration of silane related particles, and the result was still satisfactory for the purpose of this research. This newly developed SiO2 deposition process is currently under verification with repeated experimental run on 4 inches wafer, and it will be adopted to Semiconductor Material and Process course offered in the Department of Electronic Engineering at Myongji University from spring semester in 2012.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.122-122
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• 1999

Graphite with its advantages of high thermal conductivity, low thermal expansion coefficient, and low elasticity, has been widely used as a structural material for high temperature. However, graphite can easily react with oxygen at even low temperature as 40$0^{\circ}C$, resulting in CO2 formation. In order to apply the graphite to high temperature structural material, therefore, it is necessary to improve its oxidation resistive property. Silicon Carbide (SiC) is a semiconductor material for high-temperature, radiation-resistant, and high power/high frequency electronic devices due to its excellent properties. Conventional chemical vapor deposited SiC films has also been widely used as a coating materials for structural applications because of its outstanding properties such as high thermal conductivity, high microhardness, good chemical resistant for oxidation. Therefore, SiC with similar thermal expansion coefficient as graphite is recently considered to be a g행 candidate material for protective coating operating at high temperature, corrosive, and high-wear environments. Due to large lattice mismatch (~50%), however, it was very difficult to grow thick SiC layer on graphite surface. In theis study, we have deposited thick SiC thin films on graphite substrates at temperature range of 700-85$0^{\circ}C$ using single molecular precursors by both thermal MOCVD and PEMOCVD methods for oxidation protection wear and tribological coating . Two organosilicon compounds such as diethylmethylsilane (EDMS), (Et)2SiH(CH3), and hexamethyldisilane (HMDS),(CH3)Si-Si(CH3)3, were utilized as single source precursors, and hydrogen and Ar were used as a bubbler and carrier gas. Polycrystalline cubic SiC protective layers in [110] direction were successfully grown on graphite substrates at temperature as low as 80$0^{\circ}C$ from HMDS by PEMOCVD. In the case of thermal MOCVD, on the other hand, only amorphous SiC layers were obtained with either HMDS or DMS at 85$0^{\circ}C$. We compared the difference of crystal quality and physical properties of the PEMOCVD was highly effective process in improving the characteristics of the a SiC protective layers grown by thermal MOCVD and PEMOCVD method and confirmed that PEMOCVD was highly effective process in improving the characteristics of the SiC layer properties compared to those grown by thermal MOCVD. The as-grown samples were characterized in situ with OES and RGA and ex situ with XRD, XPS, and SEM. The mechanical and oxidation-resistant properties have been checked. The optimum SiC film was obtained at 85$0^{\circ}C$ and RF power of 200W. The maximum deposition rate and microhardness are 2$mu extrm{m}$/h and 4,336kg/mm2 Hv, respectively. The hardness was strongly influenced with the stoichiometry of SiC protective layers.

• 한국재료학회지
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• 제14권8호
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• pp.542-546
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• 2004

We report a new fabrication process for high performance triode type CNT field emitters and their superior electrical properties. The CNT-based triode-type field emitter structure was fabricated by the conventional semiconductor processes. The keys of the fabrication process are spin-on-glass coating and trim-and-leveling of the carbon nanotubes grown in trench structures by employing a chemical mechanical polishing process. They lead to strong adhesion and a uniform distance from the carbon nanotube tips to the electrode. The measured emission property of the arrays showed a remarkably uniform and high current density. The gate leakage current could be remarkably reduced by coating of thin $SiO_{2}$ insulating layer over the gate metal. The field enhancement factor(${\beta}$) and emission area(${\alpha}$) were calculated from the F-N plot. This process can be applicable to fabrication of high power CNT vacuum transistors with good electrical performance.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.399-399
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• 2012

최근 그래핀 연구와 더불어 2차원 구조의 나노소재에 대한 관심이 급증하면서 육각형의 질화붕소(hexagonal boron nitride; h-BN) 나노시트(nanosheet)[1]나 붕소 탄화질화물(boron caronitride;BCN) 나노시트[2, 3]와 같은 2차원 구조체에 대한 연구가 활발히 진행되고 있다. 그 중 BCN은 반금속(semimetal)인 흑연(graphite)과 절연체인 h-BN이 결합된 나노시트로 원소의 구성 비율에 따라 전기적 특성을 제어할 수 있다는 장점이 있다. 따라서 다양한 나노소자로의 응용을 위한 연구가 활발히 진행되고 있다. 본 연구에서는 열 화학기상증착법(thermal chemical vapor deposition)을 이용하여 폴리스틸렌(polystyrene)과 보레인 암모니아(borane ammonia)를 사용하여 BCN 나노시트를 합성하였다. 합성된 BCN 나노시트의 구조적 특징과 화학적 조성 및 결합 상태를 주사전자현미경(scanning electron microscopy), 투과전자현미경(transmission electron microscopy), X-선 광전자 분광법(X-ray photoelectron spectroscopy), 라만 분광법(Raman spectroscopy)을 통해 조사하였고, 이온성 용액법 (ionic liquid)[4]을 이용하여 전계효과 특성을 측정하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.403-403
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• 2012

그래핀(graphene)은 우수한 전기적, 물리적인 특성을 지닌 물질로써 다양한 분야에서 이를 활용하려는 노력들이 활발히 진행되고 있다. 그중 그래핀을 채널로 이용하는 전계효과 트랜지스터(field effect transistor)로의 응용에 있어, 가장 핵심적인 도전과제는 전하농도(carrier concentration)의 제어 및 에너지 밴드갭(energy bandgap) 형성이라 할수 있다. 최근 다양한 물질을 이용한 도핑을 통해 이를 해결하기 위한 노력들이 진행되고 있는 추세이다. 본 연구에서는 열화학 기상 증착법(Thermal chemical vapor deposition)을 통해 합성된 단일층의 그래핀에 염화니켈 나노입자의 분산액을 스핀코팅 한후 열처리를 통해 그래핀-니켈 나노입자의 하이브리드 구조를 제작하였다. 제작된 그래핀-니켈 나노입자 하이브리드 물질의 구조적 특징을 주사 전자 현미경(Scanning electron microscope)과 원자힘 현미경(Atomic force microscopy)을 통하여 확인하였다. 또한 니켈 분산액의 농도와 도핑효과 와의 상관관계를 라만분광법(Raman spectroscopy)과 이온성 용액법(Ionic liquid)을 이용한 전계효과 특성분석을 통해 조사하였다. 나노입자의 형성 메커니즘은 X-선 광전자 분광법(X-ray photoelectron spectroscopy)을 통하여 규명하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.418-418
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• 2012

Synthesis of nanocrystalline diamond powder was investigated via a gas-to-particle scheme using the hot filament chemical vapor deposition. Effect of substrate surface seeding by nano diamond powder, and that of the electrical conductance of the substrate were studied. The substrate temperature, methane content in the precursor gas, filament-substrate distance and filament temperature were $670^{\circ}C$, 5% methane in hydrogen, 10 mm and $2400^{\circ}C$, respectively. The powder formation by gas-to-particle mechanism were greatly enhanced by the substrate seeding by the nano diamond powder. It was attributed to the removal of the electrostatic force between the substrate and the seeded nano diamond particle by the thermal electron shower from the hot filament, via the depolarization of the substrate surface or the attached diamond powder and subsequent levitation into the gas phase to serve as the gas-phase nucleation site. The powder formation was greatly favoured by the conducting substrate relative to the insulating substrate, which proved the actual effect of the electric static force in the powder formation.

• Bulletin of the Korean Chemical Society
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• 제33권10호
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• pp.3383-3386
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• 2012

SnS thin films were deposited on glasses through metal organic chemical vapor deposition (MOCVD) method at relatively mild conditions, using bis(3-mercapto-1-propanethiolato) tin(II) precursor without toxic $H_2S$ gas. The MOCVD process was carried out in the temperature range of $300-400^{\circ}C$ and the average grain size in fabricated SnS films was about 500 nm. The optical band gap of the SnS film was about 1.3 eV which is in optimal range for harvesting solar radiation energy. The precursor and SnS films were characterized through infrared spectroscopy, nuclear magnetic resonance spectroscopy, DIP-EI mass spectroscopy, elemental analyses, thermal analysis, X-ray diffraction, and field emission scanning electron microscopic analyses.

• 전자공학회논문지
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• 제52권5호
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• pp.197-205
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• 2015

함정용 전자광학추적장비 열영상센서부 전면창의 신뢰성 및 성능 개선을 위해 플라즈마 화학기상증착법을 통해 제작되는 DLC 박막을 제안하였다. DLC 박막은 현재 사용되고 있는 실리콘 박막과 비교하여 뛰어난 강도와 낮은 마찰, 화학적 안정성이 우수하며 이로 인해 해상 환경에서 필연적으로 발생하는 열영상센서 전면창의 표면 박리를 최소화할 수 있는 장점이 있다. 본 실험을 통해, DLC 박막이 갖는 물리적 특성을 바탕으로 다양한 전자광학장비에 적용이 가능함을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.337.1-337.1
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• 2016

단일벽 탄소나노튜브(Single-walled carbon nanotubes, SWNTs)는 나노 스케일의 크기와 우수한 물성을 갖고 있어, 전자, 에너지, 바이오 등 다양한 분야로의 응용이 기대되고 있다. 이러한 응용의 실현을 위해서는 경제적, 산업적인 면에서 보다 손쉬운 합성법이 요구된다. SWNTs의 합성에는 대면적의 균일한 CNTs를 합성할 수 있다는 장점이 있는 열화학기상증착법(Thermal chemical vapor deposition, TCVD)이 가장 일반적으로 사용되고 있다. 하지만 탄화수소가스를 효율적으로 분해하기 위하여 $900^{\circ}C$ 이상의 고온공정이 요구되며, 이는 경제적, 산업적인 면에서 사용이 제한적이다. 따라서 저결함, 고수율의 SWNTs를 저온합성 할 수 있는 공정의 개발이 지속적으로 필요하다. 본 연구에서는, TCVD법을 이용하여 에틸렌 원료가스로 SWNTs의 저온합성 가능성을 확인하였다. 합성을 위한 기판과 촉매로는 실리콘 산화막 기판(SiO2/Si wafer)에 철 나노입자를 지닌 ferritin을 스핀코팅 후 산화하여 이용하였다. 저온합성 공정의 변수로는 합성온도와 원료가스인 에틸렌의 분율을 설정하여, 변수가 SWNTs의 결정성과 수율에 미치는 영향을 고찰하였다. 합성된 SWNTs의 분석의 용이함과 손지기(Chirality)의 제어 가능성을 확인하기 위하여 나노 다공성 물질인 제올라이트(Zeolite)를 보조 기판으로 사용하였다. 실험결과 에틸렌 원료가스로 합성한 SWNTs는 메탄을 원료가스로 사용한 경우보다 낮은 $700^{\circ}C$ 부근에서도 합성이 가능함을 확인하였다. 또한 에틸렌의 분율과 합성 시간의 정밀한 제어를 통해 SWNTs의 합성온도를 더욱 감소시키는 것도 가능할 것으로 예상된다.